NO146676B - Fotopolymeriserbar trykkfarge for silketrykk - Google Patents
Fotopolymeriserbar trykkfarge for silketrykk Download PDFInfo
- Publication number
- NO146676B NO146676B NO751830A NO751830A NO146676B NO 146676 B NO146676 B NO 146676B NO 751830 A NO751830 A NO 751830A NO 751830 A NO751830 A NO 751830A NO 146676 B NO146676 B NO 146676B
- Authority
- NO
- Norway
- Prior art keywords
- circuit
- steam
- hot water
- heat
- pressure
- Prior art date
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 37
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000001419 dependent effect Effects 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 210000000056 organ Anatomy 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F20/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/447—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from acrylic compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4981—Utilizing transitory attached element or associated separate material
- Y10T29/49812—Temporary protective coating, impregnation, or cast layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- General Physics & Mathematics (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
- Chemically Coating (AREA)
- Paints Or Removers (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Description
Kombinert hettvanns- og dampkjele.
Ved hettvannskj eler kan man ved å holde et høyt trykk forhindre dampdannelse til tross for at temperaturen av det sir-kulerende vann er over 100°C. Ved slike kjeler er der ofte behov for samtidig å kunne utta en viss mengde damp, enten for å anvende den i slike apparater som krever damp for sin drift, eller for ved hjelp av dampen å kunne holde en høyere temperatur i ett eller annet apparat enn i vannet. For hettvannskretsen behøves et ekspansjonskar, og forskjellige behov for hettvann og damp fører til at man som oftest benytter separat fyring for de forskjellige kretser.
Den foreliggende oppfinnelse går ut på en kjele til levering av både hettvann og damp, omfattende en sirkulasjonskrets for hettvann og en sirkulasjonskrets for dampproduksjon, begge med varmeopptagende deler i ett og samme fyrsted. Oppfinnelsen er karakterisert ved at sirkulasjonskretsene er forsynt med parallelle varmeopptagende deler i det felles fyrsted, og at der er anordnet en stadig åpen forbindelsesledning mellom hettvannskretsen og dampkretsen, hensiktsmessig tilsluttet en damptrommel som inngår i dampkretsen. På denne måte kan den dampproduserende krets gjøre tjeneste som ekspansjonskar for hettvannskretsen, og det blir mulig med enkle midler å regulere varme-opptagelsen på en slik måte at man får tilfredsstillende driftsbetingelser for begge kretser.
På tegningen er der som eksempel vist en utførelsesform av oppfinnelsen an-vendt ved en kjele som hovedsakelig er be-stemt for indirekte oppvarmning av et stør-re varmeledningssystem, og som også omfatter en mindre sløyfe for dampproduksjon.
Kjelen, som er skjematisk antydet ved 1, er forsynt med en brenner 2 av vilkårlig, i og for seg kjent type. I kjelen inngår varmeopptagende flater 3 og 4. Den først-nevnte varmeflate inngår i en primær hettvanns-sirkulasjonskrets 5, som i en varmeveksler 6 indirekte oppvarmer bruks-vann, resp. sirkulasjonsvann for en større sentralvarmeledning, som her bare er antydet ved inn- og utgående ledninger hen-holdsvis 8 og 7. Hettvannskretsen er be-stemt for tvungen sirkulasjon av arbeids-mediet og inneholder en første pumpe 9 og en reservepumpe 10, som begge på kjent måte er forsynt med stengbare ventiler, så hvilken som helst av dem kan settes i funksjon. I den utgående ledning 7 er der innsatt et termostatpåvirket organ 11, som i avhengighet av temperaturen av vannet i sirkulasjonskretsen styrer omdreiningstal-let for pumpenes drivmotor. Hettvannstem-peraturen bestemmer ved hjelp av impulser fra en føler 12 brenseltilførselen til brenneren 2.
