NO943626L - Fjerning av overflateforurensninger ved bestråling - Google Patents
Fjerning av overflateforurensninger ved bestrålingInfo
- Publication number
- NO943626L NO943626L NO943626A NO943626A NO943626L NO 943626 L NO943626 L NO 943626L NO 943626 A NO943626 A NO 943626A NO 943626 A NO943626 A NO 943626A NO 943626 L NO943626 L NO 943626L
- Authority
- NO
- Norway
- Prior art keywords
- surface contaminants
- irradiation
- removal
- substrate
- energy irradiation
- Prior art date
Links
- 239000000356 contaminant Substances 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 239000013078 crystal Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
- B23K26/1436—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means for pressure control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
- B23K26/1437—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means for flow rate control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32051—Deposition of metallic or metal-silicide layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76819—Smoothing of the dielectric
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- High Energy & Nuclear Physics (AREA)
- Fluid Mechanics (AREA)
- Electromagnetism (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Drying Of Semiconductors (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Road Signs Or Road Markings (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86503992A | 1992-03-31 | 1992-03-31 | |
PCT/US1993/002734 WO1993019888A1 (en) | 1992-03-31 | 1993-03-24 | Removal of surface contaminants by irradiation |
Publications (2)
Publication Number | Publication Date |
---|---|
NO943626D0 NO943626D0 (no) | 1994-09-29 |
NO943626L true NO943626L (no) | 1994-09-29 |
Family
ID=25344584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO943626A NO943626L (no) | 1992-03-31 | 1994-09-29 | Fjerning av overflateforurensninger ved bestråling |
Country Status (17)
Country | Link |
---|---|
EP (1) | EP0633823B1 (fi) |
JP (1) | JPH07505577A (fi) |
KR (1) | KR100221421B1 (fi) |
CN (1) | CN1078415A (fi) |
AT (1) | ATE180703T1 (fi) |
AU (1) | AU673519B2 (fi) |
BR (1) | BR9306174A (fi) |
CA (1) | CA2132332C (fi) |
CZ (1) | CZ238294A3 (fi) |
DE (1) | DE69325171D1 (fi) |
FI (1) | FI944526A (fi) |
MX (1) | MX9301773A (fi) |
NO (1) | NO943626L (fi) |
RU (1) | RU2114486C1 (fi) |
SG (1) | SG42890A1 (fi) |
TW (1) | TW367527B (fi) |
WO (1) | WO1993019888A1 (fi) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2714464B1 (fr) * | 1993-12-23 | 1996-02-09 | Cogema | Procédé de contrôle de la contamination surfacique d'un solide et dispositif de mise en Óoeuvre. |
IL115933A0 (en) | 1995-11-09 | 1996-01-31 | Oramir Semiconductor Ltd | Process and apparatus for oblique beam revolution for the effective laser stripping of sidewalls |
IL115934A0 (en) * | 1995-11-09 | 1996-01-31 | Oramir Semiconductor Ltd | Laser processing chamber with cassette cell |
IL115931A0 (en) | 1995-11-09 | 1996-01-31 | Oramir Semiconductor Ltd | Laser stripping improvement by modified gas composition |
NL1002598C2 (nl) * | 1996-03-13 | 1997-09-17 | Bootsman Holding Bv | Werkwijze en inrichting voor het bewerken van substraat. |
