NO20002323D0 - Electrically conductive filler for conductive plastic materials - Google Patents

Electrically conductive filler for conductive plastic materials

Info

Publication number
NO20002323D0
NO20002323D0 NO20002323A NO20002323A NO20002323D0 NO 20002323 D0 NO20002323 D0 NO 20002323D0 NO 20002323 A NO20002323 A NO 20002323A NO 20002323 A NO20002323 A NO 20002323A NO 20002323 D0 NO20002323 D0 NO 20002323D0
Authority
NO
Norway
Prior art keywords
plastic materials
electrically conductive
conductive
filler
conductive filler
Prior art date
Application number
NO20002323A
Other languages
Norwegian (no)
Other versions
NO312902B1 (en
NO20002323L (en
Inventor
Helmut Kahl
Bernd Tiburtius
Helmut Wegener
Original Assignee
Helmut Kahl
Bernd Tiburtius
Helmut Wegener
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Helmut Kahl, Bernd Tiburtius, Helmut Wegener filed Critical Helmut Kahl
Publication of NO20002323D0 publication Critical patent/NO20002323D0/en
Publication of NO20002323L publication Critical patent/NO20002323L/en
Publication of NO312902B1 publication Critical patent/NO312902B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/223—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating specially adapted for coating particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Conductive Materials (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Physical Vapour Deposition (AREA)
NO20002323A 1997-11-03 2000-05-02 Electrically conductive filler for conductive plastic materials NO312902B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19749956 1997-11-03
PCT/DE1998/003267 WO1999023152A1 (en) 1997-11-03 1998-11-03 Electrically conductive filler and method for the production thereof

Publications (3)

Publication Number Publication Date
NO20002323D0 true NO20002323D0 (en) 2000-05-02
NO20002323L NO20002323L (en) 2000-06-20
NO312902B1 NO312902B1 (en) 2002-07-15

Family

ID=7848379

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20002323A NO312902B1 (en) 1997-11-03 2000-05-02 Electrically conductive filler for conductive plastic materials

Country Status (13)

Country Link
EP (1) EP1030880A1 (en)
JP (1) JP2001521964A (en)
KR (1) KR100421334B1 (en)
CN (1) CN1283213A (en)
AU (1) AU730445B2 (en)
CA (1) CA2309074A1 (en)
DE (1) DE19881647D2 (en)
HU (1) HUP0004285A3 (en)
IL (1) IL135862A0 (en)
NO (1) NO312902B1 (en)
RU (1) RU2199556C2 (en)
TR (1) TR200001006T2 (en)
WO (1) WO1999023152A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001522896A (en) * 1997-11-03 2001-11-20 カール ヘルムート Plastic material
BR112016002368A2 (en) 2013-09-24 2017-08-01 Henkel IP & Holding GmbH pyrolyzed organic conductive prepreg layers produced with these layers
CN104448562A (en) * 2014-12-04 2015-03-25 苏州润佳工程塑料股份有限公司 Coated conductive powder and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096548A (en) * 1983-10-31 1985-05-30 Nippon Chem Ind Co Ltd:The Electrically conductive material
US4621024A (en) * 1984-12-31 1986-11-04 Paper Applications International, Inc. Metal-coated hollow microspheres
JP3042101B2 (en) * 1991-11-22 2000-05-15 ジェイエスアール株式会社 Method for producing composite particles and hollow particles
DE4405156C1 (en) * 1994-02-18 1995-10-26 Univ Karlsruhe Process for the production of coated polymeric microparticles
DE19518942C2 (en) * 1995-05-23 1998-12-10 Fraunhofer Ges Forschung Process for the production of metallized polymer particles and polymer material produced by the process and their use

Also Published As

Publication number Publication date
EP1030880A1 (en) 2000-08-30
IL135862A0 (en) 2001-05-20
TR200001006T2 (en) 2000-07-21
AU730445B2 (en) 2001-03-08
KR20010031755A (en) 2001-04-16
RU2199556C2 (en) 2003-02-27
AU1749599A (en) 1999-05-24
JP2001521964A (en) 2001-11-13
CA2309074A1 (en) 1999-05-14
DE19881647D2 (en) 2000-04-13
NO312902B1 (en) 2002-07-15
KR100421334B1 (en) 2004-03-09
WO1999023152A1 (en) 1999-05-14
HUP0004285A3 (en) 2002-02-28
CN1283213A (en) 2001-02-07
HUP0004285A1 (en) 2001-03-28
NO20002323L (en) 2000-06-20

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Legal Events

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