PL3835381T3 - Dwuskładnikowa (2k) utwardzalna kompozycja klejowa - Google Patents

Dwuskładnikowa (2k) utwardzalna kompozycja klejowa

Info

Publication number
PL3835381T3
PL3835381T3 PL19216098.4T PL19216098T PL3835381T3 PL 3835381 T3 PL3835381 T3 PL 3835381T3 PL 19216098 T PL19216098 T PL 19216098T PL 3835381 T3 PL3835381 T3 PL 3835381T3
Authority
PL
Poland
Prior art keywords
component
adhesive composition
curable adhesive
curable
composition
Prior art date
Application number
PL19216098.4T
Other languages
English (en)
Inventor
Stefanie Stapf
Benjamin Brunstedt
Jordán Gutiérrez Díaz
Thomas Moeller
Original Assignee
Henkel Ag & Co. Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co. Kgaa filed Critical Henkel Ag & Co. Kgaa
Publication of PL3835381T3 publication Critical patent/PL3835381T3/pl

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/064Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/18Layered products comprising a layer of metal comprising iron or steel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006Delaminating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04Acids; Metal salts or ammonium salts thereof
    • C08F220/06Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/14Methyl esters, e.g. methyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/103Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/14Peroxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37Thiols
    • C08K5/378Thiols containing heterocyclic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/56Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207Heat-activated adhesive
    • B32B2037/1215Hot-melt adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/022 layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54Yield strength; Tensile strength
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PL19216098.4T 2019-12-13 2019-12-13 Dwuskładnikowa (2k) utwardzalna kompozycja klejowa PL3835381T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19216098.4A EP3835381B1 (en) 2019-12-13 2019-12-13 Two component (2k) curable adhesive composition

Publications (1)

Publication Number Publication Date
PL3835381T3 true PL3835381T3 (pl) 2023-06-26

Family

ID=69105684

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19216098.4T PL3835381T3 (pl) 2019-12-13 2019-12-13 Dwuskładnikowa (2k) utwardzalna kompozycja klejowa

Country Status (9)

Country Link
US (1) US20220389289A1 (pl)
EP (1) EP3835381B1 (pl)
JP (1) JP2023506807A (pl)
KR (1) KR20220117871A (pl)
CN (1) CN114787305A (pl)
ES (1) ES2940490T3 (pl)
PL (1) PL3835381T3 (pl)
TW (1) TW202132522A (pl)
WO (1) WO2021115772A1 (pl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113980171B (zh) * 2021-12-01 2022-10-11 香港中文大学(深圳) 遇湿***的高分子材料及其制备方法和用途
JP2023138150A (ja) * 2022-03-18 2023-09-29 株式会社東芝 物体の接着・剥離方法、及び物体接着剥離装置
EP4269518A1 (en) * 2022-04-26 2023-11-01 Henkel AG & Co. KGaA Two component (2k) acrylic composition comprising a bio-renewable monomer
WO2023241875A1 (en) 2022-06-17 2023-12-21 Henkel Ag & Co. Kgaa Two component (2k) curable adhesive composition
EP4332190A1 (en) * 2022-09-05 2024-03-06 Henkel AG & Co. KGaA Debondable solvent-borne pressure sensitive adhesive (psa)
WO2024079548A1 (en) * 2022-10-10 2024-04-18 3M Innovative Properties Company Electrically debondable uv activated adhesives

