PL3829278T3 - Układ chłodzenia dla serwera z możliwością zamontowania w szafie serwerowej - Google Patents
Układ chłodzenia dla serwera z możliwością zamontowania w szafie serwerowejInfo
- Publication number
- PL3829278T3 PL3829278T3 PL19315149.5T PL19315149T PL3829278T3 PL 3829278 T3 PL3829278 T3 PL 3829278T3 PL 19315149 T PL19315149 T PL 19315149T PL 3829278 T3 PL3829278 T3 PL 3829278T3
- Authority
- PL
- Poland
- Prior art keywords
- server
- mountable
- cooling arrangement
- rack
- server rack
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP19315149.5A EP3829278B1 (en) | 2019-11-29 | 2019-11-29 | Cooling arrangement for a server mountable in a server rack |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3829278T3 true PL3829278T3 (pl) | 2022-07-18 |
Family
ID=69185285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL19315149.5T PL3829278T3 (pl) | 2019-11-29 | 2019-11-29 | Układ chłodzenia dla serwera z możliwością zamontowania w szafie serwerowej |
Country Status (7)
Country | Link |
---|---|
US (1) | US10897837B1 (pl) |
EP (1) | EP3829278B1 (pl) |
KR (1) | KR102587436B1 (pl) |
CN (1) | CN112888239B (pl) |
CA (1) | CA3091052A1 (pl) |
DK (1) | DK3829278T3 (pl) |
PL (1) | PL3829278T3 (pl) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11985800B2 (en) * | 2022-03-21 | 2024-05-14 | Microsoft Tech nology Licensing, LLC | Systems and methods for multiphase thermal management |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6141211A (en) * | 1998-06-29 | 2000-10-31 | Hewlett-Packard Company | Heat sink conduction between disk drive carrier and information storage enclosure |
US6796372B2 (en) | 2001-06-12 | 2004-09-28 | Liebert Corporation | Single or dual buss thermal transfer system |
US6828675B2 (en) | 2001-09-26 | 2004-12-07 | Modine Manufacturing Company | Modular cooling system and thermal bus for high power electronics cabinets |
US6836407B2 (en) | 2002-01-04 | 2004-12-28 | Intel Corporation | Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure |
US7133283B2 (en) | 2002-01-04 | 2006-11-07 | Intel Corporation | Frame-level thermal interface component for transfer of heat from an electronic component of a computer system |
US7012807B2 (en) | 2003-09-30 | 2006-03-14 | International Business Machines Corporation | Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack |
JP4272503B2 (ja) | 2003-12-17 | 2009-06-03 | 株式会社日立製作所 | 液冷システム |
US7958935B2 (en) | 2004-03-31 | 2011-06-14 | Belits Computer Systems, Inc. | Low-profile thermosyphon-based cooling system for computers and other electronic devices |
US20060187639A1 (en) | 2005-02-23 | 2006-08-24 | Lytron, Inc. | Electronic component cooling and interface system |
CN101438638B (zh) | 2006-02-16 | 2015-01-14 | 库利吉公司 | 服务器应用的液体冷却回路 |
US20070291452A1 (en) | 2006-06-14 | 2007-12-20 | Gilliland Don A | Heat Transfer Systems for Dissipating Thermal Loads From a Computer Rack |
US20080043442A1 (en) * | 2006-08-16 | 2008-02-21 | Strickland Travis C | Computer system with thermal conduction |
US9074825B2 (en) | 2007-09-28 | 2015-07-07 | Panasonic Intellectual Property Management Co., Ltd. | Heatsink apparatus and electronic device having the same |
JP4859823B2 (ja) * | 2007-12-14 | 2012-01-25 | 株式会社日立製作所 | 冷却装置およびそれを用いた電子機器 |
US8164901B2 (en) | 2008-04-16 | 2012-04-24 | Julius Neudorfer | High efficiency heat removal system for rack mounted computer equipment |
JP2010212533A (ja) * | 2009-03-12 | 2010-09-24 | Fujikura Ltd | 局部冷却装置 |
US8582298B2 (en) * | 2009-06-22 | 2013-11-12 | Xyber Technologies | Passive cooling enclosure system and method for electronics devices |
JP5644767B2 (ja) | 2009-09-29 | 2014-12-24 | 日本電気株式会社 | 電子機器装置の熱輸送構造 |
CN102834688B (zh) | 2010-03-29 | 2015-07-15 | 日本电气株式会社 | 相变冷却器和设有该相变冷却器的电子设备 |
US20120279683A1 (en) * | 2011-05-05 | 2012-11-08 | Alcatel-Lucent Usa Inc. | Cooling apparatus for communications platforms |
US9560794B2 (en) * | 2011-11-08 | 2017-01-31 | Panasonic Intellectual Property Management Co., Ltd. | Cooling device for cooling rack-type server, and data center provided with same |
JP6164089B2 (ja) | 2011-12-13 | 2017-07-19 | 日本電気株式会社 | 薄型電子機器の冷却構造及びそれを用いた電子装置 |
JP6587540B2 (ja) * | 2012-08-20 | 2019-10-09 | エーディーシー テクノロジーズ インコーポレイテッド | ラックマウント式機器のレールと冷却ラック筐体のチャネルとの間で熱を伝達するための装置、並びにそれに関連する構成要素、システム、及び方法 |
JP6390225B2 (ja) | 2014-07-11 | 2018-09-19 | 富士通株式会社 | 冷却システム及び電子装置 |
US9433132B2 (en) * | 2014-08-08 | 2016-08-30 | Intel Corporation | Recirculating dielectric fluid cooling |
EP2985556B1 (en) | 2014-08-14 | 2017-03-15 | Ibérica del Espacio, S.A. | Advanced control two phase heat transfer loop |
CN104252187B (zh) | 2014-09-19 | 2016-08-17 | 广东申菱环境***股份有限公司 | 一种二次水环路服务器机柜散热***的控制方法 |
CN105704989B (zh) | 2016-04-26 | 2018-09-28 | 广东申菱环境***股份有限公司 | 带有液冷***的服务器机柜 |
US10045466B1 (en) | 2017-04-28 | 2018-08-07 | Quanta Computer Inc. | High performance server through improved hybrid cooling |
JP6628327B2 (ja) | 2017-10-20 | 2020-01-08 | Necプラットフォームズ株式会社 | サーバ |
CN107979955B (zh) | 2017-11-24 | 2020-06-30 | 北京百度网讯科技有限公司 | 一种模块化液冷服务器机箱 |
-
2019
- 2019-11-29 EP EP19315149.5A patent/EP3829278B1/en active Active
- 2019-11-29 DK DK19315149.5T patent/DK3829278T3/da active
- 2019-11-29 PL PL19315149.5T patent/PL3829278T3/pl unknown
-
2020
- 2020-08-25 US US17/002,065 patent/US10897837B1/en active Active
- 2020-08-25 CA CA3091052A patent/CA3091052A1/en active Pending
- 2020-08-28 CN CN202010887208.5A patent/CN112888239B/zh active Active
- 2020-08-31 KR KR1020200110005A patent/KR102587436B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR102587436B1 (ko) | 2023-10-10 |
CA3091052A1 (en) | 2021-05-29 |
US10897837B1 (en) | 2021-01-19 |
CN112888239B (zh) | 2023-09-12 |
DK3829278T3 (da) | 2022-06-20 |
EP3829278A1 (en) | 2021-06-02 |
EP3829278B1 (en) | 2022-05-18 |
CN112888239A (zh) | 2021-06-01 |
KR20210067863A (ko) | 2021-06-08 |
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