SE8005980L - Metod och anordning for montering av elektriska komponenter pa tryckta kretskort - Google Patents
Metod och anordning for montering av elektriska komponenter pa tryckta kretskortInfo
- Publication number
- SE8005980L SE8005980L SE8005980A SE8005980A SE8005980L SE 8005980 L SE8005980 L SE 8005980L SE 8005980 A SE8005980 A SE 8005980A SE 8005980 A SE8005980 A SE 8005980A SE 8005980 L SE8005980 L SE 8005980L
- Authority
- SE
- Sweden
- Prior art keywords
- installation
- electrical components
- printed circuits
- printed circuit
- chips
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000009434 installation Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
- H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Automatic Assembly (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2935081A DE2935081C2 (de) | 1979-08-30 | 1979-08-30 | Vorrichtung zur Bestückung von Leiterplatten. |
Publications (1)
Publication Number | Publication Date |
---|---|
SE8005980L true SE8005980L (sv) | 1981-03-01 |
Family
ID=6079652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8005980A SE8005980L (sv) | 1979-08-30 | 1980-08-27 | Metod och anordning for montering av elektriska komponenter pa tryckta kretskort |
Country Status (12)
Country | Link |
---|---|
US (1) | US4375126A (sv) |
JP (1) | JPS5636197A (sv) |
BE (1) | BE885022A (sv) |
CA (1) | CA1157959A (sv) |
DE (1) | DE2935081C2 (sv) |
FR (1) | FR2464616A1 (sv) |
GB (1) | GB2056956B (sv) |
HK (1) | HK21384A (sv) |
IT (1) | IT1193964B (sv) |
NL (1) | NL8004834A (sv) |
SE (1) | SE8005980L (sv) |
SG (1) | SG52783G (sv) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2474270A1 (fr) * | 1980-01-21 | 1981-07-24 | Radiotechnique Compelec | Procede et dispositif d'assemblage simultane de composants sur un support |
DE3040357A1 (de) * | 1980-10-25 | 1982-05-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren und vorrichtung zum bestuecken von platinen mit chipartigen bauelementen |
NL8006058A (nl) * | 1980-11-06 | 1982-06-01 | Philips Nv | Inrichting voor het opschuiven van in magazijnen opgenomen onderdelen. |
NL8006194A (nl) * | 1980-11-13 | 1982-06-01 | Philips Nv | Inrichting voor het gelijktijdig plaatsen van meerdere elektrische en/of elektronische onderdelen op een gedrukte bedradingspaneel. |
NL8103573A (nl) * | 1981-07-29 | 1983-02-16 | Philips Nv | Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie. |
NL8201653A (nl) * | 1982-04-21 | 1983-11-16 | Philips Nv | Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat. |
US4528747A (en) * | 1982-12-02 | 1985-07-16 | At&T Technologies, Inc. | Method and apparatus for mounting multilead components on a circuit board |
SE454643B (sv) * | 1983-06-13 | 1988-05-16 | Sincotron Aps | Sett och anordning for att pa ett kretskort montera elektroniska komponenter |
GB2147888B (en) * | 1983-10-14 | 1986-12-31 | Dage Precima International Lim | Component stack feed device |
NL8303797A (nl) * | 1983-11-04 | 1985-06-03 | Philips Nv | Inrichting voor het aanbrengen van een bevestigingsmiddel op electronische onderdelen, in het bijzonder op chipvormige onderdelen. |
NL8304185A (nl) * | 1983-12-06 | 1985-07-01 | Philips Nv | Stempel en inrichting voor het aanbrengen van druppels van een viskeuze vloeistof op een substraat. |
US4626167A (en) * | 1984-03-22 | 1986-12-02 | Thomson Components-Mostek Corporation | Manipulation and handling of integrated circuit dice |
US4548667A (en) * | 1984-03-28 | 1985-10-22 | Wical Robert M | Planned coordinate component placement system |
EP0171466A1 (de) * | 1984-07-24 | 1986-02-19 | Siemens Aktiengesellschaft | Verfahren zum Übertragen von Klebstoff auf einen Chipträger und Vorrichtung zur Durchfürung des Verfahrens |
