PH12019500670A1 - Workpiece holding jig and method for attaching workpiece to workpiece holding jig - Google Patents
Workpiece holding jig and method for attaching workpiece to workpiece holding jigInfo
- Publication number
- PH12019500670A1 PH12019500670A1 PH12019500670A PH12019500670A PH12019500670A1 PH 12019500670 A1 PH12019500670 A1 PH 12019500670A1 PH 12019500670 A PH12019500670 A PH 12019500670A PH 12019500670 A PH12019500670 A PH 12019500670A PH 12019500670 A1 PH12019500670 A1 PH 12019500670A1
- Authority
- PH
- Philippines
- Prior art keywords
- members
- pair
- workpiece
- holding jig
- supported
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Abstract
This workpiece holding jig 10 has a jig main body 20 that includes: a pair of upper lateral members 31, 32; a pair of lower lateral members 41, 42; and a connection part 50 that connects the pair of upper lateral members and the pair of lower lateral members. The jig main body 20 is provided with: a plurality of parallel first support members 70 that are supported between the pair of upper lateral members; a plurality of first clamp members 80 that are supported on each of the plurality of first support members and clamp upper end parts of each of a plurality of workpieces; a plurality of parallel second support members 90 that are supported between the pair of lower lateral members; and a plurality of second clamp members 100 that are supported on each of the plurality of second support members and clamp lower end parts of each of the plurality of workpieces. The plurality of first support members or the plurality of second support members are supported on the pair of upper lateral members or the pair of lower lateral members so as to be capable of ascending/descending.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016192109 | 2016-09-29 | ||
PCT/JP2017/034924 WO2018062260A1 (en) | 2016-09-29 | 2017-09-27 | Workpiece holding jig and method for attaching workpiece to workpiece holding jig |
Publications (1)
Publication Number | Publication Date |
---|---|
PH12019500670A1 true PH12019500670A1 (en) | 2019-12-02 |
Family
ID=61759793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12019500670A PH12019500670A1 (en) | 2016-09-29 | 2019-03-27 | Workpiece holding jig and method for attaching workpiece to workpiece holding jig |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6793967B2 (en) |
KR (1) | KR20190058513A (en) |
CN (1) | CN109963964B (en) |
MY (1) | MY195297A (en) |
PH (1) | PH12019500670A1 (en) |
WO (1) | WO2018062260A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6909524B2 (en) * | 2018-11-20 | 2021-07-28 | 株式会社アルメックステクノロジーズ | Jig transfer member and surface treatment device and method |
CN111945213B (en) * | 2020-07-06 | 2022-10-28 | 西安飞机工业(集团)有限责任公司 | Pictographic anode clamp for electroplating multiple plating surfaces of slide rail part |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1875454A (en) * | 2003-10-28 | 2006-12-06 | 诺信公司 | Plasma processing system and plasma treatment process |
JP2006093651A (en) | 2004-08-26 | 2006-04-06 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board and non-electrolytic plating device for wiring board manufacture |
JP6234731B2 (en) * | 2013-08-08 | 2017-11-22 | 上村工業株式会社 | Holder with clamper |
-
2017
- 2017-09-27 JP JP2018542637A patent/JP6793967B2/en active Active
- 2017-09-27 CN CN201780059414.3A patent/CN109963964B/en active Active
- 2017-09-27 MY MYPI2019001614A patent/MY195297A/en unknown
- 2017-09-27 WO PCT/JP2017/034924 patent/WO2018062260A1/en active Application Filing
- 2017-09-27 KR KR1020197010020A patent/KR20190058513A/en not_active Application Discontinuation
-
2019
- 2019-03-27 PH PH12019500670A patent/PH12019500670A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2018062260A1 (en) | 2018-04-05 |
CN109963964A (en) | 2019-07-02 |
JP6793967B2 (en) | 2020-12-02 |
MY195297A (en) | 2023-01-12 |
KR20190058513A (en) | 2019-05-29 |
CN109963964B (en) | 2021-08-31 |
JPWO2018062260A1 (en) | 2019-07-11 |
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