PL3584352T3 - Electroless plating method - Google Patents
Electroless plating methodInfo
- Publication number
- PL3584352T3 PL3584352T3 PL18806217.8T PL18806217T PL3584352T3 PL 3584352 T3 PL3584352 T3 PL 3584352T3 PL 18806217 T PL18806217 T PL 18806217T PL 3584352 T3 PL3584352 T3 PL 3584352T3
- Authority
- PL
- Poland
- Prior art keywords
- electroless plating
- plating method
- electroless
- plating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017102106 | 2017-05-23 | ||
PCT/JP2018/019776 WO2018216714A1 (en) | 2017-05-23 | 2018-05-23 | Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3584352T3 true PL3584352T3 (en) | 2023-09-25 |
Family
ID=64395514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL18806217.8T PL3584352T3 (en) | 2017-05-23 | 2018-05-23 | Electroless plating method |
Country Status (10)
Country | Link |
---|---|
US (1) | US20200407854A1 (en) |
EP (1) | EP3584352B1 (en) |
JP (1) | JP6482049B1 (en) |
KR (2) | KR20190137146A (en) |
CN (3) | CN113373432A (en) |
ES (1) | ES2953783T3 (en) |
MY (1) | MY176735A (en) |
PL (1) | PL3584352T3 (en) |
PT (1) | PT3584352T (en) |
WO (1) | WO2018216714A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3323910B1 (en) * | 2016-11-22 | 2018-11-14 | MacDermid Enthone GmbH | Chromium-free plating-on-plastic etch |
CN110172684A (en) * | 2019-06-06 | 2019-08-27 | 南通柏源汽车零部件有限公司 | A kind of ABS Chrome-free coarsening solution and the preparation method and application thereof |
EP4144885A1 (en) | 2020-04-28 | 2023-03-08 | Kurita Water Industries Ltd. | Etching method for resin molded article and etching process system for resin molded article |
JP2023539605A (en) | 2020-08-25 | 2023-09-15 | アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー | Metallization method and pretreatment composition for nonmetallic substrates |
JP7138880B1 (en) * | 2021-08-06 | 2022-09-20 | 株式会社太洋工作所 | Electroless plating method |
CN115125525A (en) * | 2022-07-05 | 2022-09-30 | 长沙理工大学 | Low-cost hexagonal boron nitride surface chemical nickel plating pre-palladium-free activation method |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4001372A (en) * | 1972-02-19 | 1977-01-04 | Mitsubishi Kinzoku Kogyo Kabushiki Kaisha | Removing oxides of nitrogen from gaseous mixtures with alkali manganate solutions |
US4042729A (en) * | 1972-12-13 | 1977-08-16 | Kollmorgen Technologies Corporation | Process for the activation of resinous bodies for adherent metallization |
DE3816494A1 (en) * | 1988-05-10 | 1989-11-16 | Schering Ag | SOLUTION AND METHOD FOR THE AETZING AND ACTIVATION OF INSULATED SURFACES |
GB9722028D0 (en) * | 1997-10-17 | 1997-12-17 | Shipley Company Ll C | Plating of polymers |
ATE445667T1 (en) * | 2007-08-10 | 2009-10-15 | Enthone | CHROME-FREE STAIN FOR PLASTIC SURFACES |
JP2009228083A (en) * | 2008-03-25 | 2009-10-08 | Ebara-Udylite Co Ltd | Metal plating method on plastic surface |
KR101025856B1 (en) * | 2008-08-26 | 2011-03-30 | 연세대학교 산학협력단 | Method for synthesizing silver and manganese dioxide complex nanorods or nanotubes by using the standard reduction potential difference |
SG188694A1 (en) * | 2011-09-30 | 2013-04-30 | Bayer Materialscience Ag | Aqueous ink formulation containing metal-based nanoparticles for usage in micro contact printing |
US8603352B1 (en) * | 2012-10-25 | 2013-12-10 | Rohm and Haas Electroncis Materials LLC | Chrome-free methods of etching organic polymers |
