NL7204574A - - Google Patents
Info
- Publication number
- NL7204574A NL7204574A NL7204574A NL7204574A NL7204574A NL 7204574 A NL7204574 A NL 7204574A NL 7204574 A NL7204574 A NL 7204574A NL 7204574 A NL7204574 A NL 7204574A NL 7204574 A NL7204574 A NL 7204574A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7204574.A NL159818B (nl) | 1972-04-06 | 1972-04-06 | Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen. |
DE2314247A DE2314247C3 (de) | 1972-04-06 | 1973-03-22 | Halbleiteranordnung mit einer biegsamen isolierenden Folie |
US00345136A US3825803A (en) | 1972-04-06 | 1973-03-26 | Semiconductor lead and heat sink structure |
CA167,681A CA974663A (en) | 1972-04-06 | 1973-04-02 | Semiconductor device package |
GB1590473A GB1418520A (en) | 1972-04-06 | 1973-04-03 | Semiconductor devices |
CH475673A CH551690A (de) | 1972-04-06 | 1973-04-03 | Halbleiteranordnung. |
IT22533/73A IT981860B (it) | 1972-04-06 | 1973-04-03 | Dispositivo semiconduttore |
JP48037490A JPS5113993B2 (de) | 1972-04-06 | 1973-04-03 | |
FR7312123A FR2179103B1 (de) | 1972-04-06 | 1973-04-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7204574.A NL159818B (nl) | 1972-04-06 | 1972-04-06 | Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen. |
Publications (2)
Publication Number | Publication Date |
---|---|
NL7204574A true NL7204574A (de) | 1973-10-09 |
NL159818B NL159818B (nl) | 1979-03-15 |
Family
ID=19815786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7204574.A NL159818B (nl) | 1972-04-06 | 1972-04-06 | Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen. |
Country Status (9)
Country | Link |
---|---|
US (1) | US3825803A (de) |
JP (1) | JPS5113993B2 (de) |
CA (1) | CA974663A (de) |
CH (1) | CH551690A (de) |
DE (1) | DE2314247C3 (de) |
FR (1) | FR2179103B1 (de) |
GB (1) | GB1418520A (de) |
IT (1) | IT981860B (de) |
NL (1) | NL159818B (de) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1478797A (en) * | 1974-09-17 | 1977-07-06 | Siemens Ag | Semiconductor arrangements |
JPS5649559Y2 (de) * | 1976-03-25 | 1981-11-19 | ||
DE2742882C2 (de) * | 1977-09-23 | 1986-10-09 | Blaupunkt-Werke Gmbh, 3200 Hildesheim | Elektronisches Bauelement |
FR2521350B1 (fr) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | Boitier porteur de puce semi-conductrice |
US4602314A (en) * | 1983-10-14 | 1986-07-22 | Intel Corporation | Heat conduction mechanism for semiconductor devices |
JPS6092829U (ja) * | 1983-11-30 | 1985-06-25 | アルプス電気株式会社 | マイクロ波トランジスタの取付構造体 |
DE3402538A1 (de) * | 1984-01-26 | 1985-08-01 | Robert Bosch Gmbh, 7000 Stuttgart | Waermeableitende befestigung |
US4835598A (en) * | 1985-06-13 | 1989-05-30 | Matsushita Electric Works, Ltd. | Wiring board |
DE3627372C3 (de) * | 1986-08-12 | 1994-04-14 | Loewe Opta Gmbh | Anordnung, bestehend aus einer Leiterplatte, einem Kühlkörper und zu kühlenden elektronischen Bauelementen |
US4962416A (en) * | 1988-04-18 | 1990-10-09 | International Business Machines Corporation | Electronic package with a device positioned above a substrate by suction force between the device and heat sink |
US4849856A (en) * | 1988-07-13 | 1989-07-18 | International Business Machines Corp. | Electronic package with improved heat sink |
JPH0310224A (ja) * | 1989-06-07 | 1991-01-17 | Sharp Corp | 表示装置 |
GB2237682A (en) * | 1989-09-28 | 1991-05-08 | Redpoint Limited | Heatsink for semiconductor devices |
GB2240425B (en) * | 1990-01-20 | 1994-01-12 | Motorola Ltd | Radio transmitter power amplifier with cooling apparatus |
US5263245A (en) * | 1992-01-27 | 1993-11-23 | International Business Machines Corporation | Method of making an electronic package with enhanced heat sinking |
US5278724A (en) * | 1992-07-06 | 1994-01-11 | International Business Machines Corporation | Electronic package and method of making same |
