NO20034827L - Bearbeidingshjelpemiddel og fremgangsmåte for bearbeiding av polymerer - Google Patents

Bearbeidingshjelpemiddel og fremgangsmåte for bearbeiding av polymerer

Info

Publication number
NO20034827L
NO20034827L NO20034827A NO20034827A NO20034827L NO 20034827 L NO20034827 L NO 20034827L NO 20034827 A NO20034827 A NO 20034827A NO 20034827 A NO20034827 A NO 20034827A NO 20034827 L NO20034827 L NO 20034827L
Authority
NO
Norway
Prior art keywords
processing
polymer
aid
processing aid
polymer processing
Prior art date
Application number
NO20034827A
Other languages
English (en)
Other versions
NO20034827D0 (no
Inventor
Eugene A Pruss
Thomas M Clere
Stuart K Randa
Original Assignee
Saint Gobain Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Corp filed Critical Saint Gobain Corp
Publication of NO20034827D0 publication Critical patent/NO20034827D0/no
Publication of NO20034827L publication Critical patent/NO20034827L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/0066—Use of inorganic compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/06—Polymer mixtures characterised by other features having improved processability or containing aids for moulding methods
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
NO20034827A 2001-04-30 2003-10-29 Bearbeidingshjelpemiddel og fremgangsmåte for bearbeiding av polymerer NO20034827L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28745201P 2001-04-30 2001-04-30
PCT/US2002/013540 WO2002088234A1 (en) 2001-04-30 2002-04-30 Polymer processing aid and method for processing polymers

Publications (2)

Publication Number Publication Date
NO20034827D0 NO20034827D0 (no) 2003-10-29
NO20034827L true NO20034827L (no) 2003-12-19

Family

ID=23102975

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20034827A NO20034827L (no) 2001-04-30 2003-10-29 Bearbeidingshjelpemiddel og fremgangsmåte for bearbeiding av polymerer

Country Status (7)

Country Link
US (1) US7662324B2 (no)
EP (1) EP1397421B1 (no)
JP (2) JP2004525242A (no)
CN (1) CN100398589C (no)
CA (1) CA2445555C (no)
NO (1) NO20034827L (no)
WO (1) WO2002088234A1 (no)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6645612B2 (en) 2001-08-07 2003-11-11 Saint-Gobain Ceramics & Plastics, Inc. High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them
JP4805768B2 (ja) * 2006-09-13 2011-11-02 日本アビオニクス株式会社 熱硬化性樹脂の保管方法
US20080139718A1 (en) * 2006-12-11 2008-06-12 Wouter Reyntjens Polymer additive compositions and methods
WO2013090172A1 (en) 2011-12-16 2013-06-20 Ticona Llc Method for low temperature injection molding of polyarylene sulfide compositions and injection molded part obtained thereby
WO2013090171A1 (en) 2011-12-16 2013-06-20 Ticona Llc Nucleating system for polyarylene sulfide compositions
US8852487B2 (en) 2011-12-16 2014-10-07 Ticona Llc Injection molding of polyarylene sulfide compositions
KR102064024B1 (ko) 2011-12-16 2020-01-08 티코나 엘엘씨 폴리페닐렌 설파이드용 붕소-함유 핵 형성제
EP2897995B1 (en) * 2012-09-19 2019-03-20 Momentive Performance Materials Inc. Masterbatch comprising boron nitride, composite powders thereof, and compositions and articles comprising such materials
KR101520343B1 (ko) * 2014-10-16 2015-05-19 주식회사 한나노텍 가공조제 및 가공조제용 마스터배치
CN205710549U (zh) * 2014-11-12 2016-11-23 美铝公司 弹药枪弹
JP2016027166A (ja) * 2015-09-10 2016-02-18 エコピューロ・エルエルシー 充填剤で補強された構造的に強化されたプラスチック
CA3020188C (en) * 2016-03-28 2023-06-27 Dow Global Technologies Llc Process for foaming polyolefin compositions using a fluororesin/boron nitride mixture as a nucleating agent
CN108794867B (zh) * 2017-04-28 2021-02-12 中国石油化工股份有限公司 聚乙烯薄膜用母料、吹膜用聚乙烯组合物及其制备方法
GB2585635B (en) * 2019-05-28 2022-03-23 Kafrit Ind 1993 Ltd Compositions and methods for use in the preparation of hydrophobic surfaces