Den annen varmeopptagende flate 4 inngår i en dampproduserende krets 14, som omfatter en damptrommel 15 og en sirkulasjonspumpe anbragt i returlednin-gen fra denne. Til damptrommelen er der sluttet en fødevannsledning 16 og en utgående dampledning 17. Damptrommelen er på vanlig måte forsynt med et organ 19 som påvirkes av vannstanden og styrer fødevannstiiførselen via ventilen 20 pro-porsjonalt med den nivåsenkning som for-årsakes av damputtak gjennom ledningen 17. Mellom disse to sirkulasjonskretser er der anordnet en første, stadig åpen forbindelsesledning 21, ved hvis hjelp damptrommelen i den annen krets kan utnyttes som ekspansjonskar for hettvannskretsen. Den dampproduserende krets kan f. eks. beregnes for et trykk av 25 ato, svarende til en temperatur av 225°C i damptrommelen. Trykket i denne blir bestemmende for trykket i hettvannskretsen, og dennes varmeopptagende del 3 er slik dimensjonert at temperaturen i hettvannskretsen under normale driftsforhold ikke blir så høy at der oppstår dampdannelse. Temperaturen bak den varmeopptagende del kan være f. eks. 175°C og temperaturen av returvannet 130°C, hvilket er tilstrekkelig til å sikre en temperatur av 90°C i det vann som forlater varmeveksleren 6. Fra dampkretsen blir der i det beskrevne tilfelle uttatt damp, dels i en med belastningen varierende mengde for forstøvning av olje i brenneren 2, dels intermittent til dampsotningsapparater for rengjøring av kjelens heteflater, samt dels ved behov til andre forbrukere.
Hvis uttaket av damp leilighetsvis underskrider den normalt beregnede mengde, må der treffes forholdsregler for å føre bort varme fra denne krets. Dette skjer via en annen forbindelsesledning 22, som går ut fra hettvannskretsens koldere del like bak pumpene 9 og 10 og forbinder denne med damptrommelens øvre del. Et trykk-følsomt organ 23 som er tilsluttet damptrommelen, styrer en ventil 24 i ledningen 22. Stiger trykket i damptrommelen over det tillatte, åpnes ventilen 24 mer eller mindre, og vann fra hettvannskretsen du-sjes inn i damprommet i trommelen og kjø-ler dampen der. En vannmengde motsva-rende den mengde som blir tilført på denne måte, føres via en returledning 25 tilbake til pumpenes sugeside. Denne mengde reguleres av en ventil 26, som også står i avhengighet av en føler i vannstandsvise-ren 19. Da trykket i dampkretsen er bestemmende for driftsforholdene i hettvannskretsen, må man forhindre at trykket i dampkretsen på grunn av alt for stort damputtak synker så meget at der inntrer fare for dampdannelse i hettvannskretsen. Føleren 23 styrer derfor også en ventil 27 i den utgående dampledning 17, slik at mu-ligheten for uttak blir begrenset i nødven-dig grad.
Claims (4)
1. Kombinert hettvanns- og dampkjele, omfattende en sirkulasjonskrets for hettvann og en sirkulasjonskrets for dampproduksjon, begge med varmeopptagende deler i ett og samme fyrsted, karakterisert ved at sirkulasjonskretsene (5, 14) er forsynt med parallelle varmeopptagende deler (3, 4) i det felles fyrsted, og at der er anordnet en stadig åpen forbindelsesledning (21) mellom hettvannskretsen (5) og dampkretsen (14), hensiktsmessig tilsluttet en damptrommel (15) som inngår i dampkretsen.
2. Kombinert kjele som angitt i på-stand 1, karakterisert ved at kret-sens varmeopptagende deler (3, 4) er dimensjonert slik at temperaturen i hettvannskretsen under normale driftsforhold ikke når opp til fordampningstemperatu-ren for trykket i den dampproduserende krets.
3. Kombinert kjele som angitt i på-stand 1 eller 2, karakterisert ved to andre, fortrinnsvis automatisk styrte for-bindelsesledninger (22, 25) mellom hettvannskretsen, hensiktsmessig dennes koldere del, og den dampproduserende krets, resp. fra denne tilbake til hettvannskretsen.
