FR2313774A1 - Ensemble comprenant un dispositif a semi-conducteur et des pieces polaires - Google Patents

Ensemble comprenant un dispositif a semi-conducteur et des pieces polaires

Info

Publication number: FR2313774A1
Authority: FR; France
Prior art keywords: semiconductor device; set including; polar parts; polar; parts
Prior art date: 1975-06-02
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

FR7616501A

Other languages

English (en)

Other versions

FR2313774B1 (fr

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Infineon Technologies Americas Corp

Original Assignee

International Rectifier Corp USA

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-06-02

Filing date

1976-06-01

Publication date

1976-12-31

1976-06-01 Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA

1976-12-31 Publication of FR2313774A1 publication Critical patent/FR2313774A1/fr

1980-07-25 Application granted granted Critical

1980-07-25 Publication of FR2313774B1 publication Critical patent/FR2313774B1/fr

Status Granted legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Die Bonding (AREA)
Thyristors (AREA)

FR7616501A 1975-06-02 1976-06-01 Ensemble comprenant un dispositif a semi-conducteur et des pieces polaires Granted FR2313774A1 (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US05/582,610 US4008486A (en)	1975-06-02	1975-06-02	Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring

Publications (2)

Publication Number	Publication Date
FR2313774A1 true FR2313774A1 (fr)	1976-12-31
FR2313774B1 FR2313774B1 (fr)	1980-07-25

Family

ID=24329807

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FR7616501A Granted FR2313774A1 (fr)	1975-06-02	1976-06-01	Ensemble comprenant un dispositif a semi-conducteur et des pieces polaires

Country Status (9)

Country	Link
US (1)	US4008486A (fr)
CH (1)	CH612540A5 (fr)
DE (1)	DE2624807A1 (fr)
ES (1)	ES448440A1 (fr)
FR (1)	FR2313774A1 (fr)
GB (1)	GB1555515A (fr)
NL (1)	NL7605903A (fr)
SE (1)	SE7606179L (fr)
SU (1)	SU845810A3 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0320618A1 (fr) *	1987-12-14	1989-06-21	BBC Brown Boveri AG	Boîtier pour un thyristor de puissance du type GTO
EP0588026A2 (fr) *	1992-08-15	1994-03-23	Abb Research Ltd.	Dispositif semiconducteur de haute puissance à commande d'extinction

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5354971A (en) *	1976-10-28	1978-05-18	Mitsubishi Electric Corp	Semiconductor device
US4131905A (en) *	1977-05-26	1978-12-26	Electric Power Research Institute, Inc.	Light-triggered thyristor and package therefore
DE2810416C2 (de) *	1978-03-10	1983-09-01	Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt	Halbleiterbauelement mit Kunststoffummantelung
US4257058A (en) *	1979-07-05	1981-03-17	Electric Power Research Institute, Inc.	Package for radiation triggered semiconductor device and method
GB8410847D0 (en) *	1984-04-27	1984-06-06	Westinghouse Brake & Signal	Semiconductor housings
US5798287A (en) *	1993-12-24	1998-08-25	Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno	Method for forming a power MOS device chip
DE69321965T2 (de) *	1993-12-24	1999-06-02	Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania	MOS-Leistungs-Chip-Typ und Packungszusammenbau
EP0660402B1 (fr) *	1993-12-24	1998-11-04	Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno	Dispositif semi-conducteur de puissance
EP0697728B1 (fr) *	1994-08-02	1999-04-21	STMicroelectronics S.r.l.	Dispositif à semi-conducteur de puissance en technologie MOS puce et boítier assemblé
US6781227B2 (en) *	2002-01-25	2004-08-24	International Rectifier Corporation	Compression assembled electronic package having a plastic molded insulation ring
US7132698B2 (en) *	2002-01-25	2006-11-07	International Rectifier Corporation	Compression assembled electronic package having a plastic molded insulation ring
EP2615240A3 (fr) *	2012-01-16	2014-09-03	Prad Research Development Limited	Moteur enrobé de tubage conducteur
USD712940S1 (en) *	2012-05-17	2014-09-09	Anthony Cerniglia	Locating ring
CN113725085B (zh) *	2021-08-31	2024-03-29	深圳技术大学	一种封装零件的装配工艺方法和封装零件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1912041A1 (de) *	1968-03-09	1969-09-18	Mitsubishi Electric Corp	Halbleitervorrichtung
FR2091947A1 (fr) *	1969-02-03	1972-01-21	Gen Electric
US3688163A (en) *	1970-08-04	1972-08-29	Gen Motors Corp	Cold welded semiconductor package having integral cold welding oil