Family Cites Families (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2991508A (en) 1959-09-23 1961-07-11 Du Pont Fabrication of thermoplastic resins
US3125547A (en) 1961-02-09 1964-03-17 Extrudable composition consisting of
US3351690A (en) 1962-04-18 1967-11-07 Gen Electric Heat treating pyrolytic graphite and boron nitride bodies with simultaneous application of multiaxial tension
US4188194A (en) 1976-10-29 1980-02-12 General Electric Company Direct conversion process for making cubic boron nitride from pyrolytic boron nitride
JPS5891005A (ja) 1981-11-25 1983-05-30 Toshiba Corp 窒化ケイ素粉末の製造方法
JPS61268763A (ja) 1984-11-26 1986-11-28 Shiseido Co Ltd 処理粉体の製造方法
US5332629A (en) 1985-01-11 1994-07-26 Sumitomo Electric Industries, Ltd. Boron nitride system including an hBN starting material with a catalyst and a sintered cNB body having a high heat conductivity based on the catalyst
US4801445A (en) 1985-07-29 1989-01-31 Shiseido Company Ltd. Cosmetic compositions containing modified powder or particulate material
EP0212870B1 (en) 1985-07-29 1992-04-15 Shiseido Company Limited Silicone polymer-coated powder or particulate material
CA1306904C (en) 1985-10-09 1992-09-01 Tetsumi Suzuki Electrically conductive material and secondary battery using the electrically conductive material
US4849284A (en) 1987-02-17 1989-07-18 Rogers Corporation Electrical substrate material
JP2590908B2 (ja) 1987-08-03 1997-03-19 松下電工株式会社 エポキシ樹脂成形材料
US4869954A (en) 1987-09-10 1989-09-26 Chomerics, Inc. Thermally conductive materials
JP2590964B2 (ja) 1987-11-11 1997-03-19 ミノルタ株式会社 画像形成方法
JPH01160215A (ja) 1987-12-17 1989-06-23 Fujitsu Ltd Ｉｆ局部発振器
JPH01221454A (ja) 1988-02-29 1989-09-04 Shin Etsu Chem Co Ltd 押出成形用シリコーンゴム組成物
JP2655581B2 (ja) 1988-07-26 1997-09-24 コクヨ株式会社 引出し装置
US4863881A (en) 1988-09-15 1989-09-05 California Institute Of Technology Shock consolidation of cubic boron nitride with whiskers of silicon compounds
JPH02164433A (ja) 1988-12-19 1990-06-25 Denki Kagaku Kogyo Kk 多結晶型立方晶窒化ほう素粒子の製造方法
JPH069730B2 (ja) 1989-01-13 1994-02-09 花野商事株式会社 ダイカスト用粉末離型剤
US5011870A (en) 1989-02-08 1991-04-30 Dow Corning Corporation Thermally conductive organosiloxane compositions
FR2655638A1 (fr) 1989-12-08 1991-06-14 Rhone Poulenc Chimie Nitrure de bore hexagonal monodisperse de haute purete vis-a-vis des metaux et de l'oxygene et son procede de preparation.
US5116589A (en) 1990-06-18 1992-05-26 The United States Of America As Represented By The United States Department Of Energy High density hexagonal boron nitride prepared by hot isostatic pressing in refractory metal containers
US5118496A (en) 1990-10-02 1992-06-02 Morris Herstein Coated cosmetic materials and method of coating cosmetic materials
JP2981002B2 (ja) 1991-04-23 1999-11-22 松下電工株式会社 窒化アルミニウム粉末
US5194480A (en) 1991-05-24 1993-03-16 W. R. Grace & Co.-Conn. Thermally conductive elastomer
US5285108A (en) 1991-06-21 1994-02-08 Compaq Computer Corporation Cooling system for integrated circuits
US5213868A (en) 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
JP2925402B2 (ja) 1991-09-11 1999-07-28 三菱電機株式会社 高熱伝導性低収縮湿式不飽和ポリエステル系樹脂組成物を成形してなる筐体を有する回路遮断器
US5234712A (en) 1992-06-08 1993-08-10 The Dow Chemical Company Method of making moisture resistant aluminum nitride powder and powder produced thereby
GB9222548D0 (en) 1992-10-27 1992-12-09 Foseco Int Metallurgical pouring vessels
US5985228A (en) 1992-12-22 1999-11-16 General Electric Company Method for controlling the particle size distribution in the production of multicrystalline cubic boron nitride
US5510174A (en) 1993-07-14 1996-04-23 Chomerics, Inc. Thermally conductive materials containing titanium diboride filler
JPH07157369A (ja) 1993-12-10 1995-06-20 Hitachi Ltd セラミックス造粒粉
US5545473A (en) 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US5591034A (en) 1994-02-14 1997-01-07 W. L. Gore & Associates, Inc. Thermally conductive adhesive interface
IT1269816B (it) * 1994-05-23 1997-04-15 Ausimont Spa Composizioni solide espandibili a base di perfluoropolimeri e processoper la loro preparazione
US5528462A (en) 1994-06-29 1996-06-18 Pendse; Rajendra D. Direct chip connection using demountable flip chip package
FR2725129B1 (fr) 1994-09-30 1997-06-13 Oreal Composition cosmetique anhydre resistante a l'eau
US5601874A (en) 1994-12-08 1997-02-11 The Dow Chemical Company Method of making moisture resistant aluminum nitride powder and powder produced thereby
CN1180363A (zh) * 1995-02-13 1998-04-29 雷伊化学公司 含氟聚合物的组合物
US5770819A (en) 1995-02-13 1998-06-23 Raychem Corporation Insulated wire or cable having foamed fluoropolymer insulation
US5614319A (en) 1995-05-04 1997-03-25 Commscope, Inc. Insulating composition, insulated plenum cable and methods for making same
