NL2007712C2 - Apparatus and method for soldering contacts in a solar panel. - Google Patents
Apparatus and method for soldering contacts in a solar panel. Download PDFInfo
- Publication number
- NL2007712C2 NL2007712C2 NL2007712A NL2007712A NL2007712C2 NL 2007712 C2 NL2007712 C2 NL 2007712C2 NL 2007712 A NL2007712 A NL 2007712A NL 2007712 A NL2007712 A NL 2007712A NL 2007712 C2 NL2007712 C2 NL 2007712C2
- Authority
- NL
- Netherlands
- Prior art keywords
- laser
- solar panel
- laser beam
- receiving surface
- contacts
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 20
- 238000005476 soldering Methods 0.000 title claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 58
- 239000007788 liquid Substances 0.000 claims description 16
- 238000001514 detection method Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0734—Shaping the laser spot into an annular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Description
Apparatus and method for soldering contacts in a solar panel
The present invention relates to the assembly of solar panels and more in particular to the soldering of contacts within a solar panel by laser.
5 WO-A-2010/027265 describes an apparatus for soldering solder contacts in a solar panel wherein the solar panel comprises a substantial flat structure with a receiving surface having at least one reflecting area and at least one solder contact being positioned at some distance from the receiving surface under the reflecting area, the 10 apparatus comprising a support for supporting the solar panel, at least one laser source for generating a laser beam and laser conducting means for directing the laser beam to the at least one reflecting area on the receiving surface of the solar panel, wherein the laser source and the laser conducting means are adapted to make the laser beam heat locally the parts of the solar panel surrounding the solder contact to melt the solder 15 present on said solder contact, such method wherein laser beams are used to heat the solder connections.
In this prior art apparatus the laser is used to allow quick and, heating the whole structure causes problems as the melting temperature of the solder is higher than the 20 melting temperature of the other materials in the panel. Laser allows such a quick and local heating.
This prior art document apparatus is applicable to establish the connections in solar panels of the ‘metal wrap through’ type. These solar panels or modules comprise a 25 transparent upper layer or carrier and solar cells located there under. The transparent upper layer must be transparent to sunlight to allow the sunlight reach the surface of the solar cells. This implies that the layer is also transparent for most laser light, so that the upper surface of the solar cells forms the receiving surface.
30 Solar panels of this type comprise conducting vias in the solar cells for establishing a conducting connection between the conductor structure at the upper side of the solar cells and the conductors on the backing layer of the solar panels. Herein the connection between the conductor structure at the upper side of the solar cells is already made when the channels forming the vias are filled with conducting material or when the conductor 2 structure is established, that is during the construction of the solar cells. When these solar cells are assembled to form a solar panel, the lower side of these vias must be connected to the conductors of the backing layer through soldering or through curing of a conducting adhesive. However the location of the solder connection is covered by the 5 centre of the conducting structure at the upper side of the solar cells. These conducting structures have light reflecting properties, forming reflecting areas. Any laser energy directed to said locations would be reflected, leading to energy concentrations at less desirable locations in the apparatus and to loss of energy deposition in the locations where it is needed. Further alignment tolerances leads to an unpredictable energy 10 deposition.
The aim of the present invention is to provide a system wherein the energy provided by the laser is for a large part absorbed by the structure of the solar panel to heat the solder connection and the part reflected by the reflecting structure on the solar panel is reduced 15 as much as possible to reduce the heat loading or energy deposition in unwanted places.
This aim is reached by an apparatus of the kind referred to above wherein the cross section of the laser beam on the receiving surface comprises a first section and a second section, the first section substantially surrounding the second section and wherein 20 substantially all laser energy is directed to the first section. This allows the second section to cover the reflecting area, reducing reflection, while the surrounding, non reflecting area’s on the receiving surface can be irradiated sufficiently to supply sufficient energy into the solar cell to cause melting of the solder at the solder contacts in a controlled and predictable manner.
25
Accordingly the present invention proposes a method of soldering contacts in a solar panel comprising a substantial flat structure with a receiving surface having at least one reflecting area and at least one solder contact being positioned at some distance from the receiving surface under the reflecting area by directing at least one laser beam to the 30 at least one reflecting area on the receiving surface to make the laser beam locally heat the parts of the solar cells surrounding the solder contact to melt the solder present on said solder contact, which is characterized in that the laser beam is directed to the reflecting area wherein the cross section of the laser beam on the reflecting area 3 comprises a first section and a second section, the first section surrounding the second section and wherein substantially all laser energy is directed to the first section.
