SE8302619D0 - Forfarande och anordning for framstellning av kopplingsplattor - Google Patents
Forfarande och anordning for framstellning av kopplingsplattorInfo
- Publication number
- SE8302619D0 SE8302619D0 SE8302619A SE8302619A SE8302619D0 SE 8302619 D0 SE8302619 D0 SE 8302619D0 SE 8302619 A SE8302619 A SE 8302619A SE 8302619 A SE8302619 A SE 8302619A SE 8302619 D0 SE8302619 D0 SE 8302619D0
- Authority
- SE
- Sweden
- Prior art keywords
- foil
- metal
- screen
- screen printing
- hole
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 239000011888 foil Substances 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 238000007650 screen-printing Methods 0.000 abstract 3
- 230000000873 masking effect Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Plates And Materials Therefor (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3217983A DE3217983C2 (de) | 1982-05-13 | 1982-05-13 | Verfahren zum Herstellen einer Abdeckmaske |
Publications (2)
Publication Number | Publication Date |
---|---|
SE8302619D0 true SE8302619D0 (sv) | 1983-05-06 |
SE8302619L SE8302619L (sv) | 1983-11-14 |
Family
ID=6163461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8302619A SE8302619L (sv) | 1982-05-13 | 1983-05-06 | Forfarande och anordning for framstellning av kopplingsplattor |
Country Status (9)
Country | Link |
---|---|
JP (1) | JPS58206192A (sv) |
CA (1) | CA1196731A (sv) |
CH (1) | CH659753A5 (sv) |
DE (1) | DE3217983C2 (sv) |
DK (1) | DK210983A (sv) |
GB (1) | GB2120017B (sv) |
IT (1) | IT1197651B (sv) |
NL (1) | NL8301586A (sv) |
SE (1) | SE8302619L (sv) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3514093A1 (de) * | 1985-04-16 | 1986-10-23 | Kaspar 5241 Gebhardshain Eidenberg | Verfahren zum verschliessen von in einer leiterplatte vorgesehenen bohrungen |
US4884337A (en) * | 1986-11-26 | 1989-12-05 | Epicor Technology, Inc. | Method for temporarily sealing holes in printed circuit boards utilizing a thermodeformable material |
US4748742A (en) * | 1986-11-26 | 1988-06-07 | Multitek Corporation | Method for temporarily sealing holes in printed circuit boards |
US6276055B1 (en) | 1998-09-02 | 2001-08-21 | Hadco Santa Clara, Inc. | Method and apparatus for forming plugs in vias of a circuit board layer |
US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
KR20030007753A (ko) | 2000-05-31 | 2003-01-23 | 허니웰 인터내셔날 인코포레이티드 | 채움 방법 |
KR20030007755A (ko) | 2000-05-31 | 2003-01-23 | 허니웰 인터내셔날 인코포레이티드 | 채움 장치 |
CN110557889A (zh) * | 2018-05-30 | 2019-12-10 | 胜宏科技(惠州)股份有限公司 | 一种铝片网版塞孔的制作方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1249966B (de) * | 1967-09-14 | Ruwel-Werke, Spezialfabrik für Hochfrequenzbauteile, Inh. Ing. Fritz Stahl, Geldern (RhId.) | Verfahren zum Herstellen von metallisierten Wandungen von Bohrungen in gedruckten Leiterplatten | |
GB1042234A (en) * | 1965-03-05 | 1966-09-14 | Mullard Ltd | Multilayer printed circuits |
GB1194853A (en) * | 1967-02-16 | 1970-06-17 | Btr Industries Ltd | A Method of Forming Printed Circuits |
JPS52118261A (en) * | 1976-03-30 | 1977-10-04 | Matsushita Electric Ind Co Ltd | Method of producing through hole printed circuit board |
JPS5658797A (en) * | 1979-10-18 | 1981-05-21 | Yashima Denki Kk | Ac power control circuit in induction motor |
JPS5667985A (en) * | 1979-11-08 | 1981-06-08 | Matsushita Electric Ind Co Ltd | Method of printing ink using metal mask |
-
1982
- 1982-05-13 DE DE3217983A patent/DE3217983C2/de not_active Expired
-
1983
- 1983-05-03 GB GB08312009A patent/GB2120017B/en not_active Expired
- 1983-05-04 NL NL8301586A patent/NL8301586A/nl not_active Application Discontinuation
- 1983-05-06 SE SE8302619A patent/SE8302619L/sv not_active Application Discontinuation
- 1983-05-10 CH CH2557/83A patent/CH659753A5/de not_active IP Right Cessation
- 1983-05-10 JP JP58083445A patent/JPS58206192A/ja active Pending
- 1983-05-11 DK DK210983A patent/DK210983A/da not_active Application Discontinuation
- 1983-05-13 IT IT48288/83A patent/IT1197651B/it active
- 1983-05-13 CA CA000428115A patent/CA1196731A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL8301586A (nl) | 1983-12-01 |
GB8312009D0 (en) | 1983-06-08 |
DE3217983A1 (de) | 1983-11-17 |
SE8302619L (sv) | 1983-11-14 |
DK210983D0 (da) | 1983-05-11 |
GB2120017B (en) | 1986-02-19 |
JPS58206192A (ja) | 1983-12-01 |
DK210983A (da) | 1983-11-14 |
IT8348288A0 (it) | 1983-05-13 |
DE3217983C2 (de) | 1984-03-29 |
CH659753A5 (de) | 1987-02-13 |
CA1196731A (en) | 1985-11-12 |
IT1197651B (it) | 1988-12-06 |
GB2120017A (en) | 1983-11-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |
Ref document number: 8302619-5 Effective date: 19851206 Format of ref document f/p: F |