SE0302467L - A method and a device for manufacturing of electrical components - Google Patents

A method and a device for manufacturing of electrical components

Info

Publication number
SE0302467L
SE0302467L SE0302467A SE0302467A SE0302467L SE 0302467 L SE0302467 L SE 0302467L SE 0302467 A SE0302467 A SE 0302467A SE 0302467 A SE0302467 A SE 0302467A SE 0302467 L SE0302467 L SE 0302467L
Authority
SE
Sweden
Prior art keywords
manufacturing
electrical components
electrical
components
Prior art date
Application number
SE0302467A
Other languages
English (en)
Other versions
SE0302467D0 (sv
SE526725C2 (sv
Inventor
Staffan Nordlinder
Fredrik Andersson
Original Assignee
Acreo Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acreo Ab filed Critical Acreo Ab
Priority to SE0302467A priority Critical patent/SE526725C2/sv
Publication of SE0302467D0 publication Critical patent/SE0302467D0/sv
Priority to EP20040775446 priority patent/EP1665912B1/en
Priority to CN2004800338455A priority patent/CN1883240B/zh
Priority to US10/572,366 priority patent/US7919027B2/en
Priority to PCT/SE2004/001343 priority patent/WO2005027599A1/en
Priority to JP2006526857A priority patent/JP4560045B2/ja
Publication of SE0302467L publication Critical patent/SE0302467L/sv
Publication of SE526725C2 publication Critical patent/SE526725C2/sv

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/44—Compression means for making articles of indefinite length
    • B29C43/46—Rollers
    • B29C2043/461—Rollers the rollers having specific surface features
    • B29C2043/463—Rollers the rollers having specific surface features corrugated, patterned or embossed surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • Y10T156/1085—One web only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/654—Including a free metal or alloy constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/654—Including a free metal or alloy constituent
    • Y10T442/656—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the nonwoven fabric]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
SE0302467A 2003-09-17 2003-09-17 Förfarande och anordning för tillverkning av elektriska komponenter SE526725C2 (sv)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SE0302467A SE526725C2 (sv) 2003-09-17 2003-09-17 Förfarande och anordning för tillverkning av elektriska komponenter
EP20040775446 EP1665912B1 (en) 2003-09-17 2004-09-16 Methods and devices for manufacturing of electrical components and laminated structures
CN2004800338455A CN1883240B (zh) 2003-09-17 2004-09-16 制造电气部件和层压结构的方法和装置
US10/572,366 US7919027B2 (en) 2003-09-17 2004-09-16 Methods and devices for manufacturing of electrical components and laminated structures
PCT/SE2004/001343 WO2005027599A1 (en) 2003-09-17 2004-09-16 Methods and devices for manufacturing of electrical components and laminated structures
JP2006526857A JP4560045B2 (ja) 2003-09-17 2004-09-16 電気部品および積層構造を製造する方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0302467A SE526725C2 (sv) 2003-09-17 2003-09-17 Förfarande och anordning för tillverkning av elektriska komponenter

Publications (3)

Publication Number Publication Date
SE0302467D0 SE0302467D0 (sv) 2003-09-17
SE0302467L true SE0302467L (sv) 2005-03-18
SE526725C2 SE526725C2 (sv) 2005-11-01

Family

ID=29212474

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0302467A SE526725C2 (sv) 2003-09-17 2003-09-17 Förfarande och anordning för tillverkning av elektriska komponenter

Country Status (6)