The invention also relates to a combination of an apparatus of the kind referred to above 5 and a solar panel comprising a substantial flat structure with a receiving surface with at least one reflecting area and at least one contact to be soldered being positioned at some distance from the upper surface under the receiving surface.
Although other shapes such as rectangular or polygonal are not excluded, the first 10 section of the cross section of the laser beam has preferably a substantially circular circumference. This is in line with the common practice of laser beams having a substantial circular cross section, often due to the circular cross section of fibres used for conducting laser beams. Further the circular shape leads to an even distribution of the energy over the spot area.
15
Another preferred embodiment provides the feature that the second section of the laser beam has a substantially circular circumference. This feature allows a further contribution to the even distribution of the energy.
20 One of the possibilities to generate the beam having the properties required by the invention is to use a single laser beam hitting the whole of the first section of the laser beam simultaneously. This embodiment provides an apparatus wherein the laser source and the laser conducting means are adapted to generate and direct a laser beam which hits the whole of the first section of the cross section of the laser beam at the receiving 25 surface simultaneously. This embodiment can do with relatively little control for the laser source and the laser conducting means.
Another possibility is to use a laser beam which subsequently hits parts of the first section. This embodiment provides an apparatus as claimed of the kind referred to 30 above, wherein the laser source and the laser conducting means are adapted to generate and direct a laser beam which subsequently hits different parts of the first section of the cross section of the laser beam at the receiving surface. Herein all sections of the first area are subsequently hit by the laser beam. This embodiment requires more control for the laser source and the laser conducting means.
5 4
Although a constant laser beam can be used, it is attractive when the laser beam is a pulsed laser beam and the pulses of the laser beam subsequently hit different sections of the first section of the cross section of the laser beam at the receiving surface.
In view of the large number of connections to be made in an average solar panel, it is attractive to make use of multiple laser beams to allow soldering of the panels within a time acceptable in industrial manufacturing. A corresponding embodiment provides an apparatus of the kind referred to above, wherein the laser source and the laser 10 conducting means are adapted to generate a first plurality of laser beams, each directed to a reflecting area on the receiving surface of the solar panel. Herein the word laser source may encompass multiple laser generating units.
This embodiment provides also a method of the kind referred to above wherein the solar 15 panel comprises a plurality of solder contacts covered by a corresponding reflecting area on the receiving surface and that each of the reflecting areas is irradiated by a laser beam comprising a first section and a second section, the first area substantially surrounding the second section and wherein substantially all laser energy is directed to the first section.
20
The contacts to be soldered in a solar panel are commonly arranged in a grid. This is the consequence of the solar cells having the contacts arranged in a grid and the fact that the solar cells are arranged in a grid within the solar panel themselves. To be more precisely, the contacts are often arranged in two grids within the solar cells, i.e. one grid 25 of the contacts of the rear side of the solar cells and another grid of the contacts of the vias, wherein both grids together from another grid. To allow soldering of the contacts of a solar cell in one action, it is attractive that the laser conducting means are adapted to direct the laser beams to areas on the receiving surface of a solar panel which are arranged in a grid. Herein it is important that the grids within each of the solar cells is 30 the same so that the same template can be used for each of the solar cells. Of course it cannot be excluded that, when the grid structure allows so, the contacts of a single solar cell can be soldered in two or more actions. The subsequent irradiating of the different groups of solder contacts may require adapted beam setting due to different optical coupling properties.
5
As stated before the solar cells of the type to which the invention pertains, also comprises contacts to be soldered, which are not covered by reflecting areas. Expressed otherwise these solder contacts are covered by non reflecting areas of the receiving 5 surface. For those contacts it is preferred that the laser source and the laser conducting means are adapted to generate at least one laser beam directed to an area on the receiving surface of the solar panel, wherein the energy on cross section of the laser beam on the receiving surface is distributed over both the first and the second sections. Expressed otherwise this concerns ‘solid’ laser beams, contrary to the ‘hollow’ laser 10 beams used for hidden contacts.
This embodiment also provides a method of the kind referred to above, wherein the solar panel also comprises a plurality of solder contacts covered by a non-reflecting area on the receiving surface and that all non reflecting areas are irradiated by a laser beam 15 wherein the energy on the receiving surface is distributed over both the first and the second area’s.
To allow a proper alignment between the laser and the solder contacts it is preferred that the apparatus comprises detection means for detecting the position of the solar panel 20 and control means for controlling the laser conducting means to make the position of the spots where the laser beam hits the receiving surface of the solar panel coincide with the contacts to be soldered of the solar cells. The detecting means may be adapted for detecting the position of the individual solar cells, which would offer the best accuracy, but it is not excluded that the detecting means are adapted to detect the position of parts 25 of the solar panel, not belonging to the solar cells, although this would require a substantial accuracy in the positioning of the solar cells within the solar panel. It is however also possible that the location of the actual solder contacts are detected to allow proper positioning.
30 Another embodiment provides an apparatus comprising temperature detection means adapted for detecting the temperature of parts of the solar panel wherein the detection means are adapted to control the laser source. This feature avoids overheating and corresponding damage to the solar panels. Further it allows to control the amount of power entering the solar cell and hence the development of the melting process.
6
The upper surface of the solar panel often is not completely flat to avoid the reflection of sunlight. Due to this lack of flatness directing of the laser beams to the solder spots is not always sufficiently accurate. To improve accuracy of the laser beams a preferred 5 embodiment proposes that the apparatus comprises liquid means for establishing a liquid layer with a flat upper surface on the upper surface of the solar panel. The flat surface of the liquid allows a better accuracy of the laser beams. To avoid reflections on the interface between the liquid and the upper layer of the solar panel, which will often be formed by glass, it is preferred that the refraction index of the liquid is equal to or 10 similar to that of the upper layer. Of course the liquid must be removed later from upper surface of the panel, to avoid the liquid layer hampering subsequent handling and treatment. This removal may be caused by evaporation through heating but also through tilting of the panel, possibly after removal of the confining means.
15 The same embodiment also provides a method of the kind referred to above wherein the solar panels are covered with a flat layer of liquid before the solar panels are irradiated.
Another embodiment forming a further development of the embodiment described above provides an apparatus, wherein the liquid means comprise a confining structure 20 adapted to be located on the solar panels extending substantially with their sides in the vicinity of the edges of the solar panel and means for supplying liquid to the upper surface of the solar panels within the confining means. It will be clear that the confining means could be formed by a strip forming a closed structure and extending over the circumference of the area to be covered by a liquid layer. The strip has 25 preferably a height of several millimetres only, as the layer may have a swallow depth only. To provide for a proper seal between the strip and the upper layer of the panel, the strip is preferably mad of a material providing a proper seal such as rubber or a softe plastic. Of course the confining means may be formed by a structure which can be located quickly onto the solar panels and be removed quickly as well, for instance 30 trough connection to handling device.
A preferred embodiment provides a combination of the kind referred to above wherein the solar panel comprises a transparent carrier, a number of solar cells located there under of which the upper surfaces form the receiving layer and having solder contacts at 7 their lower surfaces and a backing layer comprising solder contacts at the side of the solar cells, to be soldered to the solder contacts on the solar cells and wherein at least a number of the solder contacts is positioned under the reflecting areas.
5 Said embodiment provides also a method of the kind referred to above wherein the solar panel comprises a plurality of contacts, the contacts are arranged in groups, all the contacts of a group are irradiated simultaneously and the contacts of different groups are irradiated subsequently. Often the number of contacts within a cell fits well with the available power of laser sources so that its is attractive to irradiate the connections of 10 one solar cell simultaneously. Another argument in favour of this embodiment is the fact that the solar cells mostly have the same structure so that the same template can be used for all solar cells, simplifying the control of the laser conducting means. Further easier control of the laser by measuring the temperature of the surface of the solar panel is allowed, just as easier alignment.
15
The same embodiment provides a method wherein initially the position of the solar panel is determined, subsequently the position of laser conducting means are adapted to the position of the solar panel and finally the spots are irradiated.
20 Subsequently the present invention will be elucidated with the help of the accompanying drawings wherein show:
Figures la, lb, lc: a partial schematic top view, a cross section and a bottom view respectively of a solar cell to be used in the soldering process according to the invention; 25 Figure 2: a diagram showing a cross section of a part of a solar panel to be used in the soldering process according to the invention;
Figure 3a, 3b, 3c: diagrams showing the area where the laser beam hits the surface of the solar panel, both as in prior art as in to the invention; and Figure 4: a diagram showing a side view of an apparatus according to the 30 invention.