US4573254A (en) * | 1984-12-24 | 1986-03-04 | Sperry Corporation | Apparatus for maintaining electronic component pin alignment |
US4670981A (en) * | 1986-03-17 | 1987-06-09 | Nitto Kogyo Kabushiki Kaisha | Method of mounting electronic parts on the predetermined positions of a printed circuit board |
US4817273A (en) * | 1987-04-30 | 1989-04-04 | Reliability Incorporated | Burn-in board loader and unloader |
US4868974A (en) * | 1987-09-01 | 1989-09-26 | Sumitomo Electric Industries, Ltd. | Chip mounting apparatus |
KR920002278B1 (ko) * | 1988-02-15 | 1992-03-20 | 다이요유덴 가부시끼가이샤 | 리드선이 없는 회로부품의 장착장치 |
JPH01295500A (ja) * | 1988-05-24 | 1989-11-29 | Taiyo Yuden Co Ltd | チップ状電子部品マウント方法及びその装置 |
DE69009259T2 (de) * | 1989-02-02 | 1994-10-13 | Matsushita Electric Ind Co Ltd | Verfahren zum Zusammensetzen von Halbleiteranordnungen. |
US4941255A (en) * | 1989-11-15 | 1990-07-17 | Eastman Kodak Company | Method for precision multichip assembly |
US5217550A (en) * | 1990-09-28 | 1993-06-08 | Dai Nippon Printing Co., Ltd | Alignment transfer method |
US5117555A (en) * | 1991-01-17 | 1992-06-02 | International Business Machines Corporation | Modular system and method for populating circuit boards |
US5240139A (en) * | 1992-03-06 | 1993-08-31 | Munroe Chirnomas | Package vending machine |
DE69330468T2 (de) * | 1993-08-27 | 2002-04-18 | Munroe Chirnomas | Verkaufsautomat für warenpackungen |
US5957326A (en) * | 1995-03-13 | 1999-09-28 | Ostgaard; John T. | Apparatus for retrieving randomly organized articles |
FR2734197B1 (fr) * | 1995-05-18 | 1997-09-26 | Nicomatic | Procede et appareil de fabrication d'articles contenant des pieces plates, et clavier forme par leur mise en oeuvre |
US6019564A (en) * | 1995-10-27 | 2000-02-01 | Advantest Corporation | Semiconductor device transporting and handling apparatus |
US5909839A (en) * | 1997-05-15 | 1999-06-08 | Ford Motor Company | Method for dispensing solder paste on a non-planar substrate using an array of ultrasonically agitated pins |
US6505665B1 (en) | 1998-09-17 | 2003-01-14 | Intermedics, Inc. | Method and apparatus for use in assembling electronic devices |
JP3643018B2 (ja) * | 1999-07-22 | 2005-04-27 | アイシン化工株式会社 | クラッチ用摩擦板の製造方法及び製造装置 |
KR100712088B1 (ko) * | 2002-05-27 | 2007-05-02 | 한라공조주식회사 | 클러치 풀리의 마찰재 접착장치 및 방법 |
US6929149B2 (en) * | 2002-06-20 | 2005-08-16 | Royal Vendors, Inc. | Frozen product vending machine |
JP3833997B2 (ja) * | 2002-12-17 | 2006-10-18 | オリオン電機株式会社 | プリント回路板の製造方法 |
US6981312B2 (en) * | 2003-03-31 | 2006-01-03 | Intel Corporation | System for handling microelectronic dies having a non-piercing die ejector |
US8424717B2 (en) * | 2004-12-23 | 2013-04-23 | Snaptron, Inc. | Efficient delivery and placement systems for switch contacts |
US8701276B2 (en) * | 2008-08-19 | 2014-04-22 | Zamtec Ltd | Placement head for a die placing assembly |
US20100047962A1 (en) * | 2008-08-19 | 2010-02-25 | Silverbrook Research Pty Ltd | Multi-chip printhead assembler |
US7979979B2 (en) * | 2008-08-19 | 2011-07-19 | Silverbrook Research Pty Ltd | Clamp assembly for an assembler of integrated circuitry on a carrier |
US20100047053A1 (en) * | 2008-08-19 | 2010-02-25 | Silverbrook Research Pty Ltd | Die picker for picking printhead die from a wafer |
US20100043214A1 (en) * | 2008-08-19 | 2010-02-25 | Silverbrook Research Pty Ltd | Integrated circuit dice pick and lift head |
US8296937B2 (en) * | 2008-08-19 | 2012-10-30 | Silverbrook Research Pty Ltd | Wafer positioning system |
US8092625B2 (en) * | 2008-08-19 | 2012-01-10 | Silverbrook Research Pty Ltd | Integrated circuit placement system |
