SE7500085L - - Google Patents

Info

Publication number: SE7500085L
Authority: SE; Sweden

Application number

SE7500085A

Inventor

C T Plough

H K Eastwood

M Arts

Original Assignee

Multi State Devices Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1974-01-07

Filing date

1975-01-03

Publication date

1975-07-08

1975-01-03 Application filed by Multi State Devices Ltd filed Critical Multi State Devices Ltd

1975-07-08 Publication of SE7500085L publication Critical patent/SE7500085L/xx

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/042—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of inorganic non-metallic substances
- H01C7/043—Oxides or oxidic compounds
- H01C7/047—Vanadium oxides or oxidic compounds, e.g. VOx
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Electromagnetism (AREA)
Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Control Of Resistance Heating (AREA)
Measuring Temperature Or Quantity Of Heat (AREA)
Investigating Or Analyzing Materials Using Thermal Means (AREA)
Thermally Actuated Switches (AREA)
Thermistors And Varistors (AREA)

SE7500085A 1974-01-07 1975-01-03 SE7500085L (xx)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US431428A US3872418A (en)	1974-01-07	1974-01-07	Electrical relay device

Publications (1)

Publication Number	Publication Date
SE7500085L true SE7500085L (xx)	1975-07-08

Family

ID=23711900

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SE7500085A SE7500085L (xx)	1974-01-07	1975-01-03

Country Status (10)

Country	Link
US (1)	US3872418A (xx)
JP (1)	JPS50116945A (xx)
AU (1)	AU7596574A (xx)
BE (1)	BE824173A (xx)
CA (1)	CA997480A (xx)
DE (1)	DE2459906A1 (xx)
FR (1)	FR2257152B3 (xx)
GB (1)	GB1469008A (xx)
NL (1)	NL7415921A (xx)
SE (1)	SE7500085L (xx)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4237474A (en) *	1978-10-18	1980-12-02	Rca Corporation	Electroluminescent diode and optical fiber assembly
US4450496A (en) *	1979-08-16	1984-05-22	Raychem Corporation	Protection of certain electrical systems by use of PTC device
US4739382A (en) *	1985-05-31	1988-04-19	Tektronix, Inc.	Package for a charge-coupled device with temperature dependent cooling
DE3671581D1 (de) *	1985-07-09	1990-06-28	Siemens Ag	Mosfet mit temperaturschutz.
US4757528A (en) *	1986-09-05	1988-07-12	Harris Corporation	Thermally coupled information transmission across electrical isolation boundaries
US5008736A (en) *	1989-11-20	1991-04-16	Motorola, Inc.	Thermal protection method for a power device
US5374123A (en) *	1992-05-20	1994-12-20	Goldstar Co., Ltd.	Thermal comfort sensing device
US6300859B1 (en) *	1999-08-24	2001-10-09	Tyco Electronics Corporation	Circuit protection devices
US9632630B2 (en) *	2011-11-17	2017-04-25	Tera Xtal Technology Corp.	Touch panel structure
CN109642830B (zh) *	2016-09-01	2022-04-08	松下知识产权经营株式会社	功能性元件以及温度传感器
CN113506849B (zh) *	2018-12-14	2022-07-08	新唐科技日本株式会社	半导体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3503030A (en) *	1966-11-11	1970-03-24	Fujitsu Ltd	Indirectly-heated thermistor
US3621446A (en) *	1969-02-17	1971-11-16	Bell Telephone Labor Inc	Thermal relay
US3614345A (en) *	1969-11-17	1971-10-19	Zyrotron Ind Inc	Thermal sensing device

1974
- 1974-01-07 US US431428A patent/US3872418A/en not_active Expired - Lifetime
- 1974-12-02 AU AU75965/74A patent/AU7596574A/en not_active Expired
- 1974-12-06 NL NL7415921A patent/NL7415921A/xx not_active Application Discontinuation
- 1974-12-13 CA CA215,958A patent/CA997480A/en not_active Expired
- 1974-12-18 DE DE19742459906 patent/DE2459906A1/de active Pending
- 1974-12-20 JP JP49146652A patent/JPS50116945A/ja active Pending
- 1974-12-23 GB GB5557774A patent/GB1469008A/en not_active Expired
1975
- 1975-01-03 FR FR7500151A patent/FR2257152B3/fr not_active Expired
- 1975-01-03 SE SE7500085A patent/SE7500085L/xx unknown
- 1975-01-07 BE BE152205A patent/BE824173A/xx unknown

Also Published As

Publication number	Publication date
GB1469008A (en)	1977-03-30
US3872418A (en)	1975-03-18
DE2459906A1 (de)	1975-07-17
NL7415921A (nl)	1975-07-09
BE824173A (fr)	1975-05-02
FR2257152B3 (xx)	1977-09-30
FR2257152A1 (xx)	1975-08-01
CA997480A (en)	1976-09-21
JPS50116945A (xx)	1975-09-12
AU7596574A (en)	1976-06-03

Publication	Publication Date	Title
JPS50116945A (xx)	1975-09-12
AU495920B2 (xx)	1976-06-03
AU480879A (xx)	1975-07-31
AU482284A (xx)	1975-08-21
BE836983A (xx)	1976-06-22
BG19621A1 (xx)	1975-10-10
BG19680A1 (xx)	1975-10-10
BG20091A3 (xx)	1977-05-20
BG20191A1 (xx)	1975-11-05
BG20213A1 (xx)	1975-11-05
BG20229A1 (xx)	1975-11-05
BG20437A1 (xx)	1975-12-05
BG20495A1 (xx)	1975-12-05
BG20910A1 (xx)	1976-01-20
BG20912A1 (xx)	1976-01-20
BG20931A1 (xx)	1976-01-20
BG21119A1 (xx)	1976-03-20
BG21133A1 (xx)	1976-03-20
BG21264A1 (xx)	1976-05-20
BG21284A1 (xx)	1976-05-20
BG21341A1 (xx)	1976-05-20
BG21358A1 (xx)	1976-05-20
BG22330A1 (xx)	1977-02-20
BG22336A1 (xx)	1977-02-20
BG22809A3 (xx)	1977-04-20