HUP0004285A3 - Electrically conductive filler and method for the production thereof - Google Patents

Electrically conductive filler and method for the production thereof

Info

Publication number: HUP0004285A3
Authority: HU; Hungary
Prior art keywords: production; electrically conductive; conductive filler; filler; electrically
Prior art date: 1997-11-03

Application number

HU0004285A

Other languages

Hungarian (hu)

Original Assignee

Wegener Helmut

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-11-03

Filing date

1998-11-03

Publication date

2002-02-28

1998-11-03 Application filed by Wegener Helmut filed Critical Wegener Helmut

2001-03-28 Publication of HUP0004285A1 publication Critical patent/HUP0004285A1/en

2002-02-28 Publication of HUP0004285A3 publication Critical patent/HUP0004285A3/en

Links

239000011231 conductive filler Substances 0.000 title 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/223—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating specially adapted for coating particles
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

HU0004285A 1997-11-03 1998-11-03 Electrically conductive filler and method for the production thereof HUP0004285A3 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE19749956		1997-11-03
PCT/DE1998/003267 WO1999023152A1 (en)	1997-11-03	1998-11-03	Electrically conductive filler and method for the production thereof

Publications (2)

Publication Number	Publication Date
HUP0004285A1 HUP0004285A1 (en)	2001-03-28
HUP0004285A3 true HUP0004285A3 (en)	2002-02-28

Family

ID=7848379

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
HU0004285A HUP0004285A3 (en)	1997-11-03	1998-11-03	Electrically conductive filler and method for the production thereof

Country Status (13)

Country	Link
EP (1)	EP1030880A1 (en)
JP (1)	JP2001521964A (en)
KR (1)	KR100421334B1 (en)
CN (1)	CN1283213A (en)
AU (1)	AU730445B2 (en)
CA (1)	CA2309074A1 (en)
DE (1)	DE19881647D2 (en)
HU (1)	HUP0004285A3 (en)
IL (1)	IL135862A0 (en)
NO (1)	NO312902B1 (en)
RU (1)	RU2199556C2 (en)
TR (1)	TR200001006T2 (en)
WO (1)	WO1999023152A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO1999023153A2 (en) *	1997-11-03	1999-05-14	Helmut Kahl	Plastic material and conductive plastic object
BR112016002368A2 (en)	2013-09-24	2017-08-01	Henkel IP & Holding GmbH	pyrolyzed organic conductive prepreg layers produced with these layers
CN104448562A (en) *	2014-12-04	2015-03-25	苏州润佳工程塑料股份有限公司	Coated conductive powder and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6096548A (en) *	1983-10-31	1985-05-30	Nippon Chem Ind Co Ltd:The	Electrically conductive material
US4621024A (en) *	1984-12-31	1986-11-04	Paper Applications International, Inc.	Metal-coated hollow microspheres
JP3042101B2 (en) *	1991-11-22	2000-05-15	ジェイエスアール株式会社	Method for producing composite particles and hollow particles
DE4405156C1 (en) *	1994-02-18	1995-10-26	Univ Karlsruhe	Process for the production of coated polymeric microparticles
DE19518942C2 (en) *	1995-05-23	1998-12-10	Fraunhofer Ges Forschung	Process for the production of metallized polymer particles and polymer material produced by the process and their use

1998
- 1998-11-03 CA CA 2309074 patent/CA2309074A1/en not_active Abandoned
- 1998-11-03 IL IL13586298A patent/IL135862A0/en unknown
- 1998-11-03 EP EP98962226A patent/EP1030880A1/en not_active Withdrawn
- 1998-11-03 HU HU0004285A patent/HUP0004285A3/en unknown
- 1998-11-03 WO PCT/DE1998/003267 patent/WO1999023152A1/en not_active Application Discontinuation
- 1998-11-03 CN CN98812782A patent/CN1283213A/en active Pending
- 1998-11-03 JP JP2000519021A patent/JP2001521964A/en active Pending
- 1998-11-03 TR TR200001006T patent/TR200001006T2/en unknown
- 1998-11-03 KR KR10-2000-7004820A patent/KR100421334B1/en not_active IP Right Cessation
- 1998-11-03 AU AU17495/99A patent/AU730445B2/en not_active Ceased
- 1998-11-03 DE DE19881647T patent/DE19881647D2/en not_active Ceased
- 1998-11-03 RU RU2000114187A patent/RU2199556C2/en not_active IP Right Cessation
2000
- 2000-05-02 NO NO20002323A patent/NO312902B1/en not_active IP Right Cessation

Also Published As

Publication number	Publication date
CA2309074A1 (en)	1999-05-14
KR100421334B1 (en)	2004-03-09
JP2001521964A (en)	2001-11-13
TR200001006T2 (en)	2000-07-21
NO312902B1 (en)	2002-07-15
HUP0004285A1 (en)	2001-03-28
KR20010031755A (en)	2001-04-16
NO20002323D0 (en)	2000-05-02
CN1283213A (en)	2001-02-07
DE19881647D2 (en)	2000-04-13
RU2199556C2 (en)	2003-02-27
AU1749599A (en)	1999-05-24
EP1030880A1 (en)	2000-08-30
NO20002323L (en)	2000-06-20
AU730445B2 (en)	2001-03-08
IL135862A0 (en)	2001-05-20
WO1999023152A1 (en)	1999-05-14

Publication	Publication Date	Title
HUP0000592A3 (en)	2000-07-28	Electrical connector unit, contact therefor, electrical connector and method for producing said electrical connector unit
GB9408326D0 (en)	1994-06-15	Electrical connector for conductive leads
GB2322016B (en)	1999-02-03	Electrical connector
HK1022184A1 (en)	2000-07-28	Device for electrically insulating the connection between two meal elements
HUP0004285A3 (en)	2002-02-28	Electrically conductive filler and method for the production thereof
GB9521964D0 (en)	1996-01-03	Electrically conductive composite polymeric material
SG72809A1 (en)	2000-05-23	Method for manufacturing electrical connectors
EP0663679A3 (en)	1996-01-10	Electrical fuse and method for producing the same.
GB2323980B (en)	2001-07-11	Electrical apparatus
GB2329080B (en)	2002-04-17	Two-part electrical connector
GB9722720D0 (en)	1998-04-15	Electrical apparatus
GB2343064B (en)	2002-03-06	Electrical assemblies
GB9711399D0 (en)	1997-07-30	Vehicle electrical
GB2328769B (en)	2001-05-16	Electrical apparatus
TW408843U (en)	2000-10-11	Electrical parts
GB2301493B (en)	1998-03-11	Electrical assemblies
GB2329081B (en)	2001-12-19	Two-part electrical connector
GB9700442D0 (en)	1997-02-26	Electrically conducting material
TW375338U (en)	1999-11-21	Improved structure for the grounding terminals
PL302820A1 (en)	1995-10-02	Electrically conductive polymer composite
ZA979537B (en)	1998-07-29	Electrical insulator.
IL143749A (en)	2005-09-25	Method for producing conductive materials and the materials produced by this method
GB9716694D0 (en)	1997-10-15	Electrical assemblies
GB9703775D0 (en)	1997-04-16	Electrical assemblies
GB9720299D0 (en)	1997-11-26	Electrical assemblies