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3419512A (en) 1965-12-23 1968-12-31 Borden Inc Anaerobic curing composition
US3479246A (en) 1967-08-08 1969-11-18 John R Stapleton Catalyzed room temperature curing shelf stable sealant compositions
US3535342A (en) 1968-02-07 1970-10-20 Dow Chemical Co Process for making alkylene carbonates
JPS5117966B1 (pl) * 1971-07-22 1976-06-07
IT1034323B (it) 1975-03-17 1979-09-10 Anic Spa Procedimento per la preparazione di alchilencarbonati
US4171240A (en) 1978-04-26 1979-10-16 Western Electric Company, Inc. Method of removing a cured epoxy from a metal surface
JPS5714669A (en) * 1980-06-30 1982-01-25 Bridgestone Corp Electrically conductive bonding method of metal
GB8307613D0 (en) 1983-03-18 1983-04-27 Bp Chem Int Ltd Carbonates
DE3529263A1 (de) 1985-08-16 1987-02-19 Hoechst Ag Verfahren zur herstellung von 2-oxo-1,3-dioxolanen
DE3600602A1 (de) 1986-01-11 1987-07-16 Hoechst Ag Verfahren zur herstellung von 2-oxo-1,3-dioxolanen
US4729797A (en) 1986-12-31 1988-03-08 International Business Machines Corporation Process for removal of cured epoxy
JPH051225A (ja) 1991-06-25 1993-01-08 Kanegafuchi Chem Ind Co Ltd 硬化性組成物
DE29706235U1 (de) 1997-04-08 1998-08-27 Ernst Mühlbauer KG, 22547 Hamburg Anordnung zum Ausgeben einer gemischten dentaltechnischen Mehrkomponentenmasse
US7332218B1 (en) * 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
US20080196828A1 (en) 1999-07-14 2008-08-21 Gilbert Michael D Electrically Disbonding Adhesive Compositions and Related Methods
US20070269659A1 (en) 2006-05-17 2007-11-22 Eic Laboratories, Inc. Electrically disbondable compositions and related methods
DE102008040738A1 (de) 2008-07-25 2010-01-28 Hilti Aktiengesellschaft Foliengebinde
WO2011112643A2 (en) * 2010-03-09 2011-09-15 Henkel Corporation Cationic uv-crosslinkable acrylic polymers for pressure sensitive adhesives
WO2013074265A1 (en) * 2011-11-14 2013-05-23 Henkel Corporation Adhesive compositions
CN103571406B (zh) * 2013-10-25 2016-08-31 北京天山新材料技术有限公司 高弹性室温快速固化丙烯酸酯结构胶及其制备方法
DE102014109355A1 (de) * 2014-07-04 2016-01-07 Fischerwerke Gmbh & Co. Kg Reaktivverdünner für die chemische Befestigung
CN107207938B (zh) * 2015-02-27 2020-12-15 汉高股份有限及两合公司 可脱粘的反应性热熔粘合剂
TWI711680B (zh) * 2015-07-03 2020-12-01 日商東亞合成股份有限公司 黏著劑組成物
EP3199344B1 (en) 2016-02-01 2022-04-13 Henkel AG & Co. KGaA Electrical debonding of pu hot melt adhesives by use of conductive inks
CN109563389A (zh) * 2016-08-10 2019-04-02 3M创新有限公司 氟化压敏粘合剂
WO2018081941A1 (zh) * 2016-11-02 2018-05-11 宁德新能源科技有限公司 结构胶纸及其制备方法、在电极片预留极耳空位的方法
TWI768032B (zh) * 2017-04-21 2022-06-21 德商漢高智慧財產控股公司 黏著劑組合物
WO2018195038A1 (en) * 2017-04-21 2018-10-25 Henkel IP & Holding GmbH Adhesive compositions
JP2018188602A (ja) * 2017-05-11 2018-11-29 セメダイン株式会社 二液型硬化性組成物、及び製品
CN108977135A (zh) * 2017-05-31 2018-12-11 比亚迪股份有限公司 厌氧胶组合物、厌氧胶及其制备方法
KR102533735B1 (ko) * 2017-09-28 2023-05-17 미쯔비시 케미컬 주식회사 활성 에너지선 경화성 박리형 점착제 조성물
WO2019113298A1 (en) * 2017-12-07 2019-06-13 Henkel IP & Holding GmbH Two component room temperature curable polyacrylate compositions
CN109054661A (zh) * 2018-07-17 2018-12-21 江苏道明胶粘剂有限公司 一种高粘接强度ab双组份型丙烯酸结构胶及制备方法

Also Published As

Publication number Publication date
EP3835381A1 (en) 2021-06-16
TW202132522A (zh) 2021-09-01
WO2021115772A1 (en) 2021-06-17
CN114787305A (zh) 2022-07-22
KR20220117871A (ko) 2022-08-24
EP3835381B1 (en) 2023-02-08
ES2940490T3 (es) 2023-05-08
US20220389289A1 (en) 2022-12-08
JP2023506807A (ja) 2023-02-20

Similar Documents

Publication Publication Date Title
PL3835381T3 (pl) Dwuskładnikowa (2k) utwardzalna kompozycja klejowa
EP3613779A4 (en) CURING COMPOSITION
EP3305831A4 (en) HARDENABLE COMPOSITION AND ADHESIVE FOR OPTICAL APPLICATIONS USED THEREOF
EP3835386B8 (en) Two component (2k) curable adhesive composition
EP3705531A4 (en) HARDENABLE COMPOSITION
EP3702377A4 (en) CURING COMPOSITION
EP3967726A4 (en) SETTING COMPOSITION
EP3858939A4 (en) TWO-PACKAGE CURING ADHESIVE COMPOSITION
EP3705529A4 (en) CURING COMPOSITION
EP4079785A4 (en) CURABLE COMPOSITION
EP4079786A4 (en) CURABLE COMPOSITION
EP4079787A4 (en) CURDABLE COMPOSITION
EP3931237A4 (en) MOISTURE CURE ADHESIVE COMPOSITIONS
EP3812426A4 (en) SETTING COMPOSITION
PL3835383T3 (pl) Jednoskładnikowa (1K), utwardzalna kompozycja klejąca
EP4079788A4 (en) CURABLE COMPOSITION
EP3705530A4 (en) CURING COMPOSITION
EP3705527A4 (en) CURING COMPOSITION
EP3705528A4 (en) HARDENABLE COMPOSITION
EP4079516A4 (en) CURDABLE COMPOSITION
EP4011978A4 (en) CURABLE COMPOSITION
EP3878917A4 (en) CURING RESIN COMPOSITION
EP3757149A4 (en) CURING COMPOSITION
EP3747940A4 (en) HARDENABLE COMPOSITION
EP3995523A4 (en) LOW TEMPERATURE CURABLE COMPOSITION