PH12019000247A1 - Method for automatic alignment of an electronic component duting die sorting process - Google Patents

Method for automatic alignment of an electronic component duting die sorting process

Info

Publication number
PH12019000247A1
PH12019000247A1 PH12019000247A PH12019000247A PH12019000247A1 PH 12019000247 A1 PH12019000247 A1 PH 12019000247A1 PH 12019000247 A PH12019000247 A PH 12019000247A PH 12019000247 A PH12019000247 A PH 12019000247A PH 12019000247 A1 PH12019000247 A1 PH 12019000247A1
Authority
PH
Philippines
Prior art keywords
electronic component
axis movement
sorting process
automatic alignment
duting
Prior art date
Application number
PH12019000247A
Inventor
Tan Kye SEANG
Te H Ban CHUAN
Chan Kok Seng
Original Assignee
Mi Equipment M Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mi Equipment M Sdn Bhd filed Critical Mi Equipment M Sdn Bhd
Publication of PH12019000247A1 publication Critical patent/PH12019000247A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A method for automatic alignment of an electronic component during die sorting process, comprising the steps of: determining first position of said electronic component; adjusting said ejector module and said wafer holding means in X-axis movement and Y-axis movement; picking and flipping said electronic component using said flipper head at an angle of 90 degrees; determining orientation of said electronic component; flipping said electronic component at an angle of 90 degrees; adjusting said flipper module in X-axis movement and Y-axis movement; adjusting said pick-up head in Z-axis movement; and said flipper module is operated based on air chamber conversion method to allow 360 degrees rotation from said flipper module.
PH12019000247A 2018-07-26 2019-07-22 Method for automatic alignment of an electronic component duting die sorting process PH12019000247A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYUI2018702607A MY192110A (en) 2018-07-26 2018-07-26 Method for automatic alignment of an electronic component during die sorting process

Publications (1)

Publication Number Publication Date
PH12019000247A1 true PH12019000247A1 (en) 2020-06-22

Family

ID=69515138

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12019000247A PH12019000247A1 (en) 2018-07-26 2019-07-22 Method for automatic alignment of an electronic component duting die sorting process

Country Status (4)

Country Link
KR (1) KR102365182B1 (en)
MY (1) MY192110A (en)
PH (1) PH12019000247A1 (en)
TW (1) TWI685912B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102503855B1 (en) 2020-06-10 2023-02-23 아이디씨코리아 주식회사 Micro chips module arranged matrix and Method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW477021B (en) * 2000-10-26 2002-02-21 Chein Hui Chuan Method of precisely accessing and placing chip to align the substrate during flip chip bonding process
JP5059518B2 (en) * 2007-08-10 2012-10-24 Ｊｕｋｉ株式会社 Electronic component mounting method and apparatus
EP2075829B1 (en) * 2007-12-24 2011-10-12 ISMECA Semiconductor Holding SA A method and device for aligning components
US20110182701A1 (en) * 2010-01-28 2011-07-28 Ui Holding Co. Method and apparatus for transferring die from a wafer
TWM463904U (en) * 2013-06-14 2013-10-21 Mpi Corp Rotary die sorting apparatus
KR101593801B1 (en) * 2014-05-29 2016-02-12 세메스 주식회사 Apparatus for ejecting dies
KR20170006343A (en) * 2015-07-07 2017-01-18 주식회사 프로텍 Apparatus and Method for Bonding Flip Chip
DE102015013494B3 (en) * 2015-10-16 2017-04-06 Mühlbauer Gmbh & Co. Kg Component handling device and method for removing components from a structured component supply and for depositing at a receiving device
US10056278B2 (en) * 2016-08-22 2018-08-21 Asm Technology Singapore Pte Ltd Apparatus and method for transferring electronic devices

Also Published As

Publication number Publication date
TW202008498A (en) 2020-02-16
KR102365182B1 (en) 2022-02-17
TWI685912B (en) 2020-02-21
MY192110A (en) 2022-07-28
KR20200012761A (en) 2020-02-05

Similar Documents

Publication Publication Date Title
US7137195B2 (en) Method for mounting electronic parts onto a board
TWI511629B (en) Alignment device and method to align plates for electronic circuits, and apparatus for processing a substrate
CN109238135B (en) Method for accurately positioning incoming material to test box based on vision
US8955735B2 (en) Method for enhancing the yield rate of ball implanting of a substrate of an integrated circuit
JP2016072397A (en) Electronic component mounting device
CN204453804U (en) A kind of full automaticity charging and discharging mechanism
JP2020062636A (en) Processing method using depth image detection
CN106855677A (en) Dynamic automatic focus tracking system
US9887111B2 (en) Die mounting system and die mounting method
JP2012116529A (en) Position correction device, electric component storage device, and electric component inspection device
JP6528123B2 (en) Component picking apparatus, component picking method and component mounting apparatus
CN103786008A (en) Dowel setting machine, suction nozzle for same and dowel setting method
CN103896025A (en) Intelligent camera based flexible vibration transmission system and operating method thereof
PH12019000247A1 (en) Method for automatic alignment of an electronic component duting die sorting process
US10005186B2 (en) Workpiece conveying device having positioning structure
JP5783652B2 (en) Attitude correction device and electrical component inspection device
JP2016096174A (en) Component mounting machine and component mounting head
JP6528121B2 (en) Component picking apparatus, component picking method and component mounting apparatus
PL1838464T3 (en) Method and apparatus for sorting a gas-driven stream of generally flat and light-weight articles
TW201824443A (en) Chip positioning device comprising an absolute precision marking member, a chip attachment body, an image capturing member, an attaching member, and a positioning adjustment member
JP2016506621A5 (en) Mask positioning system and mask positioning method
CN108838099A (en) Safety pin badge Defect Detection system and method based on machine vision
US10334768B2 (en) Component mounting device
JP6528122B2 (en) Component picking apparatus, component picking method and component mounting apparatus
CN108080293B (en) Six-face detection chip detection device