SE0302467L - A method and a device for manufacturing of electrical components - Google Patents
A method and a device for manufacturing of electrical componentsInfo
- Publication number
- SE0302467L SE0302467L SE0302467A SE0302467A SE0302467L SE 0302467 L SE0302467 L SE 0302467L SE 0302467 A SE0302467 A SE 0302467A SE 0302467 A SE0302467 A SE 0302467A SE 0302467 L SE0302467 L SE 0302467L
- Authority
- SE
- Sweden
- Prior art keywords
- manufacturing
- electrical components
- electrical
- components
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/44—Compression means for making articles of indefinite length
- B29C43/46—Rollers
- B29C2043/461—Rollers the rollers having specific surface features
- B29C2043/463—Rollers the rollers having specific surface features corrugated, patterned or embossed surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
- Y10T156/1085—One web only
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
- Y10T442/654—Including a free metal or alloy constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
- Y10T442/654—Including a free metal or alloy constituent
- Y10T442/656—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the nonwoven fabric]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0302467A SE526725C2 (sv) | 2003-09-17 | 2003-09-17 | Förfarande och anordning för tillverkning av elektriska komponenter |
EP20040775446 EP1665912B1 (en) | 2003-09-17 | 2004-09-16 | Methods and devices for manufacturing of electrical components and laminated structures |
CN2004800338455A CN1883240B (zh) | 2003-09-17 | 2004-09-16 | 制造电气部件和层压结构的方法和装置 |
US10/572,366 US7919027B2 (en) | 2003-09-17 | 2004-09-16 | Methods and devices for manufacturing of electrical components and laminated structures |
PCT/SE2004/001343 WO2005027599A1 (en) | 2003-09-17 | 2004-09-16 | Methods and devices for manufacturing of electrical components and laminated structures |
JP2006526857A JP4560045B2 (ja) | 2003-09-17 | 2004-09-16 | 電気部品および積層構造を製造する方法および装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0302467A SE526725C2 (sv) | 2003-09-17 | 2003-09-17 | Förfarande och anordning för tillverkning av elektriska komponenter |
Publications (3)
Publication Number | Publication Date |
---|---|
SE0302467D0 SE0302467D0 (sv) | 2003-09-17 |
SE0302467L true SE0302467L (sv) | 2005-03-18 |
SE526725C2 SE526725C2 (sv) | 2005-11-01 |
Family
ID=29212474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0302467A SE526725C2 (sv) | 2003-09-17 | 2003-09-17 | Förfarande och anordning för tillverkning av elektriska komponenter |
Country Status (6)
Country | Link |
---|---|
US (1) | US7919027B2 (sv) |
EP (1) | EP1665912B1 (sv) |
JP (1) | JP4560045B2 (sv) |
CN (1) | CN1883240B (sv) |
SE (1) | SE526725C2 (sv) |
WO (1) | WO2005027599A1 (sv) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI108986B (sv) * | 1999-07-01 | 2002-04-30 | Emfitech Oy | Förfarande för att framställa ett givarelement och ett givarelement |
GB0623108D0 (en) | 2006-11-20 | 2006-12-27 | Sericol Ltd | A printable composition |
GB0904263D0 (en) | 2009-03-12 | 2009-04-22 | Sericol Ltd | Electrolyte composition |
US8564870B2 (en) | 2009-10-05 | 2013-10-22 | Acreo Ab | Active-matrix electrochromic display device and method for producing the same |
US8810888B2 (en) | 2009-10-05 | 2014-08-19 | Acreo Swedish Ict Ab | Electrochemical device |
