PL2633728T3 - Sposób polerowania podłoży powlekanych z użyciem szczotek - Google Patents

Sposób polerowania podłoży powlekanych z użyciem szczotek

Info

Publication number
PL2633728T3
PL2633728T3 PL11779480T PL11779480T PL2633728T3 PL 2633728 T3 PL2633728 T3 PL 2633728T3 PL 11779480 T PL11779480 T PL 11779480T PL 11779480 T PL11779480 T PL 11779480T PL 2633728 T3 PL2633728 T3 PL 2633728T3
Authority
PL
Poland
Prior art keywords
brushes
coated substrates
polishing coated
polishing
substrates
Prior art date
Application number
PL11779480T
Other languages
English (en)
Inventor
David Lawrence Bamber
Troy Darrell Manning
Neil Mcsporran
Paul David Warren
Paul Arthur Holmes
Original Assignee
Pilkington Group Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pilkington Group Limited filed Critical Pilkington Group Limited
Publication of PL2633728T3 publication Critical patent/PL2633728T3/pl

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0236Special surface textures
    • H01L31/02366Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • H01L21/02068Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • H01L31/03923Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including AIBIIICVI compound materials, e.g. CIS, CIGS
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1884Manufacture of transparent electrodes, e.g. TCO, ITO
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22Roughened surfaces, e.g. at the interface between epitaxial layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80Constructional details
    • H10K30/81Electrodes
    • H10K30/82Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60Forming conductive regions or layers, e.g. electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/541CuInSe2 material PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photovoltaic Devices (AREA)
PL11779480T 2010-10-27 2011-10-27 Sposób polerowania podłoży powlekanych z użyciem szczotek PL2633728T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1018141.0A GB201018141D0 (en) 2010-10-27 2010-10-27 Polishing coated substrates
PCT/GB2011/052087 WO2012056240A2 (en) 2010-10-27 2011-10-27 Polishing coated substrates
EP11779480.0A EP2633728B1 (en) 2010-10-27 2011-10-27 Method of polishing coated substrates using brushes

Publications (1)

Publication Number Publication Date
PL2633728T3 true PL2633728T3 (pl) 2021-12-13

Family

ID=43365598

Family Applications (1)

Application Number Title Priority Date Filing Date
PL11779480T PL2633728T3 (pl) 2010-10-27 2011-10-27 Sposób polerowania podłoży powlekanych z użyciem szczotek

Country Status (5)

