SE363426B - - Google Patents

Info

Publication number
SE363426B
SE363426B SE01720/70A SE172070A SE363426B SE 363426 B SE363426 B SE 363426B SE 01720/70 A SE01720/70 A SE 01720/70A SE 172070 A SE172070 A SE 172070A SE 363426 B SE363426 B SE 363426B
Authority
SE
Sweden
Application number
SE01720/70A
Inventor
W Schierz
L Vladik
Original Assignee
Semikron Gleichrichterbau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau
Publication of SE363426B publication Critical patent/SE363426B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Rectifiers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Synchronous Machinery (AREA)
SE01720/70A 1969-02-13 1970-02-11 SE363426B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1907075A DE1907075B2 (de) 1969-02-13 1969-02-13 Verfahren zur Herstellung von Halbleiter-Kleingleichrichtern

Publications (1)

Publication Number Publication Date
SE363426B true SE363426B (xx) 1974-01-14

Family

ID=5725060

Family Applications (1)

Application Number Title Priority Date Filing Date
SE01720/70A SE363426B (xx) 1969-02-13 1970-02-11

Country Status (8)

Country Link
US (1) US3708730A (xx)
BR (1) BR6915308D0 (xx)
CH (1) CH520402A (xx)
DE (1) DE1907075B2 (xx)
ES (1) ES375664A1 (xx)
FR (1) FR2031079A5 (xx)
GB (1) GB1298766A (xx)
SE (1) SE363426B (xx)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4247864A (en) * 1978-03-06 1981-01-27 Amp Incorporated Light emitting diode assembly
US4478588A (en) * 1978-03-06 1984-10-23 Amp Incorporated Light emitting diode assembly
JPS57133655A (en) * 1981-02-10 1982-08-18 Pioneer Electronic Corp Lead frame
FR2538164B1 (fr) * 1982-12-21 1985-06-07 Thomson Csf Procede d'encapsulation et circuit integre sous boitier encapsule par ce procede
US4722060A (en) * 1984-03-22 1988-01-26 Thomson Components-Mostek Corporation Integrated-circuit leadframe adapted for a simultaneous bonding operation
JPH06105721B2 (ja) * 1985-03-25 1994-12-21 日立超エル・エス・アイエンジニアリング株式会社 半導体装置
JP2875334B2 (ja) * 1990-04-06 1999-03-31 株式会社日立製作所 半導体装置
TW276357B (xx) * 1993-03-22 1996-05-21 Motorola Inc
US5714792A (en) * 1994-09-30 1998-02-03 Motorola, Inc. Semiconductor device having a reduced die support area and method for making the same
US5907769A (en) 1996-12-30 1999-05-25 Micron Technology, Inc. Leads under chip in conventional IC package
US6121674A (en) 1998-02-23 2000-09-19 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
US6977214B2 (en) * 1998-12-11 2005-12-20 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
SG112799A1 (en) 2000-10-09 2005-07-28 St Assembly Test Services Ltd Leaded semiconductor packages and method of trimming and singulating such packages
US6686258B2 (en) 2000-11-02 2004-02-03 St Assembly Test Services Ltd. Method of trimming and singulating leaded semiconductor packages
JP6850938B1 (ja) * 2019-04-10 2021-03-31 新電元工業株式会社 半導体装置、及びリードフレーム材

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514822A1 (de) * 1964-08-14 1969-06-26 Telefunken Patent Verfahren zur Herstellung einer Halbleiteranordnung
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
GB1196452A (en) * 1967-01-19 1970-06-24 Lucas Industries Ltd Semiconductor Circuits
US3500136A (en) * 1968-01-24 1970-03-10 Int Rectifier Corp Contact structure for small area contact devices

Also Published As

Publication number Publication date
CH520402A (de) 1972-03-15
DE1907075B2 (de) 1974-07-04
BR6915308D0 (pt) 1973-01-02
GB1298766A (en) 1972-12-06
ES375664A1 (es) 1972-05-16
FR2031079A5 (xx) 1970-11-13
US3708730A (en) 1973-01-02
DE1907075A1 (de) 1971-02-11

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