CN102959737A (zh) * | 2010-06-30 | 2013-03-06 | 第一太阳能有限公司 | 引线箔环的形成 |
US9709867B2 (en) | 2010-10-05 | 2017-07-18 | Rise Acreo Ab | Display device |
EP2461658A1 (en) * | 2010-12-03 | 2012-06-06 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate |
US8905748B2 (en) * | 2010-12-16 | 2014-12-09 | Northwestern University | Deformation-based micro surface texturing system |
KR101993852B1 (ko) | 2011-04-05 | 2019-09-30 | 린텍 코포레이션 | 전극 표면의 자가 배열 전해질에 기반한 전기 화학적 장치의 제조 방법 |
US9719628B2 (en) | 2012-01-06 | 2017-08-01 | Start Manufacturing, Inc. | Mounting system for label dispensing unit |
US9492995B2 (en) * | 2012-11-06 | 2016-11-15 | Lg Chem, Ltd. | Roll printing machine and method of roll printing using same |
US9748431B1 (en) * | 2013-03-15 | 2017-08-29 | Eric C. Bachman | Large scale production of photovoltaic cells and resulting power |
US10651329B1 (en) * | 2013-03-15 | 2020-05-12 | Eric C. Bachman | Large-scale production of photovoltaic cells and resulting power |
USD737374S1 (en) | 2014-05-09 | 2015-08-25 | Start Manufacturing, Inc. | Reel |
USD737900S1 (en) | 2014-05-09 | 2015-09-01 | Start Manufacturing, Inc. | Reel |
FR3048897B1 (fr) * | 2016-03-21 | 2018-03-02 | Mecanokit | Procede et installation de traitement de panneau ou plaque |
CN110088586B (zh) * | 2016-08-05 | 2021-11-05 | 斯蒂芬.A.马什 | 微压力传感器 |
DE102017000290B3 (de) | 2017-01-13 | 2018-06-14 | Mühlbauer Gmbh & Co. Kg | Vorrichtung und Verfahren zur Überwachung eines Fräsvorgangs |
DE102017001097A1 (de) * | 2017-02-07 | 2018-08-09 | Gentherm Gmbh | Elektrisch leitfähige Folie |
DE102017001424A1 (de) | 2017-02-14 | 2018-08-16 | Mühlbauer Gmbh & Co. Kg | Herstellung eines Sicherungsetiketts |
SE542007C2 (en) | 2017-10-13 | 2020-02-11 | Stora Enso Oyj | A method and an apparatus for producing a radio-frequency identification transponder |
SE541026C2 (en) | 2017-10-13 | 2019-03-12 | Stora Enso Oyj | Method and arrangement for producing a label with integrated electrically conductive pattern |
CN108566732B (zh) * | 2018-05-14 | 2020-09-01 | 龙南骏亚柔性智能科技有限公司 | 一种柔性pcb电子器件褶皱制备结构 |
US10709022B1 (en) * | 2019-04-19 | 2020-07-07 | Gentherm Incorporated | Milling of flex foil with two conductive layers from both sides |
US10991929B2 (en) | 2019-08-05 | 2021-04-27 | Gentherm Inc. | Strain relief for flex foil |
US10667394B1 (en) | 2019-09-24 | 2020-05-26 | Gentherm Inc. | Double-sided, single conductor laminated substrate |
US11134575B2 (en) | 2019-09-30 | 2021-09-28 | Gentherm Gmbh | Dual conductor laminated substrate |
BE1027652B1 (de) * | 2019-10-09 | 2021-05-11 | Phoenix Contact Gmbh & Co | Technik zur Kennzeichnung eines prolaten Objekts |
US11552344B2 (en) | 2020-02-28 | 2023-01-10 | Gentherm Gmbh | Flex foil substrate connector for sensing battery voltage and temperature |
US11297718B2 (en) | 2020-06-30 | 2022-04-05 | Gentherm Gmbh | Methods of manufacturing flex circuits with mechanically formed conductive traces |
WO2022072254A2 (en) | 2020-09-30 | 2022-04-07 | Gentherm Gmbh | Interposers for splicing flexible circuits to printed circuit boards |
CN112589913A (zh) * | 2021-03-05 | 2021-04-02 | 赛柯赛斯新能源科技(苏州)有限公司 | 柔性电路板圆刀裁切工艺及其加工装置 |
SE544825C2 (en) * | 2021-04-19 | 2022-12-06 | Dp Patterning Ab | A method and device for producing a product comprising a substrate with at least one patterned layer |