Country Link
US (1) US7919027B2 (sv)
EP (1) EP1665912B1 (sv)
JP (1) JP4560045B2 (sv)
CN (1) CN1883240B (sv)
SE (1) SE526725C2 (sv)
WO (1) WO2005027599A1 (sv)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI108986B (sv) * 1999-07-01 2002-04-30 Emfitech Oy Förfarande för att framställa ett givarelement och ett givarelement
GB0623108D0 (en) 2006-11-20 2006-12-27 Sericol Ltd A printable composition
GB0904263D0 (en) 2009-03-12 2009-04-22 Sericol Ltd Electrolyte composition
US8564870B2 (en) 2009-10-05 2013-10-22 Acreo Ab Active-matrix electrochromic display device and method for producing the same
US8810888B2 (en) 2009-10-05 2014-08-19 Acreo Swedish Ict Ab Electrochemical device
CN102959737A (zh) * 2010-06-30 2013-03-06 第一太阳能有限公司 引线箔环的形成
US9709867B2 (en) 2010-10-05 2017-07-18 Rise Acreo Ab Display device
EP2461658A1 (en) * 2010-12-03 2012-06-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate
US8905748B2 (en) * 2010-12-16 2014-12-09 Northwestern University Deformation-based micro surface texturing system
KR101993852B1 (ko) 2011-04-05 2019-09-30 린텍 코포레이션 전극 표면의 자가 배열 전해질에 기반한 전기 화학적 장치의 제조 방법
US9719628B2 (en) 2012-01-06 2017-08-01 Start Manufacturing, Inc. Mounting system for label dispensing unit
US9492995B2 (en) * 2012-11-06 2016-11-15 Lg Chem, Ltd. Roll printing machine and method of roll printing using same
US9748431B1 (en) * 2013-03-15 2017-08-29 Eric C. Bachman Large scale production of photovoltaic cells and resulting power
US10651329B1 (en) * 2013-03-15 2020-05-12 Eric C. Bachman Large-scale production of photovoltaic cells and resulting power
USD737374S1 (en) 2014-05-09 2015-08-25 Start Manufacturing, Inc. Reel
USD737900S1 (en) 2014-05-09 2015-09-01 Start Manufacturing, Inc. Reel
FR3048897B1 (fr) * 2016-03-21 2018-03-02 Mecanokit Procede et installation de traitement de panneau ou plaque
CN110088586B (zh) * 2016-08-05 2021-11-05 斯蒂芬.A.马什 微压力传感器
DE102017000290B3 (de) 2017-01-13 2018-06-14 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zur Überwachung eines Fräsvorgangs
DE102017001097A1 (de) * 2017-02-07 2018-08-09 Gentherm Gmbh Elektrisch leitfähige Folie
DE102017001424A1 (de) 2017-02-14 2018-08-16 Mühlbauer Gmbh & Co. Kg Herstellung eines Sicherungsetiketts
SE542007C2 (en) 2017-10-13 2020-02-11 Stora Enso Oyj A method and an apparatus for producing a radio-frequency identification transponder
SE541026C2 (en) 2017-10-13 2019-03-12 Stora Enso Oyj Method and arrangement for producing a label with integrated electrically conductive pattern
CN108566732B (zh) * 2018-05-14 2020-09-01 龙南骏亚柔性智能科技有限公司 一种柔性pcb电子器件褶皱制备结构
US10709022B1 (en) * 2019-04-19 2020-07-07 Gentherm Incorporated Milling of flex foil with two conductive layers from both sides
US10991929B2 (en) 2019-08-05 2021-04-27 Gentherm Inc. Strain relief for flex foil
US10667394B1 (en) 2019-09-24 2020-05-26 Gentherm Inc. Double-sided, single conductor laminated substrate
US11134575B2 (en) 2019-09-30 2021-09-28 Gentherm Gmbh Dual conductor laminated substrate
BE1027652B1 (de) * 2019-10-09 2021-05-11 Phoenix Contact Gmbh & Co Technik zur Kennzeichnung eines prolaten Objekts
US11552344B2 (en) 2020-02-28 2023-01-10 Gentherm Gmbh Flex foil substrate connector for sensing battery voltage and temperature
US11297718B2 (en) 2020-06-30 2022-04-05 Gentherm Gmbh Methods of manufacturing flex circuits with mechanically formed conductive traces
WO2022072254A2 (en) 2020-09-30 2022-04-07 Gentherm Gmbh Interposers for splicing flexible circuits to printed circuit boards
CN112589913A (zh) * 2021-03-05 2021-04-02 赛柯赛斯新能源科技(苏州)有限公司 柔性电路板圆刀裁切工艺及其加工装置
SE544825C2 (en) * 2021-04-19 2022-12-06 Dp Patterning Ab A method and device for producing a product comprising a substrate with at least one patterned layer
WO2023056999A1 (de) * 2021-10-07 2023-04-13 Gentherm Gmbh Elektrische leit-einrichtung und verfahren zum herstellen einer elektrischen leit-einrichtung
SE2250719A1 (en) * 2022-06-15 2023-12-16 Dp Patterning Ab A method and device for producing a product comprising a substrate with at least one patterned layer using a cutting fluid

