CN108080293B - Six-face detection chip detection device - Google Patents
Six-face detection chip detection device Download PDFInfo
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- CN108080293B CN108080293B CN201810134550.0A CN201810134550A CN108080293B CN 108080293 B CN108080293 B CN 108080293B CN 201810134550 A CN201810134550 A CN 201810134550A CN 108080293 B CN108080293 B CN 108080293B
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- 230000007246 mechanism Effects 0.000 claims description 26
- 230000002950 deficient Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 abstract description 13
- 230000003287 optical effect Effects 0.000 abstract description 10
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
- B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
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Abstract
The invention discloses a six-face detection chip detection device, which comprises a material taking part, a detection part, a control part and a material receiving part, wherein the material taking part is used for taking materials from a plurality of sides; the control part is respectively connected with the material taking part, the detection part and the material receiving part; the detected material is placed in a material receiving part; the control part is a control system; the device divides complex linear motion detection into simple circular arc motion carrying and static optical detection, an X-Y-theta rotation correction function is added in the material carrying process, so that precision loss caused by motion is reduced to the greatest extent, six surfaces of the material are detected in a vibration-free static state, the precision is high, the detection stability is improved, and high-speed six-surface optical three-dimensional detection of a high-precision semiconductor device is realized. The device is also added with automatic identification and automatic sorting functions, so that the synchronous selection and inspection of the high-precision semiconductor device is realized.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to a six-face detection chip detection device.
Background
In the current integrated circuit IC manufacturing, the semiconductor device runs through the whole packaging process, and after the later stage packaging process is completed, the appearance of the semiconductor chip or the semiconductor device needs to be detected, and the six-sided detecting chip device can realize the required detecting and selecting functions. The six-face inspection device performs optical stereoscopic inspection of six surfaces on the appearance of the high-precision semiconductor device. The full-automatic high-precision recognition, detection and selection functions in the sucking movement of the chip are realized, and the high-precision chip sorting functions from the film to the quenching disc and from the quenching disc to the quenching disc are completed.
The detection of the high-precision semiconductor device by the prior art is divided into two modes of domestic and foreign:
(1) Six-face detection of the semiconductor device in China is mainly realized by controlling the quality of products through process flow management and manually performing spot check on the packaged chips in a certain quantity proportion;
(2) Six-face detection of foreign semiconductor devices is realized by a motion detection device with a linear motor, and the device can meet the working requirements. However, as the movement speed of the linear motor is increased, the vibration of the mechanical arm is increased, and the error of the detection precision is improved; when the mechanical arm works, the mechanical arm must be subjected to X-Y-Z-theta four-phase motion control; in addition, due to the linear operation design of the device in the detection process and the position design of the camera, one rotation is required when six surfaces of the device are detected; due to the factors, the mechanical device of the device has the defects of complex action, high precision requirement, difficult motion control, difficult speed control, complex mechanical part design and maintenance, high equipment design, manufacturing and maintenance cost, low equipment use and motion rate, low industrial production efficiency and the like.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a six-face detection chip detection device, which divides complex linear motion detection into simple circular arc motion carrying and static optical detection, and adds an X-Y-theta rotation correction function during material carrying, thereby reducing the precision loss caused by motion to the maximum extent, ensuring that the detection of six faces of a material is static detection without vibration, improving the detection stability while ensuring high precision, and realizing high-speed six-face optical three-dimensional detection of a high-precision semiconductor device. The device is also added with automatic identification and automatic sorting functions, so that the synchronous selection and inspection of the high-precision semiconductor device is realized. The mechanical action is simple, the movement and the speed are easy to control, the equipment design, manufacturing and maintenance cost is low, the equipment use and the movement speed are fast, and the detection efficiency is high.
The technical scheme for realizing the aim of the invention is as follows:
the six-face detection chip detection device comprises a material taking part, a detection part, a control part and a material receiving part; the control part is respectively connected with the material taking part, the detection part and the material receiving part; the detected material is placed in a material receiving part;
The control part is a control system.