4. Kombinert kjele som angitt i på-stand 1 eller 2, karakterisert ved et organ (23) som står i avhengighet av trykket i den dampproduserende krets og er innrettet til å styre en strupeventil (27) i damputtaksledningen (17) fra denne krets på en slik måte at trykket i dampkretsen ikke underskrider en viss ønsket verdi.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/473,180 US4003877A (en) | 1974-05-24 | 1974-05-24 | Photopolymerizable screen printing inks for permanent coatings prepared from aryloxyalkyl compositions |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO751830L NO751830L (no) | 1975-11-25 |
| NO146676B true NO146676B (no) | 1982-08-09 |
| NO146676C NO146676C (no) | 1982-11-17 |
Family
ID=23878521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO751830A NO146676C (no) | 1974-05-24 | 1975-05-23 | Fotopolymeriserbar trykkfarge for silketrykk |
Country Status (24)
| Country | Link |
|---|---|
| US (2) | US4003877A (no) |
| JP (1) | JPS515388A (no) |
| AR (1) | AR217039A1 (no) |
| AT (1) | AT339928B (no) |
| BE (1) | BE829437A (no) |
| BG (1) | BG26402A3 (no) |
| BR (1) | BR7503276A (no) |
| CA (1) | CA1049691A (no) |
| CH (1) | CH608825A5 (no) |
| DD (2) | DD124390A5 (no) |
| DE (1) | DE2522811C2 (no) |
| DK (1) | DK154919C (no) |
| ES (1) | ES437825A1 (no) |
| FI (1) | FI59112C (no) |
| FR (1) | FR2274652A1 (no) |
| GB (1) | GB1507842A (no) |
| IL (1) | IL47310A (no) |
| IN (1) | IN142791B (no) |
| IT (1) | IT1035820B (no) |
| NL (1) | NL173178B (no) |
| NO (1) | NO146676C (no) |
| RO (1) | RO67457A (no) |
| SE (1) | SE431879B (no) |
| ZA (1) | ZA753049B (no) |
Families Citing this family (69)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5296690A (en) * | 1976-02-10 | 1977-08-13 | Dainippon Ink & Chem Inc | Rapidly curable photo-setting resin composition |
| US4234676A (en) * | 1978-01-23 | 1980-11-18 | W. R. Grace & Co. | Polythiol effect curable polymeric composition |
| EP0002040B1 (de) * | 1977-11-21 | 1981-12-30 | Ciba-Geigy Ag | Verfahren zur Herstellung von Lötstoppmasken auf gedruckten Schaltungen mit Druckkontaktierungsbohrungen |
| US4169732A (en) * | 1978-01-09 | 1979-10-02 | International Business Machines Corporation | Photosensitive coating composition and use thereof |
| US4381951A (en) * | 1978-01-25 | 1983-05-03 | Western Electric Co. Inc. | Method of removing contaminants from a surface |
| US4322457A (en) * | 1978-01-25 | 1982-03-30 | Western Electric Co., Inc. | Method of selectively depositing a metal on a surface |
| JPS54105774A (en) * | 1978-02-08 | 1979-08-20 | Hitachi Ltd | Method of forming pattern on thin film hybrid integrated circuit |
| JPS5953164B2 (ja) * | 1978-04-13 | 1984-12-24 | 日本文化精工株式会社 | 印刷とメツキとによるプラスチツク製品の加飾方法 |
| JPS54158661A (en) * | 1978-06-01 | 1979-12-14 | Tokyo Purinto Kougiyou Kk | Printed circuit board |
| GB2030584B (en) * | 1978-10-03 | 1983-03-23 | Lankro Chem Ltd | Photopolymerisable solder resist compositions |
| NO159729C (no) * | 1978-11-01 | 1989-02-01 | Coates Brothers & Co | Fremgangsmaate for fremstilling av et moenster av loddemetall paa et lag elektrisk ledende metall baaret av et ikke-ledende underlag. |
| US4486466A (en) * | 1979-01-12 | 1984-12-04 | Kollmorgen Technologies Corporation | High resolution screen printable resists |
