RU2004108042A - Электронный контур, содержащий проводящие перемычки, и способ изготовления таких перемычек - Google Patents
Электронный контур, содержащий проводящие перемычки, и способ изготовления таких перемычекInfo
- Publication number
- RU2004108042A RU2004108042A RU2004108042/09A RU2004108042A RU2004108042A RU 2004108042 A RU2004108042 A RU 2004108042A RU 2004108042/09 A RU2004108042/09 A RU 2004108042/09A RU 2004108042 A RU2004108042 A RU 2004108042A RU 2004108042 A RU2004108042 A RU 2004108042A
- Authority
- RU
- Russia
- Prior art keywords
- substrate
- conductive layer
- conductive
- electronic circuit
- segment
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 239000000758 substrate Substances 0.000 claims abstract 22
- 239000010410 layer Substances 0.000 claims abstract 16
- 239000012790 adhesive layer Substances 0.000 claims abstract 6
- 239000000853 adhesive Substances 0.000 claims abstract 3
- 230000001070 adhesive effect Effects 0.000 claims abstract 3
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 2
- 230000003213 activating effect Effects 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Ceramic Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Credit Cards Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electronic Switches (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Claims (7)
1. Электронная схема, содержащая, по меньшей мере, один электронный элемент (6), выполненную из гибкого изолирующего материала подложку (5), по меньшей мере, один адгезионный слой и проводящий слой с множеством дорожек (4), причем электронный элемент (6) содержит, по меньшей мере, две соединительные зоны (7), по меньшей мере, одна из которых электрически соединена с проводящим слоем посредством проводящей перемычки, отличающаяся тем, что подложка содержит, по меньшей мере, одну полоску (2, 3) преимущественно прямоугольной формы, созданную путем прорезания подложки (5) по трем сторонам полоски, причем оставшаяся сторона полоски связана с подложкой (5), а перемычка образована проводящим сегментом (1), выделенным из проводящего слоя, свободным от любого клеящего вещества, проведенным сквозь подложку через один из вырезов, которые образованы за счет формирования полосок (2, 3), и соединенным с соединительной зоной (7).
2. Электронная схема по п.1, отличающаяся тем, что подложка (5) имеет первую поверхность с первым адгезионным слоем и первым проводящим слоем, а также вторую поверхность со вторым адгезионным слоем и вторым проводящим слоем, причем перемычка образована проводящим сегментом (1), выделенным только из второго проводящего слоя, свободным от клеящего вещества, проходящим сквозь подложку (5) через один из вырезов, которые образованы за счет формирования полосок (2, 3), и соединенным с соединительной зоной (7) и/или первым проводящим слоем.
3. Электронная схема, по п.1 или 2, отличающаяся тем, что несколько перемычек, образованных сегментами (1) дорожек, проведено сквозь подложку (5) через один и тот же вырез.
4. Электронная схема, по п.1 или 2, отличающаяся тем, что, по меньшей мере, одна перемычка, образованная сегментами (1) дорожек, проведена через подложку (5) столько раз, сколько необходимо для пересечения дорожек (4), принадлежащих проводящему слою, чтобы обеспечить соединение с соединительной зоной (7).
5. Электронная этикетка, отличающаяся тем, что содержит электронную схему согласно любому из пп.1-4.
6. Способ изготовления электронной схемы, содержащей подложку (5), образованную из гибкого изолирующего материала, по меньшей мере, один адгезионный слой и проводящий слой с множеством дорожек (4), а также электронный элемент (6), отличающийся тем, что выполнение перемычки между зоной проводящего слоя и целевой соединительной зоной (7) осуществляют посредством следующих операций:
продлевают дорожку в проводящем слое для образования проводящего сегмента (1),
вырезают в подложке (5) полоску преимущественно прямоугольной формы, одна из сторон которой связана с подложкой (5),
временно открывают вырез в подложке путем отжатия полоски (2, 3), которую отгибают по стороне, связанной с подложкой (5),
проводят проводящий сегмент (1) через указанный вырез,
сгибают проводящий сегмент (1), располагая его на противоположной поверхности подложки (5),
закрывают вырез после проводки проводящего сегмента (1) возвращением полоски в первоначальное положение на уровне подложки (5),
соединяют проводящий сегмент (1) с целевой соединительной зоной (7).