The material taking part comprises an XY material taking workbench, a material taking positioning camera and a material taking swing arm, wherein the material taking positioning camera is arranged right above the XY material taking workbench; and the XY material taking workbench, the material taking positioning camera and the material taking swing arm are respectively connected with a control system of the control part.
The detection part comprises a positioning detection correction camera, 2 detection swing arms, an XY theta correction detection workbench and 2 five-face detection mechanisms; the 2 detection swing arms and the 2 pentahedral detection mechanisms are symmetrically arranged on two sides of the XY theta correction detection workbench respectively; the XY theta correction detection workbench and the pentahedral detection mechanism are respectively arranged on a circle taking the shaft of the detection swing arm as the center of a circle and the arm length of the detection swing arm as the radius; the positioning detection correction camera is arranged right above the XY theta correction detection workbench; the positioning detection correction camera, the detection swing arm, the XY theta correction detection workbench and the five-face detection mechanism are respectively connected with a control system of the control part.
The detecting swing arm is characterized in that a suction nozzle is arranged at the tail end of the swing arm and used for sucking the material to be detected.
The pentahedral detection mechanism comprises a pentahedral detection table, a first detection camera, a second detection camera, a third detection camera, a fourth detection camera, a fifth detection camera, a first prism, a second prism, a third prism and a fourth prism which are arranged in the pentahedral detection table; the first prism, the second prism, the third prism and the fourth prism are respectively arranged right in front of, right behind, right left side and right side of the materials to be detected in the five-sided detection table; the first detection camera is arranged on a light path of the reflected light of the material to be detected after being reflected by the first prism, and receives the reflected light of the first prism; the second detection camera is arranged on a light path of the reflected light of the material to be detected after being reflected by the second prism, and receives the reflected light of the second prism; the third detection camera is arranged on a light path of the reflected light of the material to be detected after being reflected by the third prism, and receives the reflected light of the third prism; the fourth detection camera is arranged on a light path of the reflected light of the material to be detected after being reflected by the fourth prism, and receives the reflected light of the fourth prism; a fifth detection camera is arranged right below the five-face detection table; the first detection camera, the second detection camera, the third detection camera, the fourth detection camera and the fifth detection camera are respectively connected with a control system of the control part.
The first prism, the second prism, the third prism and the fourth prism are isosceles right-angle prisms.
The material receiving part comprises a material receiving positioning camera, an XY material receiving workbench and a material receiving positioning camera which are arranged above the XY material receiving workbench, wherein the XY material receiving workbench is divided into a quality product area and a defective product area; and the material receiving positioning camera and the XY material receiving workbench are respectively connected with a control system of the control part.
The working process of the device comprises the following steps: in an initial state, a chip to be detected is placed on an XY material taking workbench. Starting the device, and controlling the XY material taking workbench to move to the origin of coordinates of the material taking swing arm by the control system through processing chip image coordinate data acquired by the material taking positioning camera; the control system controls the material taking swing arm and the suction nozzle at the tail end of the swing arm to finish the pickup of the chip to be tested.
The control system calculates the target positioning of the chip through the positioning detection correction camera and the X-Y-theta correction detection workbench, and controls the material taking swing arm to swing the chip to be detected to the X-Y-theta correction detection workbench; the material taking swing arm is reset, the positioning detection camera collects image data and parameters such as coordinate displacement, deflection and the like on the chip, the control system processes the data, the X-Y-theta correction detection workbench is controlled to conduct coordinate adjustment of an X axis and a Y axis and rotation adjustment of a theta angle, accurate correction of the chip coordinates is completed, and image information on the chip is transmitted to the control system.