Country Link
US (1) US9406822B2 (pl)
EP (1) EP2633728B1 (pl)
GB (1) GB201018141D0 (pl)
PL (1) PL2633728T3 (pl)
WO (1) WO2012056240A2 (pl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3428933B1 (en) 2011-09-30 2022-03-02 View, Inc. Improved optical device fabrication
GB201614208D0 (en) 2016-08-19 2016-10-05 Pilkington Group Ltd Switchable glazing unit
US11073715B2 (en) * 2016-09-27 2021-07-27 AGC Inc. Method for producing glass article, and glass article
GB201702168D0 (en) * 2017-02-09 2017-03-29 Pilkington Group Ltd Coated glazing
JP7464667B2 (ja) * 2022-09-16 2024-04-09 Dowaエレクトロニクス株式会社 光半導体素子の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522342A (en) 1967-07-03 1970-07-28 Nypel Inc Apparatus and method for making bristles having a filler
US4507361A (en) 1983-07-18 1985-03-26 Allied Corporation Low moisture absorption bristle of nylon and polyester
IN162671B (pl) 1984-03-05 1988-06-25 Energy Conversion Devices Inc
CA2068551A1 (en) 1991-05-15 1992-11-16 Akira Morii Abrasive brush
JP3119289B2 (ja) 1994-10-21 2000-12-18 信越半導体株式会社 半導体ウェーハの洗浄方法
US5483568A (en) * 1994-11-03 1996-01-09 Kabushiki Kaisha Toshiba Pad condition and polishing rate monitor using fluorescence
US6225640B1 (en) 1999-05-19 2001-05-01 Hughes Electronics Corporation Method for electrical shunt detection and removal on semiconductors
DE19923072A1 (de) 1999-05-20 2000-11-23 Bayer Ag Pigmentpräparationen für den Ink-Jet-Druck
DE60044762D1 (de) 1999-05-20 2010-09-16 Kaneka Corp Verfahren und Vorrichtung zur Herstellung eines Halbleiterbauelements
US7026758B2 (en) * 2001-09-28 2006-04-11 Osram Opto Semiconductors Gmbh Reinforcement of glass substrates in flexible devices
WO2007095322A1 (en) 2006-02-14 2007-08-23 Cabot Microelectronics Corporation Compositions and methods for cmp of indium tin oxide surfaces
EP2150149B1 (en) * 2007-05-10 2013-05-22 3M Innovative Properties Company Abrasive filament and brush
US20100047954A1 (en) 2007-08-31 2010-02-25 Su Tzay-Fa Jeff Photovoltaic production line
WO2009029901A1 (en) * 2007-08-31 2009-03-05 Applied Materials, Inc. Production line module for forming multiple sized photovoltaic devices
US8017861B2 (en) 2007-09-18 2011-09-13 Solopower, Inc. Substrate preparation for thin film solar cell manufacturing
US7863074B2 (en) 2008-09-30 2011-01-04 Stion Corporation Patterning electrode materials free from berm structures for thin film photovoltaic cells
US20100258173A1 (en) 2009-04-13 2010-10-14 Joseph Laia Polishing a thin metallic substrate for a solar cell

Also Published As

Publication number Publication date
EP2633728A2 (en) 2013-09-04
WO2012056240A2 (en) 2012-05-03
GB201018141D0 (en) 2010-12-08
EP2633728B1 (en) 2021-06-23
WO2012056240A3 (en) 2013-06-06
US20130244359A1 (en) 2013-09-19
US9406822B2 (en) 2016-08-02

Similar Documents

Publication Publication Date Title
EP2714821A4 (en) SURFACE COATING SYSTEM AND METHOD FOR PREPARING AND USING SAME
HK1183687A1 (en) Method of reducing biofilms
ZA201300880B (en) Coated abrasive articles
GB201010591D0 (en) Novel cleaning method
EP2610031A4 (en) POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
SG11201401051WA (en) Method of coating liquid optically clear adhesives onto rigid substrates
EP2714820A4 (en) SURFACE COATING SYSTEM AND METHOD OF USE OF THE SURFACE COATING SYSTEM
PL2539080T3 (pl) Sposób powlekania komponentów
EP2311074A4 (en) PROCESS FOR POLISHING NICKEL PHOSPHORUS
GB2489761B (en) Surface coatings
EP2535183A4 (en) HART COATING PROCESS FORM
GB2497665B (en) Synthetic diamond coated compound semiconductor substrates
SG11201400137WA (en) Composition for cleaning substrates post-chemical mechanical polishing
PL2558541T3 (pl) Obróbka powierzchniowa podłoży cementowych
EP2794768A4 (en) SURFACE COATINGS AND METHODS
EP2794280A4 (en) COATED MEDIA SUBSTRATE
EP2788192A4 (en) METHOD OF BINDING POLYESTER SUBSTRATES
PL2633728T3 (pl) Sposób polerowania podłoży powlekanych z użyciem szczotek
EP2660004A4 (en) Diamond surface polishing method
EP2638877A4 (en) BRUSH FOR CLEANING THE INSIDE OF AN IMPLANT
SG10201500561SA (en) Cleaning method for coating systems
GB201108255D0 (en) Wipe applicator
TWI562213B (en) System and method for cleaning substrate
KR101952444B9 (ko) 부상식 도포 장치
HRP20190347T1 (hr) Postupak proizvodnje premazanih supstrata