NL2003785A - Method of forming a marker, substrate having a marker and device manufacturing method. - Google Patents
Method of forming a marker, substrate having a marker and device manufacturing method. Download PDFInfo
- Publication number
- NL2003785A NL2003785A NL2003785A NL2003785A NL2003785A NL 2003785 A NL2003785 A NL 2003785A NL 2003785 A NL2003785 A NL 2003785A NL 2003785 A NL2003785 A NL 2003785A NL 2003785 A NL2003785 A NL 2003785A
- Authority
- NL
- Netherlands
- Prior art keywords
- substrate
- features
- pattern
- marker
- pitch
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/708—Mark formation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12103308P | 2008-12-09 | 2008-12-09 | |
US12103308 | 2008-12-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL2003785A true NL2003785A (en) | 2010-06-10 |
Family
ID=42230188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL2003785A NL2003785A (en) | 2008-12-09 | 2009-11-11 | Method of forming a marker, substrate having a marker and device manufacturing method. |
Country Status (3)
Country | Link |
---|---|
US (1) | US8252491B2 (ja) |
JP (1) | JP4881426B2 (ja) |
NL (1) | NL2003785A (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2458441B1 (en) | 2010-11-30 | 2022-01-19 | ASML Netherlands BV | Measuring method, apparatus and substrate |
JP2012134425A (ja) * | 2010-12-24 | 2012-07-12 | Toshiba Corp | 半導体記憶装置、半導体ウェーハ及び半導体記憶装置の製造方法 |
KR20150087397A (ko) * | 2012-11-21 | 2015-07-29 | 케이엘에이-텐코 코포레이션 | 프로세스 호환 세그먼팅된 타겟들 및 설계 방법들 |
KR102344379B1 (ko) | 2015-05-13 | 2021-12-28 | 삼성전자주식회사 | 실딩 패턴을 갖는 반도체 소자 |
DE102015116092B4 (de) * | 2015-09-23 | 2018-06-14 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements |
CN205427436U (zh) * | 2016-03-23 | 2016-08-03 | 北京京东方光电科技有限公司 | 显示器件的对位检测设备及曝光工艺*** |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3511552B2 (ja) * | 1996-08-07 | 2004-03-29 | 松下電器産業株式会社 | 重ね合わせ測定マークおよび測定方法 |
JP3630269B2 (ja) * | 1997-08-18 | 2005-03-16 | 株式会社ルネサステクノロジ | 重ね合わせマ−クおよびこの重ね合わせマークを使用した半導体装置の製造方法 |
JP4528464B2 (ja) * | 2000-06-08 | 2010-08-18 | 株式会社東芝 | アライメント方法、重ね合わせ検査方法及びフォトマスク |
US7440105B2 (en) * | 2002-12-05 | 2008-10-21 | Kla-Tencor Technologies Corporation | Continuously varying offset mark and methods of determining overlay |
-
2009
- 2009-11-11 NL NL2003785A patent/NL2003785A/en not_active Application Discontinuation
- 2009-11-17 US US12/619,813 patent/US8252491B2/en not_active Expired - Fee Related
- 2009-12-02 JP JP2009274065A patent/JP4881426B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20100140816A1 (en) | 2010-06-10 |
US8252491B2 (en) | 2012-08-28 |
JP2010141315A (ja) | 2010-06-24 |
JP4881426B2 (ja) | 2012-02-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WDAP | Patent application withdrawn |
Effective date: 20110118 |