NL7415921A - Elektrische relais-inrichting. - Google Patents
Elektrische relais-inrichting.Info
- Publication number
- NL7415921A NL7415921A NL7415921A NL7415921A NL7415921A NL 7415921 A NL7415921 A NL 7415921A NL 7415921 A NL7415921 A NL 7415921A NL 7415921 A NL7415921 A NL 7415921A NL 7415921 A NL7415921 A NL 7415921A
- Authority
- NL
- Netherlands
- Prior art keywords
- relay device
- electrical relay
- electrical
- relay
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/042—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of inorganic non-metallic substances
- H01C7/043—Oxides or oxidic compounds
- H01C7/047—Vanadium oxides or oxidic compounds, e.g. VOx
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Thermistors And Varistors (AREA)
- Thermally Actuated Switches (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Control Of Resistance Heating (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US431428A US3872418A (en) | 1974-01-07 | 1974-01-07 | Electrical relay device |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7415921A true NL7415921A (nl) | 1975-07-09 |
Family
ID=23711900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7415921A NL7415921A (nl) | 1974-01-07 | 1974-12-06 | Elektrische relais-inrichting. |
Country Status (10)
Country | Link |
---|---|
US (1) | US3872418A (nl) |
JP (1) | JPS50116945A (nl) |
AU (1) | AU7596574A (nl) |
BE (1) | BE824173A (nl) |
CA (1) | CA997480A (nl) |
DE (1) | DE2459906A1 (nl) |
FR (1) | FR2257152B3 (nl) |
GB (1) | GB1469008A (nl) |
NL (1) | NL7415921A (nl) |
SE (1) | SE7500085L (nl) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4237474A (en) * | 1978-10-18 | 1980-12-02 | Rca Corporation | Electroluminescent diode and optical fiber assembly |
US4450496A (en) * | 1979-08-16 | 1984-05-22 | Raychem Corporation | Protection of certain electrical systems by use of PTC device |
US4739382A (en) * | 1985-05-31 | 1988-04-19 | Tektronix, Inc. | Package for a charge-coupled device with temperature dependent cooling |
EP0208970B1 (de) * | 1985-07-09 | 1990-05-23 | Siemens Aktiengesellschaft | MOSFET mit Temperaturschutz |
US4757528A (en) * | 1986-09-05 | 1988-07-12 | Harris Corporation | Thermally coupled information transmission across electrical isolation boundaries |
US5008736A (en) * | 1989-11-20 | 1991-04-16 | Motorola, Inc. | Thermal protection method for a power device |
US5374123A (en) * | 1992-05-20 | 1994-12-20 | Goldstar Co., Ltd. | Thermal comfort sensing device |
US6300859B1 (en) * | 1999-08-24 | 2001-10-09 | Tyco Electronics Corporation | Circuit protection devices |
US9632630B2 (en) * | 2011-11-17 | 2017-04-25 | Tera Xtal Technology Corp. | Touch panel structure |
US11332381B2 (en) * | 2016-09-01 | 2022-05-17 | Panasonic Intellectual Property Management Co., Ltd. | Functional element and temperature sensor of crystal grain trititanium pentoxide |
CN112368850B (zh) * | 2018-12-14 | 2021-06-22 | 新唐科技日本株式会社 | 半导体装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3503030A (en) * | 1966-11-11 | 1970-03-24 | Fujitsu Ltd | Indirectly-heated thermistor |
US3621446A (en) * | 1969-02-17 | 1971-11-16 | Bell Telephone Labor Inc | Thermal relay |
US3614345A (en) * | 1969-11-17 | 1971-10-19 | Zyrotron Ind Inc | Thermal sensing device |
-
1974
- 1974-01-07 US US431428A patent/US3872418A/en not_active Expired - Lifetime
- 1974-12-02 AU AU75965/74A patent/AU7596574A/en not_active Expired
- 1974-12-06 NL NL7415921A patent/NL7415921A/nl not_active Application Discontinuation
- 1974-12-13 CA CA215,958A patent/CA997480A/en not_active Expired
- 1974-12-18 DE DE19742459906 patent/DE2459906A1/de active Pending
- 1974-12-20 JP JP49146652A patent/JPS50116945A/ja active Pending
- 1974-12-23 GB GB5557774A patent/GB1469008A/en not_active Expired
-
1975
- 1975-01-03 SE SE7500085A patent/SE7500085L/xx unknown
- 1975-01-03 FR FR7500151A patent/FR2257152B3/fr not_active Expired
- 1975-01-07 BE BE152205A patent/BE824173A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
DE2459906A1 (de) | 1975-07-17 |
FR2257152B3 (nl) | 1977-09-30 |
US3872418A (en) | 1975-03-18 |
JPS50116945A (nl) | 1975-09-12 |
CA997480A (en) | 1976-09-21 |
FR2257152A1 (nl) | 1975-08-01 |
GB1469008A (en) | 1977-03-30 |
AU7596574A (en) | 1976-06-03 |
BE824173A (fr) | 1975-05-02 |
SE7500085L (nl) | 1975-07-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BV | The patent application has lapsed |