US8297472B2 (en) * | 2010-11-24 | 2012-10-30 | Texas Instruments Incorporated | Pellet loader with pellet separator for molding IC devices |
US10271437B2 (en) * | 2014-08-14 | 2019-04-23 | The United States Of America As Represented By The Secretary Of The Army | Motion-based reconfigurable microelectronics system |
CN104959824A (zh) * | 2015-06-30 | 2015-10-07 | 苏州昌飞自动化设备厂 | 阀芯自动组装机的四组式上料装置 |
DE112020007833T5 (de) * | 2020-12-11 | 2023-09-21 | Fuji Corporation | Saugdüse und Bauteilmontierer |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1064127B (de) * | 1956-02-04 | 1959-08-27 | Blaupunkt Werke Gmbh | Verfahren zur Bestueckung von sogenannten gedruckten Schaltungen mit Schaltungselementen |
US3479716A (en) * | 1966-12-05 | 1969-11-25 | Kulicke & Soffa Ind Inc | Automatic dice dispenser for semiconductor bonding |
DE1614960A1 (de) * | 1967-02-25 | 1971-01-14 | Elektromat Veb | Verfahren und Vorrichtung zur Entnahme von geordnet oder ungeordnet uebereinanderliegenden kleinen flaechenhaften Koerpern |
US3982979A (en) * | 1973-06-28 | 1976-09-28 | Western Electric Company, Inc. | Methods for mounting an article on an adherent site on a substrate |
JPS5537879B2 (sv) * | 1973-10-15 | 1980-09-30 | ||
US3859723A (en) * | 1973-11-05 | 1975-01-14 | Microsystems Int Ltd | Bonding method for multiple chip arrays |
JPS52124168A (en) * | 1976-04-12 | 1977-10-18 | Matsushita Electric Ind Co Ltd | Method of assembling electronic device circuit |
DE2716330B2 (de) * | 1976-04-12 | 1981-07-30 | Matsushita Electric Industrial Co., Ltd., 1006 Kadoma, Osaka | Verfahren zur Bestückung von Schaltungsplatinen mit plättchenförmigen Schaltungsbauteilen und Vorrichtung zur Durchführung des Verfahrens |
US4116348A (en) * | 1976-07-19 | 1978-09-26 | Deval Industries, Inc. | Component locating apparatus |
US4215799A (en) * | 1977-07-22 | 1980-08-05 | Oxoid Limited | Disc dispenser |
US4292116A (en) * | 1978-04-18 | 1981-09-29 | Tokyo Denki Kagaku Kogyo Kabushiki Kaisha | Apparatus for mounting chip type circuit elements on a printed circuit board |
DE2823360C3 (de) * | 1978-05-29 | 1981-06-25 | Texas Instruments Deutschland Gmbh, 8050 Freising | Vorrichtung zur Überführung von Gegenständen |
-
1979
- 1979-08-30 DE DE2935081A patent/DE2935081C2/de not_active Expired
-
1980
- 1980-08-25 CA CA000358909A patent/CA1157959A/en not_active Expired
- 1980-08-27 IT IT24318/80A patent/IT1193964B/it active
- 1980-08-27 SE SE8005980A patent/SE8005980L/sv not_active Application Discontinuation
- 1980-08-27 NL NL8004834A patent/NL8004834A/nl not_active Application Discontinuation
- 1980-08-27 GB GB8027709A patent/GB2056956B/en not_active Expired
- 1980-08-27 US US06/181,607 patent/US4375126A/en not_active Expired - Lifetime
- 1980-08-29 FR FR8018782A patent/FR2464616A1/fr active Granted
- 1980-08-29 JP JP11963680A patent/JPS5636197A/ja active Pending
- 1980-09-01 BE BE0/201943A patent/BE885022A/fr not_active IP Right Cessation
-
1983
- 1983-08-22 SG SG52783A patent/SG52783G/en unknown
-
1984
- 1984-03-08 HK HK213/84A patent/HK21384A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
FR2464616B1 (sv) | 1982-07-16 |
IT1193964B (it) | 1988-08-31 |
DE2935081C2 (de) | 1985-12-19 |
CA1157959A (en) | 1983-11-29 |
US4375126A (en) | 1983-03-01 |
BE885022A (fr) | 1981-03-02 |
DE2935081A1 (de) | 1981-03-12 |
NL8004834A (nl) | 1981-03-03 |
SG52783G (en) | 1985-01-11 |
GB2056956B (en) | 1983-06-08 |
JPS5636197A (en) | 1981-04-09 |
GB2056956A (en) | 1981-03-25 |
IT8024318A0 (it) | 1980-08-27 |
HK21384A (en) | 1984-03-16 |
FR2464616A1 (fr) | 1981-03-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |
Ref document number: 8005980-1 |