EP0751562B1 (de) * | 1995-06-27 | 2001-07-18 | Braun GmbH | Wärmeleite-Befestigung eines elektronischen Leistungsbauelementes auf einer Leiterplatte mit Kühlblech |
IT1285396B1 (it) * | 1996-06-04 | 1998-06-03 | Magneti Marelli Spa | Dispositivo dissipatore per circuiti integrati. |
FR2764114B1 (fr) * | 1997-06-02 | 2003-04-25 | Sgs Thomson Microelectronics | Dispositif semi-conducteur muni d'un dissipateur thermique |
JP2915892B2 (ja) * | 1997-06-27 | 1999-07-05 | 松下電子工業株式会社 | 樹脂封止型半導体装置およびその製造方法 |
US6861735B2 (en) * | 1997-06-27 | 2005-03-01 | Matsushita Electric Industrial Co., Ltd. | Resin molded type semiconductor device and a method of manufacturing the same |
JP3003638B2 (ja) * | 1997-08-05 | 2000-01-31 | 日本電気株式会社 | 半導体装置、その製造方法 |
US7023087B1 (en) * | 1998-08-05 | 2006-04-04 | Agere Systems Inc. | Integrated circuit carrier and method of manufacturing and integrated circuit |
DE19853777A1 (de) * | 1998-11-21 | 2000-05-25 | Wuerth Elektronik Gmbh & Co Kg | Kühlelement für Leiterplatten |
DE19905055A1 (de) * | 1999-02-08 | 2000-08-17 | Siemens Ag | Halbleiterbauelement mit einem Chipträger mit Öffnungen zur Kontaktierung |
US6208020B1 (en) * | 1999-02-24 | 2001-03-27 | Matsushita Electronics Corporation | Leadframe for use in manufacturing a resin-molded semiconductor device |
US6215663B1 (en) * | 2000-03-16 | 2001-04-10 | Philips Electronics North America Corporation | Printed circuit board assembly with improved thermal performance |
DE102004057494A1 (de) | 2004-11-29 | 2006-06-08 | Siemens Ag | Metallisierte Folie zur flächigen Kontaktierung |
DE102010013334A1 (de) * | 2010-03-30 | 2012-05-10 | Borgwarner Beru Systems Gmbh | Leiterplatte mit Bauelement und Verfahren zum Bestücken einer Leiterplatte |
US8987875B2 (en) | 2013-03-08 | 2015-03-24 | Delphi Technologies, Inc. | Balanced stress assembly for semiconductor devices |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3614832A (en) * | 1966-03-09 | 1971-10-26 | Ibm | Decal connectors and methods of forming decal connections to solid state devices |
US3480836A (en) * | 1966-08-11 | 1969-11-25 | Ibm | Component mounted in a printed circuit |
US3544857A (en) * | 1966-08-16 | 1970-12-01 | Signetics Corp | Integrated circuit assembly with lead structure and method |
US3624462A (en) * | 1969-07-03 | 1971-11-30 | Fairchild Camera Instr Co | Face-bonded photoarray package |
US3724068A (en) * | 1971-02-25 | 1973-04-03 | Du Pont | Semiconductor chip packaging apparatus and method |
US3711625A (en) * | 1971-03-31 | 1973-01-16 | Microsystems Int Ltd | Plastic support means for lead frame ends |
-
1972
- 1972-04-06 NL NL7204574.A patent/NL159818B/xx unknown
-
1973
- 1973-03-22 DE DE2314247A patent/DE2314247C3/de not_active Expired
- 1973-03-26 US US00345136A patent/US3825803A/en not_active Expired - Lifetime
- 1973-04-02 CA CA167,681A patent/CA974663A/en not_active Expired
- 1973-04-03 JP JP48037490A patent/JPS5113993B2/ja not_active Expired
- 1973-04-03 IT IT22533/73A patent/IT981860B/it active
- 1973-04-03 CH CH475673A patent/CH551690A/de not_active IP Right Cessation
- 1973-04-03 GB GB1590473A patent/GB1418520A/en not_active Expired
- 1973-04-04 FR FR7312123A patent/FR2179103B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2179103B1 (de) | 1978-05-26 |
NL159818B (nl) | 1979-03-15 |
JPS4917969A (de) | 1974-02-16 |
US3825803A (en) | 1974-07-23 |
DE2314247A1 (de) | 1973-10-18 |
FR2179103A1 (de) | 1973-11-16 |
DE2314247B2 (de) | 1978-10-26 |
GB1418520A (en) | 1975-12-24 |
JPS5113993B2 (de) | 1976-05-06 |
CH551690A (de) | 1974-07-15 |
DE2314247C3 (de) | 1979-07-05 |
CA974663A (en) | 1975-09-16 |
IT981860B (it) | 1974-10-10 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
VJC | Lapsed due to non-payment of the due maintenance fee for the patent or patent application | ||
NL80 | Information provided on patent owner name for an already discontinued patent |
Owner name: PHILIPS |