Initially the structure of a solar cell will briefly discussed, to provide a proper understanding of the invention. Figure la shows a top view of such a solar cell 1. The solar cell 1 is formed by a sheet or slate of a semiconductor such as silicon, which has 8 been processed to generate a voltage between the rear and front surfaces. The process includes the provision of a pn-junction, and possibly secondary structures. To access the voltage, the front surface 2 of the solar cell 1 is provided of a number of electrically conducting patterns 3. Each pattern 3 is centred around a centre 4. At the location of the 5 centre 4 of each pattern 3 a via 5 extending in the solar cell 1 has been provided. The via comprises an electrically conducting plug 6 as is shown in figure lb. The plug 6 is electrically connected with the centre 4 of the pattern 3. At its lower side the plug 6 is provided of a solder contact 7, commonly having a larger diameter than the diameter of the plug 6. Further to access the voltage generated at the lower side of the solar cell 1 a 10 number of conducting patterns 8 has been provided at the lower side of the solar cell 1. This pattern comprises a solder contact 9, which is offset from the solder contact 7 having the reverse polarity. Further the conducting pattern 8 avoids the location of the solder contact 7. Both solder contacts 7, 9 need to be permanently contacted by the electrical contacts on the backing layer to provide a functional solar panel.
15
Figure 2 shows a cross section of the semi finished product to form a solar panel 12, including solar cells 1, a transparent carrier 10 and a backing layer 11. The layers of cured plastic used to unite the solar panel 12 are designated by the number 13. The figure shows clearly the pairs of contacts 7, 17 and 9, 19 respectively to be made. These 20 include the contacts 7 which must be connected with corresponding contacts 17 on the backing layer 11 and the contacts 9, which must be connected with corresponding contacts 19 on the backing layer 11. Herein it is understood that the contacts 7, 9 and or 17, 19 have already been provided with the required quantity of solder.
25 As described in WO-A-2010/027265, the soldering is effected through irradiating with a laser beam 20 from the front side of the assembly of the solar panel 12. Herein the laser energy travels through the transparent carrier 10 and is absorbed by the silicon of the solar cells 1, which is heated so much that the accumulated heat is transferred to the contacts 7, 17, 9, 19 to make the solder melt, and after cooling down the solder 30 connection is established. This works well with the contacts 9 and 19, but it leads to problems with the contacts 7 and 17, as the laser beam directed to these contacts will hit the centre 4 of the conducting patterns which is exactly above the contacts 7, 17 to be soldered. The consequence is that the amount of laser radiation reaching the solar cells 1 to be converted into heat is limited, but, more important, that a substantial portion of the 9 laser heat is reflected and scattered. This may lead to unwanted effects in the apparatus performing the assembly. By using a laser beam 20 having a pipe like shape, or rather having a ring like cross section, these problems are at least substantially limited.
5 Hence the laser source and the laser conducting means are adapted to define a laser beam 20, having an annular cross section, wherein the laser beam 20 is centred on the centre 4 of the patterns 3. This leads to a situation as depicted in figure 3, showing the spot of the laser beam 20 or rather its cross section when it hits the upper side of the solar cells 1, forming the receiving surface. In figure 3a the situation according to the 10 prior art is shown, wherein a ‘solid’ laser beam 21 is used which hits the centre 4 of the conducting pattern 3. As a substantial part of the cross section of the laser beam 20 hits the reflecting part centre 4. This is avoided in the situation depicted in figure 3b wherein the cross section of the laser beam 20 is ring shaped and a substantial portion of the laser beam 20 is absorbed in the solar cell 1 and only a limited portion of the laser 15 energy is reflected by the centre 4. The same counts for the situation depicted in figure 3c.
The situations of the figures 3b and 3 c differ only in the alignment of the laser beam 20 relative to the reflecting centre 4 of the pattern 3. From these figures it appears that the 20 configuration of the beam according to the invention is much more tolerant for errors in the alignment than the prior art configuration. Further the ratio between the diameters of the centre of the pattern 4, the inner hollow of the laser beam 20 and of the laser beam itself is important. It has appeared that it is preferable when the diameter of the second section of the beam, transferring no energy is smaller than the diameter of the reflecting 25 part of the solar cells. Herein it is assumed that both the second section of the cross section of the beam and the reflecting part have a round shape. However the shapes may deviate from a circle and in such cases the surface area of the second area is preferably smaller than that of the reflecting part.
30 Finally figure 4 shows a diagram of the apparatus according to the invention wherein a solar panel 12 is irradiated by laser. The apparatus comprises a support for the solar panel 12 in the shape of a belt 30. Other configurations of the support are not excluded. Further the apparatus comprises a laser source 31, connected by a laser fiber 32 to a laser distributor 33, which is movable in two directions through a rail system 34. The 10 laser fiber 32, the laser distributor 33 and the rail system 34 form together the laser conducting means. Finally the apparatus comprises a camera 35 and a control unit 36, preferably formed by a digital computer and which is connected to the laser source 31, the laser conducting means 32, 33, 34 and the motor of the belt 30. The solar panel 12 is 5 shown to be composed of solar cells 1. Although not disclosed in this embodiment, the laser source may comprise multiple lasers generators.
