PL2823010T3 - Zespolony system do uszczelniania układów elektronicznych - Google Patents

Zespolony system do uszczelniania układów elektronicznych

Info

Publication number
PL2823010T3
PL2823010T3 PL13703063T PL13703063T PL2823010T3 PL 2823010 T3 PL2823010 T3 PL 2823010T3 PL 13703063 T PL13703063 T PL 13703063T PL 13703063 T PL13703063 T PL 13703063T PL 2823010 T3 PL2823010 T3 PL 2823010T3
Authority
PL
Poland
Prior art keywords
composite system
encapsulating electronic
electronic arrangements
arrangements
encapsulating
Prior art date
Application number
PL13703063T
Other languages
English (en)
Inventor
Minyoung BAI
Thilo Dollase
Jan Ellinger
Judith Grünauer
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of PL2823010T3 publication Critical patent/PL2823010T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/005—Presence of polyolefin in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
    • C09J2423/105—Presence of homo or copolymers of propene in the release coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1438—Metal containing
    • Y10T428/1443—Aluminum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1452—Polymer derived only from ethylenically unsaturated monomer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1476—Release layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
PL13703063T 2012-03-07 2013-02-07 Zespolony system do uszczelniania układów elektronicznych PL2823010T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012203623A DE102012203623A1 (de) 2012-03-07 2012-03-07 Verbundsystem zur Verkapselung elektronischer Anordnungen
PCT/EP2013/052422 WO2013131707A1 (de) 2012-03-07 2013-02-07 Verbundsystem zur verkapselung elektronischer anordnungen
EP13703063.1A EP2823010B1 (de) 2012-03-07 2013-02-07 Verbundsystem zur verkapselung elektronischer anordnungen

Publications (1)

Publication Number Publication Date
PL2823010T3 true PL2823010T3 (pl) 2019-03-29

Family

ID=47678830

Family Applications (1)

Application Number Title Priority Date Filing Date
PL13703063T PL2823010T3 (pl) 2012-03-07 2013-02-07 Zespolony system do uszczelniania układów elektronicznych

Country Status (9)

Country Link
US (1) US20150099081A1 (pl)
EP (1) EP2823010B1 (pl)
JP (1) JP2015511982A (pl)
KR (2) KR20190109595A (pl)
CN (1) CN104220549B (pl)
DE (1) DE102012203623A1 (pl)
PL (1) PL2823010T3 (pl)
TW (1) TW201350556A (pl)
WO (1) WO2013131707A1 (pl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016066435A1 (de) 2014-10-29 2016-05-06 Tesa Se Klebemassen mit aktivierbaren gettermaterialien
DE102016213840A1 (de) 2016-07-27 2018-02-01 Tesa Se Klebeband zur Verkapselung elektronischer Aufbauten
EP3339388B1 (en) * 2016-12-22 2022-01-26 3M Innovative Properties Company Pressure-sensitive adhesive compositions for manufacturing electronic devices
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
CN113420109B (zh) * 2021-08-23 2022-01-07 深圳市城市交通规划设计研究中心股份有限公司 一种街道界面渗透率的测量方法、计算机及存储介质

