SE354742B - - Google Patents
Info
- Publication number
- SE354742B SE354742B SE05012/69A SE501269A SE354742B SE 354742 B SE354742 B SE 354742B SE 05012/69 A SE05012/69 A SE 05012/69A SE 501269 A SE501269 A SE 501269A SE 354742 B SE354742 B SE 354742B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US71996668A | 1968-04-09 | 1968-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE354742B true SE354742B (de) | 1973-03-19 |
Family
ID=24892121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE05012/69A SE354742B (de) | 1968-04-09 | 1969-04-09 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3581163A (de) |
| DE (2) | DE1916399A1 (de) |
| FR (1) | FR2005892A1 (de) |
| GB (1) | GB1258309A (de) |
| SE (1) | SE354742B (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE350874B (de) * | 1970-03-05 | 1972-11-06 | Asea Ab | |
| US3800192A (en) * | 1970-08-11 | 1974-03-26 | O Schaerli | Semiconductor circuit element with pressure contact means |
| DE2556749A1 (de) * | 1975-12-17 | 1977-06-23 | Bbc Brown Boveri & Cie | Leistungshalbleiterbauelement in scheibenzellenbauweise |
| US4274106A (en) * | 1977-11-07 | 1981-06-16 | Mitsubishi Denki Kabushiki Kaisha | Explosion proof vibration resistant flat package semiconductor device |
| US4402004A (en) * | 1978-01-07 | 1983-08-30 | Tokyo Shibaura Denki Kabushiki Kaisha | High current press pack semiconductor device having a mesa structure |
| JPS5929143B2 (ja) * | 1978-01-07 | 1984-07-18 | 株式会社東芝 | 電力用半導体装置 |
| US4327370A (en) * | 1979-06-28 | 1982-04-27 | Rca Corporation | Resilient contact ring for providing a low impedance connection to the base region of a semiconductor device |
| WO2005112111A1 (ja) * | 2004-05-14 | 2005-11-24 | Mitsubishi Denki Kabushiki Kaisha | 加圧接触式整流装置 |
| CN101641785B (zh) * | 2006-11-09 | 2011-07-13 | 怡得乐Qlp公司 | 具有延展层的微电路封装体 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL204333A (de) * | 1954-01-14 | 1900-01-01 | ||
| US3268309A (en) * | 1964-03-30 | 1966-08-23 | Gen Electric | Semiconductor contact means |
| US3293508A (en) * | 1964-04-21 | 1966-12-20 | Int Rectifier Corp | Compression connected semiconductor device |
| SE312860B (de) * | 1964-09-28 | 1969-07-28 | Asea Ab | |
| GB1140677A (en) * | 1965-05-07 | 1969-01-22 | Ass Elect Ind | Improvements relating to semi-conductor devices |
| US3457472A (en) * | 1966-10-10 | 1969-07-22 | Gen Electric | Semiconductor devices adapted for pressure mounting |
-
1968
- 1968-04-09 US US719966A patent/US3581163A/en not_active Expired - Lifetime
-
1969
- 1969-03-27 GB GB1258309D patent/GB1258309A/en not_active Expired
- 1969-03-31 DE DE19691916399 patent/DE1916399A1/de active Pending
- 1969-03-31 DE DE6912949U patent/DE6912949U/de not_active Expired
- 1969-04-09 FR FR6910962A patent/FR2005892A1/fr not_active Withdrawn
- 1969-04-09 SE SE05012/69A patent/SE354742B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3581163A (en) | 1971-05-25 |
| DE1916399A1 (de) | 1969-10-23 |
| DE6912949U (de) | 1972-09-14 |
| GB1258309A (de) | 1971-12-30 |
| FR2005892A1 (de) | 1969-12-19 |