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3058209A (en) *		1962-10-16		Method of manufacturing a vacuum tight closure
NL240675A (fr) *	1958-07-02
DE1248814B (de) *	1962-05-28	1968-03-14	Siemens Ag	Halbleiterbauelement und zugehörige Kühlordnung
DE1514152A1 (de) *	1964-12-16	1969-09-11	Licentia Gmbh	Halbleiter-Gleichrichterzelle
US3337678A (en) *	1965-06-30	1967-08-22	John P Stelmak	Sealed microminiature electronic package
US3437887A (en) *	1966-06-03	1969-04-08	Westinghouse Electric Corp	Flat package encapsulation of electrical devices
DE2014289A1 (de) *	1970-03-25	1971-10-14	Semikron Gleichrichterbau	Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung
US3654529A (en) *	1971-04-05	1972-04-04	Gen Electric	Loose contact press pack
US3831067A (en) *	1972-05-15	1974-08-20	Int Rectifier Corp	Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring
US3918147A (en) *	1974-03-25	1975-11-11	Corning Glass Works	Hermetic enclosure for electronic component

1975
- 1975-06-02 US US05/582,610 patent/US4008486A/en not_active Expired - Lifetime
1976
- 1976-06-01 ES ES448440A patent/ES448440A1/es not_active Expired
- 1976-06-01 CH CH687176A patent/CH612540A5/xx not_active IP Right Cessation
- 1976-06-01 FR FR7616501A patent/FR2313774A1/fr active Granted
- 1976-06-01 SE SE7606179A patent/SE7606179L/xx unknown
- 1976-06-01 NL NL7605903A patent/NL7605903A/xx not_active Application Discontinuation
- 1976-06-02 GB GB22781/76A patent/GB1555515A/en not_active Expired
- 1976-06-02 DE DE19762624807 patent/DE2624807A1/de not_active Withdrawn
- 1976-06-02 SU SU762364901A patent/SU845810A3/ru active

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1912041A1 (de) *	1968-03-09	1969-09-18	Mitsubishi Electric Corp	Halbleitervorrichtung
FR2091947A1 (fr) *	1969-02-03	1972-01-21	Gen Electric
US3688163A (en) *	1970-08-04	1972-08-29	Gen Motors Corp	Cold welded semiconductor package having integral cold welding oil

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0320618A1 (fr) *	1987-12-14	1989-06-21	BBC Brown Boveri AG	Boîtier pour un thyristor de puissance du type GTO
US4953004A (en) *	1987-12-14	1990-08-28	Bbc Brown Boveri Ag	Housing for a gate turn-off power thyristor (GTO)
EP0588026A2 (fr) *	1992-08-15	1994-03-23	Abb Research Ltd.	Dispositif semiconducteur de haute puissance à commande d'extinction
EP0588026A3 (en) *	1992-08-15	1994-09-07	Abb Research Ltd	Turn-off high-power semiconductor device

Also Published As

Publication number	Publication date
CH612540A5 (fr)	1979-07-31
SE7606179L (sv)	1976-12-03
ES448440A1 (es)	1977-07-01
NL7605903A (nl)	1976-12-06
GB1555515A (en)	1979-11-14
SU845810A3 (ru)	1981-07-07
DE2624807A1 (de)	1976-12-16
US4008486A (en)	1977-02-15
FR2313774B1 (fr)	1980-07-25

Legal Events

Date	Code	Title	Description
1982-04-23	ST	Notification of lapse

Publication	Publication Date	Title
FR2301416A1 (fr)	1976-09-17	Dispositif d
FR2331451A1 (fr)	1977-06-10	Dispositif graphique
FR2321756A1 (fr)	1977-03-18	Dispositif solenoide
BE843655A (fr)	1976-12-30	Dispositif de jonction
FR2334172B1 (fr)	1984-03-23	Dispositif semi-conducteur
FR2299968A1 (fr)	1976-09-03	Dispositif d'
FR2303752A1 (fr)	1976-10-08	Dispositif d'elevation
FR2313774A1 (fr)	1976-12-31	Ensemble comprenant un dispositif a semi-conducteur et des pieces polaires
FR2273983A1 (fr)	1976-01-02	Dispositif et ensemble rivet-clou pour rivetage
FR2298776A1 (fr)	1976-08-20	Procede et dispositif
FR2300419A1 (fr)	1976-09-03	Dispositif semi-cond
FR2298966A1 (fr)	1976-08-27	Dispositif d'eplucha
FR2298855A1 (fr)	1976-08-20	Dispositif d'in
FR2301417A1 (fr)	1976-09-17	Dispositif an
FR2305784A1 (fr)	1976-10-22	Dispositif de multiplication
FR2344186A1 (fr)	1977-10-07	Dispositif tripolaire a semiconducteurs
FR2302532A1 (fr)	1976-09-24	Dispositif d'ecartometrie
FR2300253A1 (fr)	1976-09-03	Dispositif
FR2306812A1 (fr)	1976-11-05	Dispositif de transfert de paraisons
FR2311316A1 (fr)	1976-12-10	Dispositif d'echantillonnage geometrique
BE844687R (fr)	1977-01-31	Dispositif orthopedique
FR2341204A1 (fr)	1977-09-09	Dispositif semi-conducteur
FR2302533A1 (fr)	1976-09-24	Dispositif d'ecartometrie
FR2334995A1 (fr)	1977-07-08	Dispositif thermostatique
FR2302594A1 (fr)	1976-09-24	Dispositif semi-conducteur integre