WO2023056999A1 (de) * | 2021-10-07 | 2023-04-13 | Gentherm Gmbh | Elektrische leit-einrichtung und verfahren zum herstellen einer elektrischen leit-einrichtung |
SE2250719A1 (en) * | 2022-06-15 | 2023-12-16 | Dp Patterning Ab | A method and device for producing a product comprising a substrate with at least one patterned layer using a cutting fluid |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB933385A (en) | 1961-05-03 | 1963-08-08 | Gen Electric Co Ltd | Improvements in or relating to the manufacture of electrical conductors |
SE320570B (sv) | 1968-09-20 | 1970-02-09 | Aps | |
US4020548A (en) * | 1976-08-25 | 1977-05-03 | Western Electric Company, Inc. | Forming and stripping of conductors |
US4877174A (en) | 1988-12-21 | 1989-10-31 | International Business Machines Corporation | Tab device excise and lead form apparatus |
CH680483A5 (sv) * | 1989-10-20 | 1992-08-31 | Kobe Properties Ltd | |
US5528001A (en) | 1992-02-14 | 1996-06-18 | Research Organization For Circuit Knowledge | Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths |
JP3245231B2 (ja) * | 1992-08-28 | 2002-01-07 | 三菱電線工業株式会社 | フラットケーブル回路の製造方法 |
JP3027888B2 (ja) * | 1992-10-23 | 2000-04-04 | 住友電装株式会社 | ダイスタンプ用金型 |
JP3355537B2 (ja) | 1994-02-15 | 2002-12-09 | 住友電装株式会社 | フレキシブルフラットケーブルの製造方法及びフレキシブルフラットケーブル用材料の製造方法 |
US6083837A (en) * | 1996-12-13 | 2000-07-04 | Tessera, Inc. | Fabrication of components by coining |
US5945131A (en) * | 1997-04-16 | 1999-08-31 | Velcro Industries B.V. | Continuous molding of fastener products and the like and products produced thereby |
JPH11186698A (ja) * | 1997-12-18 | 1999-07-09 | Matsushita Electric Ind Co Ltd | 回路基板の製造方法および回路基板 |
EP1050201B1 (de) | 1998-01-24 | 2002-04-10 | SCHOBER GmbH Werkzeug- und Maschinenbau | Verfahren und vorrichtung zum rotativen schneiden von platinen und elektrischen leiterbahnen |
US6568285B1 (en) * | 1998-02-19 | 2003-05-27 | Stowe Woodward Llc | Nip width sensing system and method |
JP3992091B2 (ja) * | 1999-10-04 | 2007-10-17 | 松下電器産業株式会社 | パターニング方法 |
DE10000090A1 (de) * | 2000-01-04 | 2001-08-30 | Elfo Ag Sachseln Sachseln | Verfahren zum Herstellen einer mehrlagigen Planarspule |
JP2001257448A (ja) * | 2000-03-10 | 2001-09-21 | Sony Corp | プリント配線基板の製造方法及びそれにより得られたプリント配線基板 |
JP2003152310A (ja) | 2001-11-19 | 2003-05-23 | Matsushita Electric Works Ltd | プリント基板の分断方法及びプリント基板の分断機構並びにプリント基板の分断装置 |
NZ534494A (en) * | 2002-03-15 | 2006-11-30 | Procter & Gamble | Patterned elements for embossing and applying an adhesive to sheet of web material |
-
2003
- 2003-09-17 SE SE0302467A patent/SE526725C2/sv not_active IP Right Cessation
-
2004
- 2004-09-16 WO PCT/SE2004/001343 patent/WO2005027599A1/en active Application Filing
- 2004-09-16 JP JP2006526857A patent/JP4560045B2/ja active Active
- 2004-09-16 CN CN2004800338455A patent/CN1883240B/zh active Active
- 2004-09-16 EP EP20040775446 patent/EP1665912B1/en active Active
- 2004-09-16 US US10/572,366 patent/US7919027B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP1665912A1 (en) | 2006-06-07 |
US7919027B2 (en) | 2011-04-05 |
JP2007506277A (ja) | 2007-03-15 |
US20070184743A1 (en) | 2007-08-09 |
SE0302467D0 (sv) | 2003-09-17 |
SE526725C2 (sv) | 2005-11-01 |
JP4560045B2 (ja) | 2010-10-13 |
CN1883240A (zh) | 2006-12-20 |
WO2005027599A1 (en) | 2005-03-24 |
EP1665912B1 (en) | 2012-07-11 |
CN1883240B (zh) | 2012-06-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |