NL192157B - Werkwijze voor de vervaardiging van een inductantie-element. - Google Patents
Werkwijze voor de vervaardiging van een inductantie-element.Info
- Publication number
- NL192157B NL192157B NL8502843A NL8502843A NL192157B NL 192157 B NL192157 B NL 192157B NL 8502843 A NL8502843 A NL 8502843A NL 8502843 A NL8502843 A NL 8502843A NL 192157 B NL192157 B NL 192157B
- Authority
- NL
- Netherlands
- Prior art keywords
- manufacture
- inductance element
- inductance
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10628—Leaded surface mounted device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49071—Electromagnet, transformer or inductor by winding or coiling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Applications Claiming Priority (18)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21994284 | 1984-10-18 | ||
JP21994284A JPH0234443B2 (ja) | 1984-10-18 | 1984-10-18 | Indakutansusoshinokeiseihoho |
JP21994184 | 1984-10-18 | ||
JP21994184A JPS6197809A (ja) | 1984-10-18 | 1984-10-18 | インダクタンス素子 |
JP21994384A JPH0234444B2 (ja) | 1984-10-18 | 1984-10-18 | Indakutansusoshinokeiseihoho |
JP21994384 | 1984-10-18 | ||
JP22746884 | 1984-10-29 | ||
JP22746984 | 1984-10-29 | ||
JP22746684A JPS61105809A (ja) | 1984-10-29 | 1984-10-29 | インダクタンス素子の形成方法 |
JP22746984A JPH0234446B2 (ja) | 1984-10-29 | 1984-10-29 | Indakutansusoshi |
JP22746784A JPH0234445B2 (ja) | 1984-10-29 | 1984-10-29 | Indakutansusoshinokeiseihoho |
JP22746784 | 1984-10-29 | ||
JP22746684 | 1984-10-29 | ||
JP22746884A JPH0234442B2 (ja) | 1984-10-29 | 1984-10-29 | Indakutansusoshinokeiseihoho |
JP24545184 | 1984-11-20 | ||
JP59245451A JPH063769B2 (ja) | 1984-11-20 | 1984-11-20 | インダクタンス素子の形成方法 |
JP24545084 | 1984-11-20 | ||
JP59245450A JPH0614490B2 (ja) | 1984-11-20 | 1984-11-20 | インダクタンス素子の形成方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
NL8502843A NL8502843A (nl) | 1986-05-16 |
NL192157B true NL192157B (nl) | 1996-10-01 |
NL192157C NL192157C (nl) | 1997-02-04 |
Family
ID=27577628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL8502843A NL192157C (nl) | 1984-10-18 | 1985-10-17 | Werkwijze voor de vervaardiging van een inductantie-element. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4860433A (nl) |
CN (1) | CN1007943B (nl) |
DE (1) | DE3536908A1 (nl) |
FR (1) | FR2572214B1 (nl) |
GB (1) | GB2166005B (nl) |
NL (1) | NL192157C (nl) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US5476211A (en) | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
DE3615307C2 (de) * | 1986-05-06 | 1994-07-07 | Johann Leonhard Huettlinger | Spule für automatische SMD-Bestückung |
DE3615308A1 (de) * | 1986-05-06 | 1987-12-17 | Huettlinger Johann Leonhard | Verformen von anschlussdraehten von luftspulen |
FI80542C (fi) * | 1988-10-27 | 1990-06-11 | Lk Products Oy | Resonatorkonstruktion. |
EP0526484B1 (fr) * | 1990-04-19 | 1994-03-16 | GUSTAFSON, Ake | Procede d'assemblage d'une bobine sur un circuit imprime |
US5025550A (en) * | 1990-05-25 | 1991-06-25 | Trovan Limited | Automated method for the manufacture of small implantable transponder devices |
DE69200282C5 (de) * | 1991-02-25 | 2006-01-26 | Assa Abloy East Europe AG | Verfahren zur befestigung einer wicklung an einem elektronischen kreis. |
WO1993009551A1 (de) * | 1991-11-08 | 1993-05-13 | Herbert Stowasser | Transponder sowie verfahren und vorrichtung zur herstellung |
DE4340594C2 (de) * | 1992-12-01 | 1998-04-09 | Murata Manufacturing Co | Verfahren zur Herstellung und zum Einstellen der Charakteristik eines oberflächenmontierbaren chipförmigen LC-Filters |
DE4313608A1 (de) * | 1993-04-26 | 1994-10-27 | Siemens Ag | Verfahren und Vorrichtung zum Kontaktieren von Wickelgütern an Anschlußelementen |
US5372665A (en) * | 1993-09-17 | 1994-12-13 | General Motors Corporation | Thermoplastic terminal encapsulation method and apparatus |
US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US5772451A (en) * | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
US6836962B2 (en) | 1993-11-16 | 2005-01-04 | Formfactor, Inc. | Method and apparatus for shaping spring elements |
US6442831B1 (en) | 1993-11-16 | 2002-09-03 | Formfactor, Inc. | Method for shaping spring elements |
US5820014A (en) | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