Initially a solar panel 12 is brought to the position indicated in figure 1 by driving the belt 30. The camera 35 or other optical or mechanical means detect the presence and the 10 position of the solar panel 12. The position of the solar panel 12 is transferred to the control unit and the control unit 36 controls the laser distributor 33 and the rail system 34 such that the laser distributor 33 is position above one of the solar cells 1 within the solar panel 12, with alignment to the solder contacts present in the solar cell 1. Then the laser source 31 is switched on and the laser beams emerging from the laser distributor 15 33 are directed to the solder contacts, so that the soldering is effected. This process is repeated for all of the solar cells 1 within the solar panel 12 until all solar cells 1 are soldered and the solar panel 12 is transported further.
In the embodiment shown in figure 4 the laser distributor 33 is adapted to irradiate the 20 solder contacts of one solar cell simultaneously. The solder contacts of different solar cells are irradiated consecutively. As some of the solder contacts within one solar cell are not hidden by a reflecting area, the laser beams directed to those solder contacts are preferably ‘solid’ beams, while the laser beams directed to the ‘hidden’ solder contacts are preferably ‘hollow’ beams with a cross section of a ring. The laser light power is 25 preferably adapted for different type of contacts and for the different rates of absorption and conductance of heat.
Within the context of the invention, it is possible to use other configurations, such as the use of a laser distributor which is adapted to irradiate only a part of the number of solder 30 contacts of a solar cell, or to irradiate the contacts belonging to two or more solar cells at the same time. Herein the repetition rate of the grid is decisive to determine the number of solder contacts to be used at the same time. The invention further encompasses the use of both a continuous laser or a pulsed laser. In the embodiments disclosed above, the solar panel is stationary during the irradiation process, while the 11 laser conducting means are moveable. It is also possible to keep the laser conducting means stationary while moving the solar panel, or to move each in one direction and the other in the perpendicular. Other embodiments within the scope of the claims may be used.
5
Claims (20)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2007712A NL2007712C2 (en) | 2011-11-03 | 2011-11-03 | Apparatus and method for soldering contacts in a solar panel. |
PCT/NL2012/050769 WO2013066182A1 (en) | 2011-11-03 | 2012-11-02 | Apparatus and method for soldering contacts in a solar panel |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2007712 | 2011-11-03 | ||
NL2007712A NL2007712C2 (en) | 2011-11-03 | 2011-11-03 | Apparatus and method for soldering contacts in a solar panel. |
Publications (1)
Publication Number | Publication Date |
---|---|
NL2007712C2 true NL2007712C2 (en) | 2013-05-07 |
Family
ID=47297360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL2007712A NL2007712C2 (en) | 2011-11-03 | 2011-11-03 | Apparatus and method for soldering contacts in a solar panel. |
Country Status (2)
Country | Link |
---|---|
NL (1) | NL2007712C2 (en) |
WO (1) | WO2013066182A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090294412A1 (en) * | 2007-01-15 | 2009-12-03 | Japan Unix Co., Ltd. | Laser type soldering apparatus |
WO2010027265A2 (en) * | 2008-09-05 | 2010-03-11 | Solland Solar Energy Holding B.V. | Method of monolithic photo-voltaic module assembly |
EP2361714A1 (en) * | 2010-02-26 | 2011-08-31 | Reis Group Holding GmbH & Co. KG | Method and assembly for laser soldering |
-
2011
- 2011-11-03 NL NL2007712A patent/NL2007712C2/en not_active IP Right Cessation
-
2012
- 2012-11-02 WO PCT/NL2012/050769 patent/WO2013066182A1/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090294412A1 (en) * | 2007-01-15 | 2009-12-03 | Japan Unix Co., Ltd. | Laser type soldering apparatus |
WO2010027265A2 (en) * | 2008-09-05 | 2010-03-11 | Solland Solar Energy Holding B.V. | Method of monolithic photo-voltaic module assembly |
EP2361714A1 (en) * | 2010-02-26 | 2011-08-31 | Reis Group Holding GmbH & Co. KG | Method and assembly for laser soldering |
Also Published As
Publication number | Publication date |
---|---|
WO2013066182A1 (en) | 2013-05-10 |
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