NL6804270A - - Google Patents

Info

Publication number
NL6804270A
NL6804270A NL6804270A NL6804270A NL6804270A NL 6804270 A NL6804270 A NL 6804270A NL 6804270 A NL6804270 A NL 6804270A NL 6804270 A NL6804270 A NL 6804270A NL 6804270 A NL6804270 A NL 6804270A
Authority
NL
Netherlands
Application number
NL6804270A
Other versions
NL161649C (nl
NL161649B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6804270A publication Critical patent/NL6804270A/xx
Publication of NL161649B publication Critical patent/NL161649B/xx
Application granted granted Critical
Publication of NL161649C publication Critical patent/NL161649C/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0156Temporary polymeric carrier or foil, e.g. for processing or transferring
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0542Continuous temporary metal layer over metal pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0733Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/243Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
NL6804270.A 1967-06-26 1968-03-27 Werkwijze voor het vervaardigen van een uit een aantal lagen opgebouwde gedruktebedrading. NL161649C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64857667A 1967-06-26 1967-06-26

Publications (3)

Publication Number Publication Date
NL6804270A true NL6804270A (de) 1968-12-27
NL161649B NL161649B (nl) 1979-09-17
NL161649C NL161649C (nl) 1980-02-15

Family

ID=24601361

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6804270.A NL161649C (nl) 1967-06-26 1968-03-27 Werkwijze voor het vervaardigen van een uit een aantal lagen opgebouwde gedruktebedrading.

Country Status (5)

Country Link
US (1) US3496072A (de)
DE (1) DE1765341B1 (de)
FR (1) FR1568439A (de)
GB (1) GB1187916A (de)
NL (1) NL161649C (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE29284E (en) * 1966-09-06 1977-06-28 Rockwell International Corporation Process for forming interconnections in a multilayer circuit board
EP0211180A3 (de) * 1985-08-02 1989-08-09 Shipley Company Inc. Herstellungsverfahren für mehrschichtige Leiterplatten
JPH0636472B2 (ja) * 1990-05-28 1994-05-11 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層配線基板の製造方法
US6462107B1 (en) 1997-12-23 2002-10-08 The Texas A&M University System Photoimageable compositions and films for printed wiring board manufacture
EP1435765A1 (de) * 2003-01-03 2004-07-07 Ultratera Corporation Verfahren zur Bildung von Verbindungen auf einem Leitermuster auf einer gedruckten Schaltungsplatte
CN111432566A (zh) * 2020-03-02 2020-07-17 博罗康佳精密科技有限公司 3oz单面厚铜铝基板精密线路的制备工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE568197A (de) * 1957-06-12
CH759162D (de) * 1961-07-13
US3325379A (en) * 1962-05-22 1967-06-13 Hazeltine Research Inc Method of making metallic patterns having continuous interconnections
FR1378158A (fr) * 1963-09-20 1964-11-13 North American Aviation Inc Procédé de fabrication de panneaux de câblage imprimé à plusieurs couches
US3319317A (en) * 1963-12-23 1967-05-16 Ibm Method of making a multilayered laminated circuit board
US3301939A (en) * 1963-12-30 1967-01-31 Prec Circuits Inc Multilayer circuit boards with plated through holes
US3340607A (en) * 1964-11-12 1967-09-12 Melpar Inc Multilayer printed circuits
US3436819A (en) * 1965-09-22 1969-04-08 Litton Systems Inc Multilayer laminate

Also Published As

Publication number Publication date
DE1765341B1 (de) 1972-02-03
US3496072A (en) 1970-02-17
FR1568439A (de) 1969-05-23
NL161649C (nl) 1980-02-15
GB1187916A (en) 1970-04-15
NL161649B (nl) 1979-09-17

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Legal Events

Date Code Title Description
NL80 Abbreviated name of patent owner mentioned of already nullified patent

Owner name: CONTROL DATA

V4 Discontinued because of reaching the maximum lifetime of a patent