FR2031079A5 - - Google Patents

Info

Publication number
FR2031079A5
FR2031079A5 FR7000340A FR7000340A FR2031079A5 FR 2031079 A5 FR2031079 A5 FR 2031079A5 FR 7000340 A FR7000340 A FR 7000340A FR 7000340 A FR7000340 A FR 7000340A FR 2031079 A5 FR2031079 A5 FR 2031079A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7000340A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG
Application granted granted Critical
Publication of FR2031079A5 publication Critical patent/FR2031079A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Rectifiers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Synchronous Machinery (AREA)
FR7000340A 1969-02-13 1970-01-07 Expired FR2031079A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1907075A DE1907075B2 (de) 1969-02-13 1969-02-13 Verfahren zur Herstellung von Halbleiter-Kleingleichrichtern

Publications (1)

Publication Number Publication Date
FR2031079A5 true FR2031079A5 (fr) 1970-11-13

Family

ID=5725060

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7000340A Expired FR2031079A5 (fr) 1969-02-13 1970-01-07

Country Status (8)

Country Link
US (1) US3708730A (fr)
BR (1) BR6915308D0 (fr)
CH (1) CH520402A (fr)
DE (1) DE1907075B2 (fr)
ES (1) ES375664A1 (fr)
FR (1) FR2031079A5 (fr)
GB (1) GB1298766A (fr)
SE (1) SE363426B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2538164A1 (fr) * 1982-12-21 1984-06-22 Thomson Csf Procede d'encapsulation et circuit integre sous boitier encapsule par ce procede

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4247864A (en) * 1978-03-06 1981-01-27 Amp Incorporated Light emitting diode assembly
US4478588A (en) * 1978-03-06 1984-10-23 Amp Incorporated Light emitting diode assembly
JPS57133655A (en) * 1981-02-10 1982-08-18 Pioneer Electronic Corp Lead frame
US4722060A (en) * 1984-03-22 1988-01-26 Thomson Components-Mostek Corporation Integrated-circuit leadframe adapted for a simultaneous bonding operation
JPH06105721B2 (ja) * 1985-03-25 1994-12-21 日立超エル・エス・アイエンジニアリング株式会社 半導体装置
JP2875334B2 (ja) * 1990-04-06 1999-03-31 株式会社日立製作所 半導体装置
TW276357B (fr) * 1993-03-22 1996-05-21 Motorola Inc
US5714792A (en) * 1994-09-30 1998-02-03 Motorola, Inc. Semiconductor device having a reduced die support area and method for making the same
US5907769A (en) 1996-12-30 1999-05-25 Micron Technology, Inc. Leads under chip in conventional IC package
US6121674A (en) 1998-02-23 2000-09-19 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
US6977214B2 (en) * 1998-12-11 2005-12-20 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
SG112799A1 (en) 2000-10-09 2005-07-28 St Assembly Test Services Ltd Leaded semiconductor packages and method of trimming and singulating such packages
US6686258B2 (en) 2000-11-02 2004-02-03 St Assembly Test Services Ltd. Method of trimming and singulating leaded semiconductor packages
JP6850938B1 (ja) * 2019-04-10 2021-03-31 新電元工業株式会社 半導体装置、及びリードフレーム材

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514822A1 (de) * 1964-08-14 1969-06-26 Telefunken Patent Verfahren zur Herstellung einer Halbleiteranordnung
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
GB1196452A (en) * 1967-01-19 1970-06-24 Lucas Industries Ltd Semiconductor Circuits
US3500136A (en) * 1968-01-24 1970-03-10 Int Rectifier Corp Contact structure for small area contact devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2538164A1 (fr) * 1982-12-21 1984-06-22 Thomson Csf Procede d'encapsulation et circuit integre sous boitier encapsule par ce procede

Also Published As

Publication number Publication date
CH520402A (de) 1972-03-15
SE363426B (fr) 1974-01-14
DE1907075B2 (de) 1974-07-04
BR6915308D0 (pt) 1973-01-02
GB1298766A (en) 1972-12-06
ES375664A1 (es) 1972-05-16
US3708730A (en) 1973-01-02
DE1907075A1 (de) 1971-02-11

Similar Documents

Publication Publication Date Title
AU2270770A (fr)
FR2031079A5 (fr)
AU429630B2 (fr)
AU2355770A (fr)
AU442375B2 (fr)
AU427401B2 (fr)
AU428129B2 (fr)
AU428131B2 (fr)
AT308690B (fr)
AU428074B2 (fr)
AU438128B2 (fr)
AU425297B2 (fr)
AU442357B2 (fr)
AU417208B2 (fr)
AU414607B2 (fr)
AU410358B2 (fr)
AU442380B2 (fr)
AU442285B2 (fr)
AU5079269A (fr)
AR203167Q (fr)
CS149298B1 (fr)
CH1738169A4 (fr)
BG18171A3 (fr)
CH575392A5 (fr)
CH628470A4 (fr)

Legal Events

Date Code Title Description
ST Notification of lapse