SE7801698L - Halvledaranordning - Google Patents

Halvledaranordning

Info

Publication number
SE7801698L
SE7801698L SE7801698A SE7801698A SE7801698L SE 7801698 L SE7801698 L SE 7801698L SE 7801698 A SE7801698 A SE 7801698A SE 7801698 A SE7801698 A SE 7801698A SE 7801698 L SE7801698 L SE 7801698L
Authority
SE
Sweden
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
SE7801698A
Other languages
English (en)
Inventor
N Bardahl
A Beer
H W Hermann
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE7801698L publication Critical patent/SE7801698L/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Power Conversion In General (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
SE7801698A 1977-03-17 1978-02-14 Halvledaranordning SE7801698L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2711711A DE2711711C3 (de) 1977-03-17 1977-03-17 Halbleiteranordnung mit einem scheibenförmigen, zwischen Kühlkörpern eingespanntem Halbleiterbauelement

Publications (1)

Publication Number Publication Date
SE7801698L true SE7801698L (sv) 1978-09-18

Family

ID=6003911

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7801698A SE7801698L (sv) 1977-03-17 1978-02-14 Halvledaranordning

Country Status (4)

Country Link
JP (1) JPS53115180A (sv)
DE (1) DE2711711C3 (sv)
FR (1) FR2384354A1 (sv)
SE (1) SE7801698L (sv)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3024001C2 (de) * 1980-06-24 1986-09-04 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Luftgekühlte Halbleiteranordnung mit scheibenförmigen, zwischen Kühlkörpern eingespannten Halbleiterbauelementen
DE3130896C2 (de) * 1981-07-31 1986-08-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Anordnung zur Kühlung von Halbleitern über Kühlkörper
DE3327992A1 (de) * 1983-08-03 1985-02-21 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitervorrichtung
WO1985003385A1 (fr) * 1984-01-23 1985-08-01 La Telemecanique Electrique Dispositif de montage et de connexion pour semi-conducteurs de puissance
FR2558644B1 (fr) * 1984-01-23 1986-09-19 Telemecanique Electrique Bloc de montage pour semi-conducteur de puissance

Also Published As

Publication number Publication date
FR2384354B1 (sv) 1980-06-13
DE2711711B2 (de) 1979-03-08
DE2711711C3 (de) 1979-11-22
JPS53115180A (en) 1978-10-07
DE2711711A1 (de) 1978-09-21
FR2384354A1 (fr) 1978-10-13

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