| US4240945A (en) * | 1979-01-31 | 1980-12-23 | Albert Gabrick | Solder mask composition |
| US4345371A (en) * | 1979-03-14 | 1982-08-24 | Sony Corporation | Method and apparatus for manufacturing hybrid integrated circuits |
| JPS55127097A (en) * | 1979-03-20 | 1980-10-01 | Matsushita Electric Ind Co Ltd | Photocurable resin composition and solder resist |
| GB2050946B (en) * | 1979-05-30 | 1983-02-16 | Tdk Electronics Co Ltd | Hot melt screen printing machine and process for producing a screen printing plate |
| US4376815A (en) * | 1979-10-22 | 1983-03-15 | Oddi Michael J | Method of applying photoresist by screening in the formation of printed circuits |
| US4390615A (en) * | 1979-11-05 | 1983-06-28 | Courtney Robert W | Coating compositions |
| US4306012A (en) * | 1979-12-05 | 1981-12-15 | Hercules Incorporated | Process of radiation and heat treatment of printing medium |
| US4416974A (en) * | 1979-12-05 | 1983-11-22 | Hercules Incorporated | Radiation curable ceramic pigment composition |
| US4252888A (en) * | 1980-02-26 | 1981-02-24 | Minnesota Mining And Manufacturing Company | Solder mask composition |
| JPS6045665B2 (ja) * | 1980-04-21 | 1985-10-11 | 日立化成工業株式会社 | 実装回路板用防湿絶縁塗料組成物 |
| JPS573875A (en) * | 1980-06-11 | 1982-01-09 | Tamura Kaken Kk | Photopolymerizable ink composition |
| US4490457A (en) * | 1980-11-28 | 1984-12-25 | Honeywell Inc. | Cold/dry substrate treatment technique which improves photolithographic limits of resolution and exposure tolerance |
| JPS5888741A (ja) * | 1981-11-20 | 1983-05-26 | Hitachi Chem Co Ltd | 感光性樹脂組成物及び感光性樹脂組成物積層体 |
| JPS58177492A (ja) * | 1982-04-12 | 1983-10-18 | Tadao Mutou | プラスチツク成形品に部分的な金属メツキを施す方法 |
| US4522914A (en) * | 1982-10-22 | 1985-06-11 | Wabash College | Imaging method of making a raised line facsimile of a photographic image |
| JPS59204036A (ja) * | 1983-05-06 | 1984-11-19 | Dainippon Ink & Chem Inc | レジストパタ−ンの形成法 |
| US4533445A (en) * | 1983-07-06 | 1985-08-06 | Shipley Company Inc. | U.V. Curable composition |
| US4775611A (en) * | 1983-11-10 | 1988-10-04 | Sullivan Donald F | Additive printed circuit boards with flat surface and indented primary wiring conductors |
| US4640719A (en) * | 1985-07-01 | 1987-02-03 | Petroleum Fermentations N.V. | Method for printed circuit board and/or printed wiring board cleaning |
| AT389793B (de) * | 1986-03-25 | 1990-01-25 | Philips Nv | Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten |
| US4690833A (en) * | 1986-03-28 | 1987-09-01 | International Business Machines Corporation | Providing circuit lines on a substrate |
| EP0313580B1 (en) * | 1986-07-02 | 1992-06-03 | Loctite Corporation | Radiation curable temporary solder mask |
| US4826705A (en) * | 1986-07-02 | 1989-05-02 | Loctite Corporation | Radiation curable temporary solder mask |
| JPS6462375A (en) * | 1987-09-02 | 1989-03-08 | Arakawa Chem Ind | Liquid photosolder resist ink composition of alkali development type |
| US5630869A (en) * | 1988-01-12 | 1997-05-20 | Sicipa Holding S.A. | Reversibly photochromic printing inks |
| EP0346522A3 (en) * | 1988-06-16 | 1991-04-03 | Nippon CMK Corp. | Printed wiring board |
| US5667934A (en) * | 1990-10-09 | 1997-09-16 | International Business Machines Corporation | Thermally stable photoimaging composition |
| US5206116A (en) * | 1991-03-04 | 1993-04-27 | Shipley Company Inc. | Light-sensitive composition for use as a soldermask and process |
| DE4316087A1 (de) * | 1993-05-13 | 1994-11-17 | Morton Int Inc | Verfahren zum bildmäßigen Metallisieren von strukturierten Leiterplatten |
| US5458921A (en) | 1994-10-11 | 1995-10-17 | Morton International, Inc. | Solvent system for forming films of photoimageable compositions |
| US5545440A (en) * | 1994-12-05 | 1996-08-13 | At&T Global Information Solutions Company (Aka Ncr Corporation) | Method and apparatus for polymer coating of substrates |
| US5802713A (en) * | 1995-01-20 | 1998-09-08 | Fairchild Space And Defense Corportion | Circuit board manufacturing method |
| US5939239A (en) * | 1997-12-01 | 1999-08-17 | Nichigo-Morton Co., Ltd. | Photoimageable compositions containing photopolymerizable urethane oligomers and dibenzoate plasticizers |
| US5939238A (en) * | 1998-06-02 | 1999-08-17 | Morton International, Inc. | Photoimageable composition having improved photoinitiator system |
| US5952153A (en) * | 1997-12-01 | 1999-09-14 | Morton International, Inc. | Photoimageable composition having improved flexibility, adhesion and stripping characteristics |
| US5952154A (en) * | 1998-05-29 | 1999-09-14 | Morton International, Inc. | Photoimageable composition having improved flexibility |
| DE19842276A1 (de) * | 1998-09-16 | 2000-03-30 | Bosch Gmbh Robert | Paste zum Verschweißen von Keramiken mit Metallen und Verfahren zur Herstellung einer Schweißverbindung |
| JP2000118113A (ja) * | 1998-10-15 | 2000-04-25 | Riso Kagaku Corp | 孔版印刷方法及び装置 |
| US20030119955A1 (en) * | 2001-02-08 | 2003-06-26 | Mbt Holding Ag | Polymeric structural support membrane |
| ATE297434T1 (de) * | 2001-02-08 | 2005-06-15 | Constr Res & Tech Gmbh | Polymere strukturierte unterstützungs - membran |
| US6855480B2 (en) | 2001-04-19 | 2005-02-15 | Shipley Company, L.L.C. | Photoresist composition |
| TW511423B (en) * | 2001-09-25 | 2002-11-21 | Benq Corp | Soft circuit board for recognition and the manufacturing method thereof |
| US20060154180A1 (en) | 2005-01-07 | 2006-07-13 | Kannurpatti Anandkumar R | Imaging element for use as a recording element and process of using the imaging element |
| US7772295B2 (en) | 2005-02-04 | 2010-08-10 | Denki Kagaku Kogyo Kabushiki Kaisha | Resin compositions, cured article obtained therefrom, and sheet |
| US7579134B2 (en) * | 2005-03-15 | 2009-08-25 | E. I. Dupont De Nemours And Company | Polyimide composite coverlays and methods and compositions relating thereto |
| US7618766B2 (en) * | 2005-12-21 | 2009-11-17 | E. I. Du Pont De Nemours And Company | Flame retardant photoimagable coverlay compositions and methods relating thereto |
| US7527915B2 (en) * | 2006-07-19 | 2009-05-05 | E. I. Du Pont De Nemours And Company | Flame retardant multi-layer photoimagable coverlay compositions and methods relating thereto |
| WO2009110480A1 (ja) | 2008-03-03 | 2009-09-11 | 旭化成ケミカルズ株式会社 | 難燃性樹脂組成物 |
| TWI353808B (en) * | 2008-04-28 | 2011-12-01 | Ind Tech Res Inst | Method for fabricating conductive pattern on flexi |
| CN102224583B (zh) * | 2008-11-25 | 2014-09-10 | 洛德公司 | 使用光固化性材料保护晶片表面的方法 |