US5688449A (en) 1995-10-02 1997-11-18 Nitech Corporation Method of forming and extruding an additive-coated resin composition
US5962122A (en) 1995-11-28 1999-10-05 Hoechst Celanese Corporation Liquid crystalline polymer composites having high dielectric constant
JPH09151324A (ja) 1995-11-30 1997-06-10 Fuji Kobunshi Kogyo Kk 難燃性・高熱伝導性シリコーンゴム組成物
JP3461651B2 (ja) 1996-01-24 2003-10-27 電気化学工業株式会社 六方晶窒化ほう素粉末及びその用途
US5681883A (en) 1996-03-05 1997-10-28 Advanced Ceramics Corporation Enhanced boron nitride composition and polymer based high thermal conductivity molding compound
US5898009A (en) 1996-03-19 1999-04-27 Advanced Ceramics Corporation High density agglomerated boron nitride particles
US5688457A (en) 1996-04-10 1997-11-18 E. I. Du Pont De Nemours And Company High speed extrusion
US5610203A (en) 1996-04-10 1997-03-11 E. I. Du Pont De Nemours And Company Foamable fluoropolymer composition
US5726502A (en) 1996-04-26 1998-03-10 Motorola, Inc. Bumped semiconductor device with alignment features and method for making the same
US5950066A (en) 1996-06-14 1999-09-07 The Bergquist Company Semisolid thermal interface with low flow resistance
US5738936A (en) 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
WO1998005590A1 (fr) 1996-08-06 1998-02-12 Otsuka Kagaku Kabushiki Kaisha Nitrure de bore et son procede de preparation
JP3142800B2 (ja) 1996-08-09 2001-03-07 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性材料及び熱伝導性シリコーングリース
US5783308A (en) 1996-10-25 1998-07-21 Quaker State Corporation Ceramic reinforced fluoropolymer
JPH10194711A (ja) 1997-01-13 1998-07-28 Shin Etsu Chem Co Ltd 高充填性窒化ホウ素粉末及びその製造方法
JP3714502B2 (ja) 1997-01-24 2005-11-09 三井化学株式会社 高熱伝導性樹脂組成物
KR20000064867A (ko) 1997-02-07 2000-11-06 아이. 데이비드 크로산 전도성，수지-기재 조성물
US5907474A (en) 1997-04-25 1999-05-25 Advanced Micro Devices, Inc. Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package
US5926371A (en) 1997-04-25 1999-07-20 Advanced Micro Devices, Inc. Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device
JP3714506B2 (ja) 1997-06-17 2005-11-09 三井化学株式会社 優れた耐水性を有する高熱伝導性樹脂組成物
JP3195277B2 (ja) 1997-08-06 2001-08-06 信越化学工業株式会社 熱伝導性シリコーン組成物
US6124579A (en) 1997-10-06 2000-09-26 Watlow Electric Manufacturing Molded polymer composite heater
US5945217A (en) 1997-10-14 1999-08-31 Gore Enterprise Holdings, Inc. Thermally conductive polytrafluoroethylene article
JPH11116213A (ja) 1997-10-15 1999-04-27 Toshiba Ceramics Co Ltd シラノール基含有ポリオルガノシロキサン被膜でコーティングされた窒化アルミニウム粉末およびその製造方法
US6251513B1 (en) 1997-11-08 2001-06-26 Littlefuse, Inc. Polymer composites for overvoltage protection
US5984055A (en) 1997-11-21 1999-11-16 Northrop Grumman Corporation Integrated fiber reinforced ceramic matrix composite brake pad and back plate
US5898217A (en) 1998-01-05 1999-04-27 Motorola, Inc. Semiconductor device including a substrate having clustered interconnects
JP3290127B2 (ja) 1998-01-27 2002-06-10 松下電工株式会社 熱伝導性シリコーンゴム組成物及びこの熱伝導性シリコーンゴム組成物によりなる放熱シート
US6168859B1 (en) 1998-01-29 2001-01-02 The Dow Chemical Company Filler powder comprising a partially coated alumina powder and process to make the filler powder
DE69807040T2 (de) 1998-02-16 2003-05-08 Advanced Ceramics Corp., Cleveland Verfahren zur Bildung von Bornitrid hoher Dichte und agglomerierte Bornitridteilchen hoher Dichte
US6136758A (en) 1998-08-17 2000-10-24 Shin-Etsu Chemical Co., Ltd. Aluminum nitride powder and thermally conductive grease composition using the same
JP3287328B2 (ja) 1999-03-09 2002-06-04 日本電気株式会社 半導体装置及び半導体装置の製造方法
JP3461758B2 (ja) * 1999-07-19 2003-10-27 三菱電線工業株式会社 発泡用組成物および発泡同軸絶縁ケーブル
PT1218205E (pt) 1999-08-27 2004-05-31 Heineken Tech Services Etiqueta de transferencia
US6713088B2 (en) 1999-08-31 2004-03-30 General Electric Company Low viscosity filler composition of boron nitride particles of spherical geometry and process
CA2311178A1 (en) * 1999-12-22 2001-06-22 Evgueni E. Rozenbaoum Extrusion aid combination
US6585039B2 (en) 2000-02-01 2003-07-01 Cool Options, Inc. Composite overmolded heat pipe construction
US6660241B2 (en) 2000-05-01 2003-12-09 Saint-Gobain Ceramics & Plastics, Inc. Highly delaminated hexagonal boron nitride powders, process for making, and uses thereof
US6794435B2 (en) 2000-05-18 2004-09-21 Saint Gobain Ceramics & Plastics, Inc. Agglomerated hexagonal boron nitride powders, method of making, and uses thereof
US6764975B1 (en) 2000-11-28 2004-07-20 Saint-Gobain Ceramics & Plastics, Inc. Method for making high thermal diffusivity boron nitride powders
US6645612B2 (en) 2001-08-07 2003-11-11 Saint-Gobain Ceramics & Plastics, Inc. High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them
KR100493021B1 (ko) 2002-07-10 2005-06-07 삼성전자주식회사 반도체 메모리 장치 및 그의 제조방법