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051195A (en) 1975-12-15 1977-09-27 Celanese Polymer Specialties Company Polyepoxide-polyacrylate ester compositions
GB1552046A (en) 1977-02-02 1979-09-05 Ciba Geigy Ag Film adhesives
US4454266A (en) 1983-04-11 1984-06-12 Daubert Coated Products Inc. Release coating compositions
US4985499A (en) 1988-02-22 1991-01-15 Kuraray Company Ltd. Pressure sensitive adhesive composition
KR960007293B1 (ko) * 1988-06-23 1996-05-30 도오레 가부시기가이샤 폴리에스테르 필름의 제조방법
DE19543653C2 (de) * 1995-11-23 2000-08-24 Assidomaen Inncoat Gmbh Trennschichtträger
DE69627715T2 (de) 1996-11-12 2004-03-04 Minnesota Mining And Manufacturing Co., St. Paul Ein thermostatoplastischer vorläufer für einen druckempfindlichen klebstoff
US6057382A (en) 1998-05-01 2000-05-02 3M Innovative Properties Company Epoxy/thermoplastic photocurable adhesive composition
KR100454563B1 (ko) * 1999-08-09 2004-11-03 에스케이씨 주식회사 실리콘 코팅 조성물 및 이 조성물로 코팅된 폴리에스테르 이형필름
US6593406B2 (en) * 2000-12-08 2003-07-15 Toray Plastics (America), Inc. Polyester overlamination film with enhanced UV stabilization properties
US20020188053A1 (en) 2001-06-04 2002-12-12 Sipix Imaging, Inc. Composition and process for the sealing of microcups in roll-to-roll display manufacturing
KR20040019098A (ko) 2001-08-03 2004-03-04 디에스엠 엔.브이 표시 장치용 경화성 조성물
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
KR20100080632A (ko) 2002-06-17 2010-07-09 세키스이가가쿠 고교가부시키가이샤 유기 전계 발광 소자의 밀봉 방법
CN1678639A (zh) 2002-07-24 2005-10-05 粘合剂研究公司 可转换的压敏粘合剂胶带及其在显示屏上的用途
JP4455139B2 (ja) * 2004-04-21 2010-04-21 日東電工株式会社 フラットパネルディスプレイ用マザーガラス保護フィルムおよびその用途
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
JP2007268723A (ja) * 2006-03-30 2007-10-18 Lintec Corp 剥離シート
DE102006035786A1 (de) * 2006-07-28 2008-03-13 Tesa Ag Haftklebefolie mit hoher optischer Transparenz zur Verklebung als Splitterschutz auf Glasscheiben in Konsumgüterelektronikbauteilen
JP4673344B2 (ja) * 2007-06-07 2011-04-20 日東電工株式会社 光学フィルム用粘着シートの製造方法
EP2235131A4 (en) 2007-12-28 2013-10-02 3M Innovative Properties Co FLEXIBLE ENCAPSULATION FILM SYSTEMS
DE102008003546A1 (de) 2008-01-09 2009-07-16 Tesa Ag Liner mit einer Barriereschicht
JP4813509B2 (ja) * 2008-03-13 2011-11-09 日東電工株式会社 両面粘着シートとその製造方法及びプラスチックフィルムの固定方法
JP5201347B2 (ja) 2008-11-28 2013-06-05 株式会社スリーボンド 有機ｅｌ素子封止用光硬化性樹脂組成物
JP4805999B2 (ja) * 2008-12-09 2011-11-02 日東電工株式会社 粘着剤層付き透明導電性フィルムとその製造方法、透明導電性積層体およびタッチパネル
DE102008062130A1 (de) * 2008-12-16 2010-06-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
CA2753052A1 (en) * 2009-02-20 2010-08-26 Nichiban Co., Ltd. Pressure sensitive adhesive composition and pressure sensitive adhesive tape
DE102009027283A1 (de) * 2009-04-03 2010-10-07 Tesa Se Klebefolie zum Verschließen von Gefäßen und Kanälen, Herstellung und Verwendung dieser
DE102009046362A1 (de) 2009-11-03 2011-05-05 Tesa Se Haftklebestoff aus einem vernetzbaren Polyolefin und einem Klebharz
KR102117211B1 (ko) * 2011-08-03 2020-06-01 린텍 가부시키가이샤 가스 배리어성 점착 시트, 그 제조 방법, 그리고 전자 부재 및 광학 부재

Also Published As

Publication number Publication date
CN104220549A (zh) 2014-12-17
KR20190109595A (ko) 2019-09-25
WO2013131707A1 (de) 2013-09-12
JP2015511982A (ja) 2015-04-23
TW201350556A (zh) 2013-12-16
EP2823010B1 (de) 2018-10-03
DE102012203623A1 (de) 2013-09-12
KR20140133919A (ko) 2014-11-20
US20150099081A1 (en) 2015-04-09
EP2823010A1 (de) 2015-01-14
CN104220549B (zh) 2016-12-14

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