US5800625A (en) * | 1996-07-26 | 1998-09-01 | Cauldron Limited Partnership | Removal of material by radiation applied at an oblique angle |
JP2002503551A (ja) * | 1998-02-20 | 2002-02-05 | ザ・グッドイヤー・タイヤ・アンド・ラバー・カンパニー | ロボット式レーザタイヤ金型清浄システムおよび使用方法 |
US6369353B1 (en) | 1998-02-20 | 2002-04-09 | The Goodyear Tire & Rubber Company | Robotic laser tire mold cleaning system and method of use |
FR2777810B1 (fr) | 1998-04-28 | 2000-05-19 | Air Liquide | Procede et dispositif de traitement de la surface interne d'une bouteille de gaz |
TWI426964B (zh) * | 2008-09-17 | 2014-02-21 | Hitachi High Tech Corp | Organic EL mask cleaning device, organic EL display manufacturing device, organic EL display and organic EL mask cleaning method |
KR101135499B1 (ko) * | 2010-05-28 | 2012-04-13 | 삼성에스디아이 주식회사 | 전지용 전극 탭의 레이저 세정 장치 및 이를 이용한 레이저 세정 방법 |
RU2538161C2 (ru) * | 2012-12-28 | 2015-01-10 | федеральное государственное автономное образовательное учреждение высшего образования "Санкт-Петербургский национальный исследовательский университет информационных технологий, механики и оптики" | Способ лазерной очистки поверхности |
US11135625B2 (en) * | 2014-12-30 | 2021-10-05 | Koninklijke Philips N.V. | System for anti-biofouling |
JP6382901B2 (ja) | 2016-09-29 | 2018-08-29 | ファナック株式会社 | レーザー加工システム |
US10416575B2 (en) * | 2016-11-16 | 2019-09-17 | Suss Microtec Photomask Equipment Gmbh & Co. Kg | Apparatus and method for cleaning a partial area of a substrate |
RU2739195C1 (ru) * | 2020-04-07 | 2020-12-21 | Общество С Ограниченной Ответственностью "Нтц Тонкопленочных Технологий В Энергетике" | Вакуумная напылительная установка с системой лазерной очистки паллет (варианты) |
CN113020129A (zh) * | 2021-02-26 | 2021-06-25 | 苏州大学 | 一种复合激光清洗光头及复合式激光清洗方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5776846A (en) * | 1980-10-31 | 1982-05-14 | Fujitsu Ltd | Surface treating method for semiconductor |
JPS57102229A (en) * | 1980-12-17 | 1982-06-25 | Matsushita Electric Ind Co Ltd | Substrate processing method |
US4568632A (en) * | 1982-10-07 | 1986-02-04 | International Business Machines Corporation | Patterning of polyimide films with far ultraviolet light |
JPS6037736A (ja) * | 1983-08-11 | 1985-02-27 | Toshiba Corp | 表面清浄方法 |
JPS60129136A (ja) * | 1983-12-15 | 1985-07-10 | Toshiba Corp | 紫外線照射装置 |
JPS61147988A (ja) * | 1984-12-19 | 1986-07-05 | Toshiba Corp | レ−ザ加工装置 |
US4668304A (en) * | 1985-04-10 | 1987-05-26 | Eaton Corporation | Dopant gettering semiconductor processing by excimer laser |
JPS6285433A (ja) * | 1985-10-09 | 1987-04-18 | Sumitomo Electric Ind Ltd | 研摩装置 |
DE3767890D1 (de) * | 1986-02-14 | 1991-03-14 | Amoco Corp | Behandlung von geformten oberflaechen mit ultraviolettlaser. |
DE3787440T2 (de) * | 1986-11-20 | 1994-01-13 | Nippon Electric Co | Verfahren und Vorrichtung um eine Linie auf einem strukturierten Substrat zu schreiben. |
JPS63178845A (ja) * | 1987-01-20 | 1988-07-22 | Mitsubishi Heavy Ind Ltd | 付着物除去装置 |
DE3721940A1 (de) * | 1987-07-02 | 1989-01-12 | Ibm Deutschland | Entfernen von partikeln von oberflaechen fester koerper durch laserbeschuss |
