SE0200749L - Metod och krets för impedansanpassning - Google Patents

Metod och krets för impedansanpassning

Info

Publication number
SE0200749L
SE0200749L SE0200749A SE0200749A SE0200749L SE 0200749 L SE0200749 L SE 0200749L SE 0200749 A SE0200749 A SE 0200749A SE 0200749 A SE0200749 A SE 0200749A SE 0200749 L SE0200749 L SE 0200749L
Authority
SE
Sweden
Prior art keywords
impedance matching
substance
circuit
component carrier
electronic component
Prior art date
Application number
SE0200749A
Other languages
English (en)
Other versions
SE0200749D0 (sv
SE520309C2 (sv
Inventor
Edgard Goobar
Lars-Goete Svenson
Original Assignee
Optillion Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optillion Ab filed Critical Optillion Ab
Priority to SE0200749A priority Critical patent/SE520309C2/sv
Publication of SE0200749D0 publication Critical patent/SE0200749D0/sv
Priority to PCT/SE2003/000356 priority patent/WO2003077316A1/en
Priority to AU2003217107A priority patent/AU2003217107A1/en
Publication of SE0200749L publication Critical patent/SE0200749L/sv
Publication of SE520309C2 publication Critical patent/SE520309C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Amplifiers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
SE0200749A 2002-03-13 2002-03-13 Metod och krets för impedansanpassning SE520309C2 (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0200749A SE520309C2 (sv) 2002-03-13 2002-03-13 Metod och krets för impedansanpassning
PCT/SE2003/000356 WO2003077316A1 (en) 2002-03-13 2003-03-03 Impedance matching
AU2003217107A AU2003217107A1 (en) 2002-03-13 2003-03-03 Impedance matching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0200749A SE520309C2 (sv) 2002-03-13 2002-03-13 Metod och krets för impedansanpassning

Publications (3)

Publication Number Publication Date
SE0200749D0 SE0200749D0 (sv) 2002-03-13
SE0200749L true SE0200749L (sv) 2003-06-24
SE520309C2 SE520309C2 (sv) 2003-06-24

Family

ID=20287242

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0200749A SE520309C2 (sv) 2002-03-13 2002-03-13 Metod och krets för impedansanpassning

Country Status (3)

Country Link
AU (1) AU2003217107A1 (sv)
SE (1) SE520309C2 (sv)
WO (1) WO2003077316A1 (sv)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04256203A (ja) * 1991-02-07 1992-09-10 Mitsubishi Electric Corp マイクロ波帯ｉｃ用パッケージ
WO1996039012A1 (en) * 1995-06-01 1996-12-05 The Whitaker Corporation Electrical connection
JP3067675B2 (ja) * 1997-02-27 2000-07-17 株式会社村田製作所 平面誘電体集積回路
JP3119191B2 (ja) * 1997-02-27 2000-12-18 株式会社村田製作所 平面誘電体集積回路

Also Published As

Publication number Publication date
AU2003217107A1 (en) 2003-09-22
SE0200749D0 (sv) 2002-03-13
WO2003077316A1 (en) 2003-09-18
SE520309C2 (sv) 2003-06-24

Similar Documents

Publication Publication Date Title
FI20030493A (sv) Förfarande för tillverkning av en elektronikmodul och en elektronikmodul
CA2261551A1 (en) Socket for integrated circuit chip
AU2002211084A1 (en) Methods of manufacturing a printed circuit board shielded against interfering radiation
FI950970A0 (sv) Ringformade kretskomponenter kopplade till genomgångshål på kretskort
DE69915874D1 (de) Gedruckte leiterplatte und verfahren zu deren herstellung
EP1335422A3 (en) Chip sized semiconductor device and a process for making it
WO2004017372A3 (en) Method and apparatus for reducing electromagnetic emissions from electronic circuits
EP1170796A3 (en) High frequency carrier with an adapted interconnect structure
DE69939087D1 (de) Mehrschichtiger metallisierter verbund auf polymerfilmprodukt und verfahren
GB2369932A (en) Environmentally-sealed electronic assembly and method of making same
TWI267092B (en) Anisotropic conductive sheet
AU2002316910A1 (en) Circuit board with at least one electronic component
EP1434473A3 (en) Technique for reducing the number of layers in a signal routing device
EP0969503A3 (en) Electronic circuit device
MY129266A (en) Integrated circuit package with a capacitor
AU2966399A (en) Electric conductor with a surface structure in the form of flanges and etched grooves
SE0200749L (sv) Metod och krets för impedansanpassning
SE9900962D0 (sv) Förfarande och anordning för komponentkontaktering
MY128653A (en) Electronic component of a high frequency current suppression type and bonding wire for the same
WO1995018487A1 (en) Component-module-adapted oscillating circuit arrangement
FR2795234B1 (fr) Procede de fabrication de tout ou partie d'un dispositif electronique par jet de matiere
SE0003978D0 (sv) Anordning på ett mönsterkort och förfarande för tillverkning av en sådan anordning
EP1130674A3 (en) High frequency circuit module
AU3192201A (en) Radiocommunication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard
DE60130969D1 (de) Integriertes Mikrowellenmodul und entsprechendes Verfahren zu dessen Herstellung

Legal Events

Date Code Title Description
NUG Patent has lapsed