NL7605903A - Samenstel met een halfgeleiderinrichting. - Google Patents
Samenstel met een halfgeleiderinrichting.Info
- Publication number
- NL7605903A NL7605903A NL7605903A NL7605903A NL7605903A NL 7605903 A NL7605903 A NL 7605903A NL 7605903 A NL7605903 A NL 7605903A NL 7605903 A NL7605903 A NL 7605903A NL 7605903 A NL7605903 A NL 7605903A
- Authority
- NL
- Netherlands
- Prior art keywords
- semiconductor
- composition
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/582,610 US4008486A (en) | 1975-06-02 | 1975-06-02 | Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7605903A true NL7605903A (nl) | 1976-12-06 |
Family
ID=24329807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7605903A NL7605903A (nl) | 1975-06-02 | 1976-06-01 | Samenstel met een halfgeleiderinrichting. |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4008486A (nl) |
| CH (1) | CH612540A5 (nl) |
| DE (1) | DE2624807A1 (nl) |
| ES (1) | ES448440A1 (nl) |
| FR (1) | FR2313774A1 (nl) |
| GB (1) | GB1555515A (nl) |
| NL (1) | NL7605903A (nl) |
| SE (1) | SE7606179L (nl) |
| SU (1) | SU845810A3 (nl) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5354971A (en) * | 1976-10-28 | 1978-05-18 | Mitsubishi Electric Corp | Semiconductor device |
| US4131905A (en) * | 1977-05-26 | 1978-12-26 | Electric Power Research Institute, Inc. | Light-triggered thyristor and package therefore |
| DE2810416C2 (de) * | 1978-03-10 | 1983-09-01 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Halbleiterbauelement mit Kunststoffummantelung |
| US4257058A (en) * | 1979-07-05 | 1981-03-17 | Electric Power Research Institute, Inc. | Package for radiation triggered semiconductor device and method |
| GB8410847D0 (en) * | 1984-04-27 | 1984-06-06 | Westinghouse Brake & Signal | Semiconductor housings |
| EP0320618A1 (de) * | 1987-12-14 | 1989-06-21 | BBC Brown Boveri AG | Gehäuse für einen abschaltbaren Leistungsthyristor (GTO) |
| DE4227063A1 (de) * | 1992-08-15 | 1994-02-17 | Abb Research Ltd | Abschaltbares Hochleistungs-Halbleiterbauelement |
| US5798287A (en) * | 1993-12-24 | 1998-08-25 | Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno | Method for forming a power MOS device chip |
| DE69321965T2 (de) * | 1993-12-24 | 1999-06-02 | Cons Ric Microelettronica | MOS-Leistungs-Chip-Typ und Packungszusammenbau |
| DE69321966T2 (de) * | 1993-12-24 | 1999-06-02 | Cons Ric Microelettronica | Leistungs-Halbleiterbauelement |
| EP0697728B1 (en) * | 1994-08-02 | 1999-04-21 | STMicroelectronics S.r.l. | MOS-technology power device chip and package assembly |
| US6781227B2 (en) * | 2002-01-25 | 2004-08-24 | International Rectifier Corporation | Compression assembled electronic package having a plastic molded insulation ring |
| US7132698B2 (en) * | 2002-01-25 | 2006-11-07 | International Rectifier Corporation | Compression assembled electronic package having a plastic molded insulation ring |
| EP2615240A3 (en) * | 2012-01-16 | 2014-09-03 | Prad Research Development Limited | Tubing Encased Motor Lead |
| USD712940S1 (en) * | 2012-05-17 | 2014-09-09 | Anthony Cerniglia | Locating ring |
| CN113725085B (zh) * | 2021-08-31 | 2024-03-29 | 深圳技术大学 | 一种封装零件的装配工艺方法和封装零件 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3058209A (en) * | 1962-10-16 | Method of manufacturing a vacuum tight closure | ||
| NL240675A (nl) * | 1958-07-02 | |||
| DE1248814B (de) * | 1962-05-28 | 1968-03-14 | Siemens Ag | Halbleiterbauelement und zugehörige Kühlordnung |
| DE1514152A1 (de) * | 1964-12-16 | 1969-09-11 | Licentia Gmbh | Halbleiter-Gleichrichterzelle |
| US3337678A (en) * | 1965-06-30 | 1967-08-22 | John P Stelmak | Sealed microminiature electronic package |
| US3437887A (en) * | 1966-06-03 | 1969-04-08 | Westinghouse Electric Corp | Flat package encapsulation of electrical devices |
| FR2003573A1 (nl) * | 1968-03-09 | 1969-11-07 | Mitsubishi Electric Corp | |
| US3599057A (en) * | 1969-02-03 | 1971-08-10 | Gen Electric | Semiconductor device with a resilient lead construction |
| DE2014289A1 (de) * | 1970-03-25 | 1971-10-14 | Semikron Gleichrichterbau | Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung |
| US3688163A (en) * | 1970-08-04 | 1972-08-29 | Gen Motors Corp | Cold welded semiconductor package having integral cold welding oil |
| US3654529A (en) * | 1971-04-05 | 1972-04-04 | Gen Electric | Loose contact press pack |
| US3831067A (en) * | 1972-05-15 | 1974-08-20 | Int Rectifier Corp | Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring |
| US3918147A (en) * | 1974-03-25 | 1975-11-11 | Corning Glass Works | Hermetic enclosure for electronic component |
-
1975
- 1975-06-02 US US05/582,610 patent/US4008486A/en not_active Expired - Lifetime
-
1976
- 1976-06-01 FR FR7616501A patent/FR2313774A1/fr active Granted
- 1976-06-01 SE SE7606179A patent/SE7606179L/xx unknown
- 1976-06-01 ES ES448440A patent/ES448440A1/es not_active Expired
- 1976-06-01 NL NL7605903A patent/NL7605903A/nl not_active Application Discontinuation
- 1976-06-01 CH CH687176A patent/CH612540A5/xx not_active IP Right Cessation
- 1976-06-02 DE DE19762624807 patent/DE2624807A1/de not_active Withdrawn
- 1976-06-02 GB GB22781/76A patent/GB1555515A/en not_active Expired
- 1976-06-02 SU SU762364901A patent/SU845810A3/ru active
Also Published As
| Publication number | Publication date |
|---|---|
| DE2624807A1 (de) | 1976-12-16 |
| FR2313774A1 (fr) | 1976-12-31 |
| CH612540A5 (nl) | 1979-07-31 |
| US4008486A (en) | 1977-02-15 |
| ES448440A1 (es) | 1977-07-01 |
| SE7606179L (sv) | 1976-12-03 |
| GB1555515A (en) | 1979-11-14 |
| SU845810A3 (ru) | 1981-07-07 |
| FR2313774B1 (nl) | 1980-07-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BV | The patent application has lapsed |