DE3904969A1 (de) * | 1988-02-24 | 1989-09-21 | Schmidt Ott Andreas Dr | Verfahren zur beseitigung von staubpartikeln von oberflaechen in gasfoermiger umgebung |
US5099557A (en) * | 1988-07-08 | 1992-03-31 | Engelsberg Audrey C | Removal of surface contaminants by irradiation from a high-energy source |
US5024968A (en) * | 1988-07-08 | 1991-06-18 | Engelsberg Audrey C | Removal of surface contaminants by irradiation from a high-energy source |
FR2641718B1 (fr) * | 1989-01-17 | 1992-03-20 | Ardt | Procede de nettoyage de la surface de matieres solides et dispositif de mise en oeuvre de ce procede, utilisant un laser impulsionnel de puissance, a impulsions courtes, dont on focalise le faisceau sur la surface a nettoyer |
US4920994A (en) * | 1989-09-12 | 1990-05-01 | The United States Of America As Represented By The United States Department Of Energy | Laser removal of sludge from steam generators |
US5151135A (en) * | 1989-09-15 | 1992-09-29 | Amoco Corporation | Method for cleaning surfaces using UV lasers |
US4979180A (en) * | 1989-11-24 | 1990-12-18 | Muncheryan Arthur M | Modular interchangeable laser system |
JPH04157088A (ja) * | 1990-10-17 | 1992-05-29 | Fujitsu Ltd | レーザ加工装置 |
-
1993
- 1993-03-24 SG SG1996000451A patent/SG42890A1/en unknown
- 1993-03-24 AT AT93908539T patent/ATE180703T1/de not_active IP Right Cessation
- 1993-03-24 RU RU94042468A patent/RU2114486C1/ru active
- 1993-03-24 AU AU39325/93A patent/AU673519B2/en not_active Ceased
- 1993-03-24 KR KR1019940703422A patent/KR100221421B1/ko not_active IP Right Cessation
- 1993-03-24 WO PCT/US1993/002734 patent/WO1993019888A1/en not_active Application Discontinuation
- 1993-03-24 BR BR9306174A patent/BR9306174A/pt unknown
- 1993-03-24 EP EP93908539A patent/EP0633823B1/en not_active Expired - Lifetime
- 1993-03-24 DE DE69325171T patent/DE69325171D1/de not_active Expired - Lifetime
- 1993-03-24 JP JP5517537A patent/JPH07505577A/ja active Pending
- 1993-03-24 CZ CZ942382A patent/CZ238294A3/cs unknown
- 1993-03-24 CA CA002132332A patent/CA2132332C/en not_active Expired - Fee Related
- 1993-03-27 TW TW085105586A patent/TW367527B/zh active
- 1993-03-30 MX MX9301773A patent/MX9301773A/es unknown
- 1993-03-30 CN CN 93104564 patent/CN1078415A/zh active Pending
-
1994
- 1994-09-29 FI FI944526A patent/FI944526A/fi unknown
- 1994-09-29 NO NO943626A patent/NO943626L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
ATE180703T1 (de) | 1999-06-15 |
SG42890A1 (en) | 1997-10-17 |
KR100221421B1 (ko) | 1999-09-15 |
CA2132332C (en) | 1999-03-30 |
AU3932593A (en) | 1993-11-08 |
FI944526A0 (fi) | 1994-09-29 |
NO943626D0 (no) | 1994-09-29 |
RU2114486C1 (ru) | 1998-06-27 |
TW367527B (en) | 1999-08-21 |
CA2132332A1 (en) | 1993-10-01 |
RU94042468A (ru) | 1997-03-10 |
AU673519B2 (en) | 1996-11-14 |
CN1078415A (zh) | 1993-11-17 |
CZ238294A3 (en) | 1996-02-14 |
DE69325171D1 (de) | 1999-07-08 |
MX9301773A (es) | 1994-02-28 |
EP0633823A1 (en) | 1995-01-18 |
FI944526A (fi) | 1994-09-29 |
BR9306174A (pt) | 1998-01-13 |
JPH07505577A (ja) | 1995-06-22 |
EP0633823B1 (en) | 1999-06-02 |
EP0633823A4 (en) | 1995-02-15 |
WO1993019888A1 (en) | 1993-10-14 |
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