7. Способ по п.6, отличающийся тем, что целевая соединительная зона расположена на проводящем слое, и проводящий сегмент (1) возвращают к указанному проводящему слою посредством его повторной проводки сквозь подложку через вырез, образованный при формировании дополнительной полоски (2, 3), а затем закрепляют сегмент (1) на подложке (5) активацией клея, входящего в состав адгезионного слоя.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1798/01 | 2001-10-01 | ||
CH17982001 | 2001-10-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
RU2004108042A true RU2004108042A (ru) | 2005-09-20 |
RU2296440C2 RU2296440C2 (ru) | 2007-03-27 |
Family
ID=4566320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU2004108042/09A RU2296440C2 (ru) | 2001-10-01 | 2002-10-01 | Электронная схема с проводящими перемычками и способ изготовления таких перемычек |
Country Status (15)
Country | Link |
---|---|
US (1) | US7071422B2 (ru) |
EP (1) | EP1433368B1 (ru) |
JP (1) | JP3978730B2 (ru) |
CN (1) | CN100357967C (ru) |
AT (1) | ATE285664T1 (ru) |
AU (1) | AU2002334330B2 (ru) |
BR (1) | BRPI0213069B1 (ru) |
CA (1) | CA2462252C (ru) |
DE (1) | DE60202380T2 (ru) |
ES (1) | ES2235112T3 (ru) |
MX (1) | MXPA04002693A (ru) |
PT (1) | PT1433368E (ru) |
RU (1) | RU2296440C2 (ru) |
WO (1) | WO2003030601A1 (ru) |
ZA (1) | ZA200402146B (ru) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7288739B2 (en) * | 2001-02-26 | 2007-10-30 | Sts Atl Corporation | Method of forming an opening or cavity in a substrate for receiving an electronic component |
US7719103B2 (en) * | 2005-06-30 | 2010-05-18 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device |
WO2007041549A1 (en) * | 2005-09-30 | 2007-04-12 | Meadwestvaco Corporation | Electronic module expansion bridge |
WO2008082617A2 (en) | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Mailing apparatus for powered cards |
WO2008082616A1 (en) | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Card configured to receive separate battery |
FI121592B (fi) * | 2008-03-26 | 2011-01-31 | Tecnomar Oy | Piirilevylaminaatin, erityisesti rfid-antennilaminaatin valmistusmenetelmä ja piirilevylaminaatti |
US9681554B2 (en) * | 2008-04-07 | 2017-06-13 | Mediatek Inc. | Printed circuit board |
US8120927B2 (en) * | 2008-04-07 | 2012-02-21 | Mediatek Inc. | Printed circuit board |
WO2010060755A1 (de) | 2008-11-03 | 2010-06-03 | Ksw Microtec Ag | Verfahren zur herstellung eines rfid-transponderprodukts und nach dem verfahren hergestelltes rfid-transponderprodukt |
DE102009050386B4 (de) * | 2009-10-22 | 2013-10-31 | Mühlbauer Ag | Verfahren zum Herstellen von Durchkontaktierungen |
FI125720B (fi) * | 2011-05-19 | 2016-01-29 | Tecnomar Oy | Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä |
EP3439438A1 (en) * | 2017-08-02 | 2019-02-06 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Non-uniform magnetic foil embedded in component carrier |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2900580A (en) * | 1954-06-04 | 1959-08-18 | Beck S Inc | Printed electrical circuit components having integral lead-outs and methods of making same |
US3977074A (en) * | 1975-02-06 | 1976-08-31 | General Motors Corporation | Double sided printed circuit board and method for making same |