The control system controls the detection swing arm to accurately swing the chip from the X-Y-theta correction detection workbench to the position right above the five-face detection mechanism; the original images of the front face, the back face, the left side face and the right side face of the chip in the five-face detection mechanism are reflected to the first detection camera, the second detection camera, the third detection camera and the fourth detection camera corresponding to the original images through the first prism, the second prism, the third prism and the fourth prism in sequence, the four detection cameras collect the image data after optical reflection and transmit the image data to the control system, and the image data under the chip is collected by the fifth detection camera. The control system detects the image data collected by the five-face detection mechanism and judges and marks the genuine or inferior products of the chip.
The control system determines the target coordinates of the inspected chip on the material receiving X-Y workbench through data processing of the qualified products or the unqualified products marked by the inspected chip; the control system calculates and matches the target coordinates of the detected chips through the image data collected by the material receiving positioning camera, and controls the material receiving X-Y workbench to accurately adjust to target positioning and wait for picking and placing of the target chips; the detected chips are accurately sent to a quenching disc or a new film group of a qualified product or a defective product of the X-Y receiving workbench from the five-face detection mechanism by the control detection swing arm, and then the suction nozzle at the tail end of the control swing arm is used for completing the picking and placing of the detected chips, so that the high-speed six-face optical three-dimensional detection of the high-precision semiconductor device is realized.
The beneficial effects are that: the six-face detection device provided by the invention detects the upper surface of the chip on the first detection table, and then five-face detection mechanisms are symmetrically arranged on two sides of the first detection table to detect other five faces, so that the critical angle characteristic of the isosceles prism is utilized to enable the surface condition of the chip to enter the detection camera through the reflection of the isosceles right prism, and six-face high-precision and efficiency detection of the chip is realized.
Drawings
FIG. 1 is a block diagram of a six-sided chip inspection device according to the present invention;
FIG. 2 is a schematic diagram of a five-sided detection mechanism and a detection swing arm symmetrically arranged on two sides of an XY theta correction detection workbench respectively;
FIG. 3 is a block diagram of a five-sided detection mechanism;
In the figure, a material taking swing arm 2, a material taking positioning camera 3, an XY material taking workbench 4, an XY theta correction detection workbench 5, a five-face detection workbench 6, a material receiving detection camera 8, a control system 9, a detection swing arm 10, a positioning detection correction camera 11, a fourth prism 12, a second detection camera 13, a fourth detection camera 14, a fifth detection camera 15, a first detection camera 16, a third detection camera 17, a first prism 18, a third prism 19, a chip to be detected 20, a suction head 21 and a second prism.
Detailed Description
The invention is further illustrated, but not limited, by the following figures and examples.
Examples:
As shown in fig. 1, a six-sided chip detection device comprises a material taking part, a detection part, a control part and a material receiving part; the control part is respectively connected with the material taking part, the detection part and the material receiving part; the detected material is placed in a material receiving part;
the control part is a control system 8.
The material taking part comprises an XY material taking workbench 3, a material taking positioning camera 2 and a material taking swing arm 1, wherein the material taking positioning camera 2 is arranged right above the XY material taking workbench 3; the XY material taking workbench 3, the material taking positioning camera 2 and the material taking swing arm 1 are respectively connected with a control system 8 of the control part.
As shown in fig. 2 and 3, the detection part comprises a positioning detection correction camera 10, 2 detection swing arms 9, an xyθ correction detection workbench 4 and 2 five-face detection mechanisms; the 2 detection swing arms 9 and the 2 five-face detection mechanisms are symmetrically arranged at two sides of the XY theta correction detection workbench 4 respectively; the XY theta correction detection workbench 4 and the pentahedral detection mechanism are respectively arranged on a circle taking the shaft of the detection swing arm 9 as the center of a circle and taking the arm length of the detection swing arm 9 as the radius; the positioning detection correction camera 10 is arranged right above the xyθ correction detection workbench 4; the positioning detection correction camera 10, the detection swing arm 9, the XY theta correction detection workbench 4 and the five-face detection mechanism are respectively connected with a control system 8 of the control part.
The detecting swing arm 9 is provided with a suction nozzle 20 at the tail end to suck the material to be detected.