Also Published As

Publication number Publication date
JP2004525242A (ja) 2004-08-19
CN1575314A (zh) 2005-02-02
US7662324B2 (en) 2010-02-16
US20040220288A1 (en) 2004-11-04
EP1397421A1 (en) 2004-03-17
JP2009035742A (ja) 2009-02-19
CA2445555C (en) 2010-11-23
NO20034827D0 (no) 2003-10-29
EP1397421A4 (en) 2004-09-15
EP1397421B1 (en) 2019-09-04
CA2445555A1 (en) 2002-11-07
CN100398589C (zh) 2008-07-02
WO2002088234A1 (en) 2002-11-07
JP5006295B2 (ja) 2012-08-22

Similar Documents

Publication Publication Date Title
DE60221728D1 (de) Informationsverarbeitungsgerät und -vorrichtung
NO20033086D0 (no) Lineor blokk-kopolymer og fremgangsmate for fremstilling av samme
DE60234492D1 (de) Bildverarbeitungsverfahren und -vorrichtung
DE60229338D1 (de) Bildverarbeitungsverfahren und -gerät
DE60209454D1 (de) Bildbearbeitungsvorrichtung und -verfahren
DE60141186D1 (de) Substratverarbeitungsvorrichtung
NO20016314D0 (no) Blandinger og fremgangsmåte for oljefeltapplikasjoner
DE60229591D1 (de) Trägerplattenvorrichtung
DE60324067D1 (de) Informationsverarbeitungsgerät und -vorrichtung
NO20021929L (no) Fremgangsmåte og anordning for brönnkomplettering
DE60239627D1 (de) Signalverarbeitungsverfahren und prozessor
DE60134299D1 (de) Geldscheinverarbeitungs-Apparat und -Verfahren
DK1322597T3 (da) Fremgangsmåde og intermediære
NO20034827L (no) Bearbeidingshjelpemiddel og fremgangsmåte for bearbeiding av polymerer
DE60114515D1 (de) Signalverarbeitungsvorrichtung und -verfahren
DE60231025D1 (de) Datenverarbeitungsgerät und -verfahren
NO20014809L (no) Kjemisk fremgangsmåte og produkt
NO20042692L (no) Sementakselerator og fremgangsmate
DE60207785D1 (de) Bildverarbeitungsvorrichtung und -verfahren
DE50208693D1 (de) Signalverarbeitungsverfahren und Vorrichtung
NO20040576L (no) Anordning og fremgangsmate for bearbeidelse av organisk materiale.
DE60143327D1 (de) Sprachdatenverarbeitungsvorrichtung und -verarbeitungsverfahren
DE60218267D1 (de) Wiedergabeverfahren und Vorrichtung
NO20014376D0 (no) Anordning, fremgangsmåte og anvendelse
GB0101062D0 (en) Signal processing method and apparatus

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application