US5229548A (en) * | 1986-10-27 | 1993-07-20 | Black & Decker Inc. | Circuit board having a stamped substrate |
US5923539A (en) * | 1992-01-16 | 1999-07-13 | Hitachi, Ltd. | Multilayer circuit substrate with circuit repairing function, and electronic circuit device |
TW276356B (ru) * | 1994-06-24 | 1996-05-21 | Ibm | |
JP3510743B2 (ja) * | 1996-09-13 | 2004-03-29 | ローム株式会社 | 配線接続構造及びそれを用いた電子部品 |
FR2769109B1 (fr) * | 1997-09-26 | 1999-11-19 | Gemplus Sca | Dispositif electronique a puce jetable et procede de fabrication |
JP2000057289A (ja) | 1998-08-11 | 2000-02-25 | Sony Corp | 非接触icカード |
DE19916180C2 (de) * | 1999-04-10 | 2001-03-08 | Cubit Electronics Gmbh | Verfahren zur Herstellung von elektrisch isolierten Leiterkreuzungen |
JP2001188891A (ja) * | 2000-01-05 | 2001-07-10 | Shinko Electric Ind Co Ltd | 非接触型icカード |
US6535396B1 (en) * | 2000-04-28 | 2003-03-18 | Delphi Technologies, Inc. | Combination circuit board and segmented conductive bus substrate |
US6727436B2 (en) * | 2002-03-15 | 2004-04-27 | Memx, Inc. | Interconnect bus crossover for MEMS |
US6707677B1 (en) * | 2003-03-12 | 2004-03-16 | Silicon Integrated Systems Corp. | Chip-packaging substrate and test method therefor |
-
2002
- 2002-10-01 BR BRPI0213069-6A patent/BRPI0213069B1/pt not_active IP Right Cessation
- 2002-10-01 CA CA2462252A patent/CA2462252C/en not_active Expired - Fee Related
- 2002-10-01 EP EP02800216A patent/EP1433368B1/fr not_active Expired - Lifetime
- 2002-10-01 ES ES02800216T patent/ES2235112T3/es not_active Expired - Lifetime
- 2002-10-01 JP JP2003533654A patent/JP3978730B2/ja not_active Expired - Fee Related
- 2002-10-01 AU AU2002334330A patent/AU2002334330B2/en not_active Ceased
- 2002-10-01 MX MXPA04002693A patent/MXPA04002693A/es active IP Right Grant
- 2002-10-01 PT PT02800216T patent/PT1433368E/pt unknown
- 2002-10-01 WO PCT/IB2002/004039 patent/WO2003030601A1/fr active IP Right Grant
- 2002-10-01 RU RU2004108042/09A patent/RU2296440C2/ru not_active IP Right Cessation
- 2002-10-01 US US10/489,879 patent/US7071422B2/en not_active Expired - Fee Related
- 2002-10-01 CN CNB028194268A patent/CN100357967C/zh not_active Expired - Fee Related
- 2002-10-01 AT AT02800216T patent/ATE285664T1/de active
- 2002-10-01 DE DE60202380T patent/DE60202380T2/de not_active Expired - Lifetime
-
2004
- 2004-03-17 ZA ZA2004/02146A patent/ZA200402146B/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP1433368A1 (fr) | 2004-06-30 |
RU2296440C2 (ru) | 2007-03-27 |
CN1561657A (zh) | 2005-01-05 |
PT1433368E (pt) | 2005-05-31 |
DE60202380T2 (de) | 2005-12-08 |
BR0213069A (pt) | 2004-09-28 |
CA2462252C (en) | 2011-11-29 |
JP3978730B2 (ja) | 2007-09-19 |
ES2235112T3 (es) | 2005-07-01 |
WO2003030601A1 (fr) | 2003-04-10 |
JP2005523572A (ja) | 2005-08-04 |
CN100357967C (zh) | 2007-12-26 |
US20040238212A1 (en) | 2004-12-02 |
ATE285664T1 (de) | 2005-01-15 |
ZA200402146B (en) | 2005-07-27 |
US7071422B2 (en) | 2006-07-04 |
EP1433368B1 (fr) | 2004-12-22 |
BRPI0213069B1 (pt) | 2015-08-18 |
CA2462252A1 (en) | 2003-04-10 |
MXPA04002693A (es) | 2004-06-18 |
DE60202380D1 (de) | 2005-01-27 |
AU2002334330B2 (en) | 2007-06-07 |
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