The pentahedral detection mechanism comprises a pentahedral detection table 5, a first detection camera 15, a second detection camera 12, a third detection camera 16, a fourth detection camera 13, a fifth detection camera 14, a first prism 17, a second prism 21, a third prism 18 and a fourth prism 11 which are arranged in the pentahedral detection table; the first prism 17, the second prism 21, the third prism 18 and the fourth prism 11 are respectively arranged right in front of, right behind, right left side and right side of the materials to be detected in the five-sided detection table 5; the first detection camera 15 is arranged on a light path of the reflected light of the material to be detected after being reflected by the first prism 17, and receives the reflected light of the first prism 17; the second detection camera 12 is arranged on the light path of the reflected light of the material to be detected after being reflected by the second prism 21, and receives the reflected light of the second prism 21; the third detection camera 16 is arranged on the light path of the reflected light of the material to be detected after being reflected by the third prism 18, and receives the reflected light of the third prism 18; the fourth detection camera 13 is arranged on an optical path of the reflected light of the material to be detected after being reflected by the fourth prism 11, and receives the reflected light of the fourth prism 11; directly under the fifth detection camera 14 five-sided detection table 5; the first detection camera 15, the second detection camera 12, the third detection camera 16, the fourth detection camera 13 and the fifth detection camera 14 are respectively connected with the control system 8 of the control part.
The first prism 17, the second prism 21, the third prism 18 and the fourth prism 11 are isosceles right prisms.
The material receiving part comprises a material receiving positioning camera 7, an XY material receiving workbench 6 and a material receiving positioning camera 7 which is arranged above the XY material receiving workbench 6, wherein the XY material receiving workbench 6 is divided into a genuine product area and a defective product area; the material receiving positioning camera 7 and the XY material receiving workbench 6 are respectively connected with a control system 8 of the control part.
The working process of the device comprises the following steps: in an initial state, the chip 19 to be inspected is placed on the XY pick-up table 3. Starting the device, and controlling the XY material taking workbench to move 3 to the origin of coordinates of the material taking swing arm 1 by the control system 8 through processing chip image coordinate data acquired by the material taking positioning camera 2; the control system 8 controls the material taking swing arm 1 and the suction nozzle at the tail end of the swing arm to finish the picking up of the chip to be tested.
The control system 8 calculates the target positioning of the chip through the positioning detection correction camera 10 and the X-Y-theta correction detection workbench 4, and controls the material taking swing arm 1 to swing the chip 19 to be detected to the X-Y-theta correction detection workbench 4; the material taking swing arm 1 is reset, the positioning detection camera 10 collects image data and parameters such as coordinate displacement and deflection on the chip, the control system 8 processes the data, the X-Y-theta correction detection workbench 4 is controlled to conduct X-axis and Y-axis coordinate adjustment and theta angle rotation adjustment, accurate correction of the chip coordinates is completed, and image information on the chip is transmitted to the control system 8.
The control system 8 controls the detection swing arm 9 to accurately swing the chip from the X-Y-theta correction detection workbench 4 to the position right above the five-face detection mechanism; the original images of the front, the back, the left side and the right side of the chip in the five-face detection mechanism are reflected to the first detection camera 15, the second detection camera 12, the third detection camera 16 and the fourth detection camera 13 corresponding to the original images sequentially through the first prism 17, the second prism 21, the third prism 18 and the fourth prism 11, the four detection cameras collect the image data after optical reflection and transmit the image data to the control system 8, and the image data under the chip is collected by the fifth detection camera 14. The control system 8 detects the image data collected by the five-face detection mechanism and judges and identifies the genuine or inferior products of the chip.