KR20180077326A (en) * | 2013-10-22 | 2018-07-06 | 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 | Composition for etching treatment of resin material |
CN106471155B (en) * | 2014-04-01 | 2019-11-15 | 安美特德国有限公司 | For making the composition and method of nonconductive plastic material surface metalation |
PL3168326T5 (en) * | 2014-07-10 | 2024-02-05 | Okuno Chemical Industries Co., Ltd. | Resin plating method |
US9506150B2 (en) * | 2014-10-13 | 2016-11-29 | Rohm And Haas Electronic Materials Llc | Metallization inhibitors for plastisol coated plating tools |
-
2018
- 2018-05-23 MY MYPI2019005194A patent/MY176735A/en unknown
- 2018-05-23 CN CN202110654779.9A patent/CN113373432A/en active Pending
- 2018-05-23 CN CN201880028555.3A patent/CN110573657A/en active Pending
- 2018-05-23 PT PT188062178T patent/PT3584352T/en unknown
- 2018-05-23 EP EP18806217.8A patent/EP3584352B1/en active Active
- 2018-05-23 US US16/493,480 patent/US20200407854A1/en active Pending
- 2018-05-23 WO PCT/JP2018/019776 patent/WO2018216714A1/en active Search and Examination
- 2018-05-23 ES ES18806217T patent/ES2953783T3/en active Active
- 2018-05-23 KR KR1020197033554A patent/KR20190137146A/en active Application Filing
- 2018-05-23 JP JP2018549365A patent/JP6482049B1/en active Active
- 2018-05-23 KR KR1020207033666A patent/KR102366687B1/en active IP Right Grant
- 2018-05-23 PL PL18806217.8T patent/PL3584352T3/en unknown
- 2018-05-23 CN CN202410090911.1A patent/CN117904611A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP3584352A1 (en) | 2019-12-25 |
KR20190137146A (en) | 2019-12-10 |
EP3584352B1 (en) | 2023-06-21 |
PT3584352T (en) | 2023-07-26 |
ES2953783T3 (en) | 2023-11-16 |
CN110573657A (en) | 2019-12-13 |
KR102366687B1 (en) | 2022-02-23 |
US20200407854A1 (en) | 2020-12-31 |
CN113373432A (en) | 2021-09-10 |
CN117904611A (en) | 2024-04-19 |
MY176735A (en) | 2020-08-20 |
EP3584352A4 (en) | 2021-01-06 |
WO2018216714A1 (en) | 2018-11-29 |
JPWO2018216714A1 (en) | 2019-06-27 |
JP6482049B1 (en) | 2019-03-13 |
KR20200134345A (en) | 2020-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
PT3575434T (en) | Plated steel | |
GB201701109D0 (en) | Method | |
SG11202001659PA (en) | Plating apparatus | |
PL3584352T3 (en) | Electroless plating method | |
EP3042985A4 (en) | Zinc alloy plating method | |
EP3173508A4 (en) | Method for producing plated component | |
GB201704847D0 (en) | Callibration method | |
EP3042984A4 (en) | Zinc alloy plating method | |
SG10201504959UA (en) | Plating method | |
EP3647461A4 (en) | Electroless plating process | |
SG11201610462WA (en) | Resin plating method | |
EP3190463A4 (en) | Photosensitive electroless plating undercoat agent | |
EP3297772A4 (en) | Method of pretreatment for electroless plating | |
SG11202001662SA (en) | Plating chuck | |
EP3149223A4 (en) | Aqueous electroless nickel plating bath and method of using the same | |
EP3489385A4 (en) | Electroless palladium/gold plating process | |
GB201700352D0 (en) | Method | |
EP3363928A4 (en) | Electroless platinum plating solution | |
EP3167097A4 (en) | Composite electroless nickel plating | |
EP3480339A4 (en) | Electroless platinum plating bath | |
GB201702250D0 (en) | Method | |
EP3693494A4 (en) | Electroless palladium plating solution | |
GB201514501D0 (en) | Electroless plating method | |
GB201703863D0 (en) | Armour plating | |
GB201705145D0 (en) | Electroless plating |