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB933385A (en) 1961-05-03 1963-08-08 Gen Electric Co Ltd Improvements in or relating to the manufacture of electrical conductors
SE320570B (sv) 1968-09-20 1970-02-09 Aps
US4020548A (en) * 1976-08-25 1977-05-03 Western Electric Company, Inc. Forming and stripping of conductors
US4877174A (en) 1988-12-21 1989-10-31 International Business Machines Corporation Tab device excise and lead form apparatus
CH680483A5 (sv) * 1989-10-20 1992-08-31 Kobe Properties Ltd
US5528001A (en) 1992-02-14 1996-06-18 Research Organization For Circuit Knowledge Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths
JP3245231B2 (ja) * 1992-08-28 2002-01-07 三菱電線工業株式会社 フラットケーブル回路の製造方法
JP3027888B2 (ja) * 1992-10-23 2000-04-04 住友電装株式会社 ダイスタンプ用金型
JP3355537B2 (ja) 1994-02-15 2002-12-09 住友電装株式会社 フレキシブルフラットケーブルの製造方法及びフレキシブルフラットケーブル用材料の製造方法
US6083837A (en) * 1996-12-13 2000-07-04 Tessera, Inc. Fabrication of components by coining
US5945131A (en) * 1997-04-16 1999-08-31 Velcro Industries B.V. Continuous molding of fastener products and the like and products produced thereby
JPH11186698A (ja) * 1997-12-18 1999-07-09 Matsushita Electric Ind Co Ltd 回路基板の製造方法および回路基板
EP1050201B1 (de) 1998-01-24 2002-04-10 SCHOBER GmbH Werkzeug- und Maschinenbau Verfahren und vorrichtung zum rotativen schneiden von platinen und elektrischen leiterbahnen
US6568285B1 (en) * 1998-02-19 2003-05-27 Stowe Woodward Llc Nip width sensing system and method
JP3992091B2 (ja) * 1999-10-04 2007-10-17 松下電器産業株式会社 パターニング方法
DE10000090A1 (de) * 2000-01-04 2001-08-30 Elfo Ag Sachseln Sachseln Verfahren zum Herstellen einer mehrlagigen Planarspule
JP2001257448A (ja) * 2000-03-10 2001-09-21 Sony Corp プリント配線基板の製造方法及びそれにより得られたプリント配線基板
JP2003152310A (ja) 2001-11-19 2003-05-23 Matsushita Electric Works Ltd プリント基板の分断方法及びプリント基板の分断機構並びにプリント基板の分断装置
NZ534494A (en) * 2002-03-15 2006-11-30 Procter & Gamble Patterned elements for embossing and applying an adhesive to sheet of web material

Also Published As

Publication number Publication date
EP1665912A1 (en) 2006-06-07
US7919027B2 (en) 2011-04-05
JP2007506277A (ja) 2007-03-15
US20070184743A1 (en) 2007-08-09
SE0302467D0 (sv) 2003-09-17
SE526725C2 (sv) 2005-11-01
JP4560045B2 (ja) 2010-10-13
CN1883240A (zh) 2006-12-20
WO2005027599A1 (en) 2005-03-24
EP1665912B1 (en) 2012-07-11
CN1883240B (zh) 2012-06-20

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