The control system 8 determines the target coordinates of the inspected chip on the material receiving X-Y workbench 6 through data processing of the quality products or the defective products marked by the inspected chip; the control system 8 calculates and matches the target coordinates of the detected chips through the image data acquired by the receiving positioning camera 7, and controls the receiving X-Y workbench 6 to accurately adjust to target positioning and wait for picking and placing the target chips; the detected chips are accurately sent to a quenching disc or a new film group of a genuine product or a defective product of the X-Y receiving workbench 6 from the five-face detection mechanism by the control detection swing arm 9, and then pick-up and placement of the detected chips are completed by controlling a suction nozzle at the tail end of the swing arm, so that high-speed six-face optical three-dimensional detection of the high-precision semiconductor device is realized.
Claims (4)
1. A six-face detection chip detection device is characterized in that,
Comprises a material taking part, a detection part, a control part and a material receiving part; the control part is respectively connected with the material taking part, the detection part and the material receiving part; the detected material is placed in a material receiving part;
the control part is a control system;
The material taking part comprises an XY material taking workbench, a material taking positioning camera and a material taking swing arm, wherein the material taking positioning camera is arranged right above the XY material taking workbench; the XY material taking workbench, the material taking positioning camera and the material taking swing arm are respectively connected with a control system of the control part;
The detection part comprises a positioning detection correction camera, 2 detection swing arms, an XY theta correction detection workbench and 2 five-face detection mechanisms; the 2 detection swing arms and the 2 pentahedral detection mechanisms are symmetrically arranged on two sides of the XY theta correction detection workbench respectively; the XY theta correction detection workbench and the pentahedral detection mechanism are respectively arranged on a circle taking the shaft of the detection swing arm as the center of a circle and the arm length of the detection swing arm as the radius; the positioning detection correction camera is arranged right above the XY theta correction detection workbench; the positioning detection correction camera, the detection swing arm, the XY theta correction detection workbench and the five-face detection mechanism are respectively connected with a control system of the control part;
the material receiving part comprises a material receiving positioning camera, an XY material receiving workbench and a material receiving positioning camera which are arranged above the XY material receiving workbench, wherein the XY material receiving workbench is divided into a quality product area and a defective product area; and the material receiving positioning camera and the XY material receiving workbench are respectively connected with a control system of the control part.
2. The six-sided chip inspection device according to claim 1, wherein,
The detecting swing arm is characterized in that a suction nozzle is arranged at the tail end of the swing arm and used for sucking the material to be detected.
3. The six-sided chip inspection device according to claim 1, wherein,
The pentahedral detection mechanism comprises a pentahedral detection table, a first detection camera, a second detection camera, a third detection camera, a fourth detection camera, a fifth detection camera, a first prism, a second prism, a third prism and a fourth prism which are arranged in the pentahedral detection table; the first prism, the second prism, the third prism and the fourth prism are respectively arranged right in front of, right behind, right left side and right side of the materials to be detected in the five-sided detection table; the first detection camera is arranged on a light path of the reflected light of the material to be detected after being reflected by the first prism, and receives the reflected light of the first prism;
The second detection camera is arranged on a light path of the reflected light of the material to be detected after being reflected by the second prism, and receives the reflected light of the second prism;
The third detection camera is arranged on a light path of the reflected light of the material to be detected after being reflected by the third prism, and receives the reflected light of the third prism; the fourth detection camera is arranged on a light path of the reflected light of the material to be detected after being reflected by the fourth prism, and receives the reflected light of the fourth prism;
A fifth detection camera is arranged right below the five-face detection table; the first detection camera, the second detection camera, the third detection camera, the fourth detection camera and the fifth detection camera are respectively connected with a control system of the control part.
4. A six-sided chip inspection device according to claim 3, wherein,
The first prism, the second prism, the third prism and the fourth prism are isosceles right-angle prisms.
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| CN109513638A (en) * | 2018-12-21 | 2019-03-26 | 珠海达明科技有限公司 | A kind of comprehensive AOI detection device of high efficiency chip appearance |
| CN112595498B (en) * | 2021-03-04 | 2021-06-18 | 武汉人和睿视科技有限公司 | Optical property detection system for light emission of laser bars and single tubes of laser bars |
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