| US9093448B2 (en) | 2008-11-25 | 2015-07-28 | Lord Corporation | Methods for protecting a die surface with photocurable materials |
| WO2011124262A1 (de) * | 2010-04-09 | 2011-10-13 | Basf Se | Druckfarbe, enthaltend einen divinylester |
| US8344172B2 (en) | 2011-03-25 | 2013-01-01 | Stepan Company | Preparation of antiplasticizers for thermoplastic polyesters |
| WO2013100087A1 (ja) | 2011-12-28 | 2013-07-04 | 旭化成イーマテリアルズ株式会社 | レドックスフロー二次電池及びレドックスフロー二次電池用電解質膜 |
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| DE102014106230A1 (de) * | 2014-05-05 | 2015-11-05 | Preh Gmbh | Galvanisierverfahren für Inselstrukturen |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3066112A (en) * | 1959-01-30 | 1962-11-27 | Rafael L Bowen | Dental filling material comprising vinyl silane treated fused silica and a binder consisting of the reaction product of bis phenol and glycidyl acrylate |
| US3539533A (en) * | 1968-06-14 | 1970-11-10 | Johnson & Johnson | Dental filling material |
| US3661576A (en) * | 1970-02-09 | 1972-05-09 | Brady Co W H | Photopolymerizable compositions and articles |
| US3772062A (en) * | 1971-11-16 | 1973-11-13 | Inmont Corp | Ultra-violet curable coating compositions |
| JPS5414605B2 (no) * | 1972-07-05 | 1979-06-08 | ||
| JPS5625441B2 (no) * | 1972-09-04 | 1981-06-12 | ||
| JPS535712B2 (no) * | 1973-01-24 | 1978-03-01 | ||
| DE2349979A1 (de) * | 1973-10-04 | 1975-04-17 | Bayer Ag | Uv-licht-haertende massen hoher reaktivitaet |
-
1974
- 1974-05-24 US US05/473,180 patent/US4003877A/en not_active Expired - Lifetime
-
1975
- 1975-05-12 ZA ZA00753049A patent/ZA753049B/xx unknown
- 1975-05-14 GB GB20460/75A patent/GB1507842A/en not_active Expired
- 1975-05-14 IN IN963/CAL/75A patent/IN142791B/en unknown
- 1975-05-18 IL IL47310A patent/IL47310A/xx unknown
- 1975-05-20 FI FI751475A patent/FI59112C/fi not_active IP Right Cessation
- 1975-05-21 ES ES437825A patent/ES437825A1/es not_active Expired
- 1975-05-21 IT IT49715/75A patent/IT1035820B/it active
- 1975-05-22 DD DD191378A patent/DD124390A5/xx unknown
- 1975-05-22 DD DD186195A patent/DD120662A5/xx unknown
- 1975-05-22 SE SE7505838A patent/SE431879B/xx unknown
- 1975-05-23 AR AR258934A patent/AR217039A1/es active
- 1975-05-23 BG BG7530068A patent/BG26402A3/xx unknown
- 1975-05-23 CH CH756624A patent/CH608825A5/xx not_active IP Right Cessation
- 1975-05-23 DE DE2522811A patent/DE2522811C2/de not_active Expired
- 1975-05-23 RO RO7582318A patent/RO67457A/ro unknown
- 1975-05-23 NO NO751830A patent/NO146676C/no unknown
- 1975-05-23 DK DK227875A patent/DK154919C/da not_active IP Right Cessation
- 1975-05-23 FR FR7516148A patent/FR2274652A1/fr active Granted
- 1975-05-23 BR BR4189/75A patent/BR7503276A/pt unknown
- 1975-05-23 CA CA227,687A patent/CA1049691A/en not_active Expired
- 1975-05-23 NL NLAANVRAGE7506080,A patent/NL173178B/xx not_active Application Discontinuation
- 1975-05-23 BE BE156665A patent/BE829437A/xx not_active IP Right Cessation
- 1975-05-24 JP JP50062416A patent/JPS515388A/ja active Pending
- 1975-05-26 AT AT400775A patent/AT339928B/de not_active IP Right Cessation
-
1976
- 1976-06-01 US US05/691,922 patent/US4064287A/en not_active Expired - Lifetime
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