EP1408337A3 (en) * | 1994-11-15 | 2007-09-19 | FormFactor, Inc. | Probe card assembly |
TW337033B (en) * | 1996-02-08 | 1998-07-21 | Matsushita Electric Ind Co Ltd | Bump forming method and its forming apparatus |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US5994152A (en) | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US6192574B1 (en) * | 1996-11-11 | 2001-02-27 | Metget Ab | Method of manufacturing and attaching a coil to an electric circuit using a circuit fixture |
US6056185A (en) * | 1998-03-18 | 2000-05-02 | Ga-Tek Inc. | Method of connecting batteries to electronic circuits |
US6351033B1 (en) * | 1999-10-06 | 2002-02-26 | Agere Systems Guardian Corp. | Multifunction lead frame and integrated circuit package incorporating the same |
US6641027B2 (en) | 2001-12-18 | 2003-11-04 | Ngk Spark Plug Co., Ltd. | Method of connecting electric leads to battery tabs |
JP3665296B2 (ja) * | 2002-01-24 | 2005-06-29 | 後藤電子 株式会社 | コイル巻線時の端末処理方法 |
DE60333074D1 (de) * | 2003-04-25 | 2010-08-05 | Assa Abloy Ab | Verfahren und Vorrichtung zur Herstellung eines Transponders |
WO2009065127A1 (en) | 2007-11-16 | 2009-05-22 | Cochlear Americas | Electrode array and method of forming an electrode array |
WO2005055363A1 (en) * | 2003-12-08 | 2005-06-16 | Cochlear Limited | Cochlear implant assembly |
EP1786004B1 (en) | 2005-11-11 | 2015-05-20 | SMARTRAC TECHNOLOGY GERMANY GmbH | Method of manufacturing an electronic component comprising an integrated circuit and a winding assembly |
EP1793395A1 (en) * | 2005-11-11 | 2007-06-06 | Sokymat Automotive GmbH | Method of manufacturing an electronic component comprising an integrated circuit and a winding assembly |
US8672667B2 (en) | 2007-07-17 | 2014-03-18 | Cochlear Limited | Electrically insulative structure having holes for feedthroughs |
US8008183B2 (en) * | 2007-10-04 | 2011-08-30 | Texas Instruments Incorporated | Dual capillary IC wirebonding |
WO2014014643A1 (en) * | 2012-07-17 | 2014-01-23 | Kulicke And Soffa Industries, Inc. | Methods of forming wire interconnect structures |
US9355774B2 (en) * | 2012-12-28 | 2016-05-31 | General Electric Company | System and method for manufacturing magnetic resonance imaging coils using ultrasonic consolidation |
KR102194727B1 (ko) * | 2015-04-29 | 2020-12-23 | 삼성전기주식회사 | 인덕터 |
JP6727747B1 (ja) * | 2019-06-17 | 2020-07-22 | 株式会社カイジョー | ワイヤボンディング方法及びワイヤボンディング装置 |
CN114716158A (zh) * | 2022-02-22 | 2022-07-08 | 上海沚明电子材料有限公司 | 导电玻璃基板及其制备方法、玻璃显示装置 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2923859A (en) * | 1955-07-20 | 1960-02-02 | Philco Corp | Manufacture of electrical appliances with printed wiring panels |
DE1834574U (de) * | 1957-12-31 | 1961-07-13 | Philips Nv | Mit einer schutzlackschicht versehenes elektrisches bauelement fuer gedruckte schaltungen. |
US3153213A (en) * | 1960-04-05 | 1964-10-13 | Stanwyck Edmund | Combined coil and coil form with integral conductive legs |
DE1185259B (de) * | 1962-04-19 | 1965-01-14 | Philips Nv | Hochfrequenzspule mit Abschirmbuchse und Regelglied |
GB1015530A (en) * | 1964-11-27 | 1966-01-05 | Philips Electronic Associated | Improvements in or relating to electrical coil assemblies |
FR1460671A (fr) * | 1965-09-14 | 1966-01-07 | Ncr Co | Machine bobineuse pour solénoïdes électriques |
US3434088A (en) * | 1967-10-17 | 1969-03-18 | Bell Telephone Labor Inc | Coil structure |
US3590480A (en) * | 1968-10-03 | 1971-07-06 | Theodore H Johnson Jr | Method of manufacturing a pulse transformer package |
US3550645A (en) * | 1968-10-03 | 1970-12-29 | Photocircuits Corp | Wire wound armature,method and apparatus for making same |
US3555477A (en) * | 1969-01-21 | 1971-01-12 | Standard Int Corp | Electrical inductor and method of making the same |
US3673681A (en) * | 1969-04-01 | 1972-07-04 | Inforex | Electrical circuit board wiring |
US3623649A (en) * | 1969-06-09 | 1971-11-30 | Gen Motors Corp | Wedge bonding tool for the attachment of semiconductor leads |
US3691497A (en) * | 1970-10-15 | 1972-09-12 | Us Army | Leadless microminiature inductance element with a closed magnetic circuit |
DE2212223A1 (de) * | 1972-03-14 | 1973-09-20 | Nordmende | Einlagige spule ohne spulenkoerper mit veraenderbarer selbstinduktion |
US3824518A (en) * | 1973-03-05 | 1974-07-16 | Piconics Inc | Miniaturized inductive component |
DE2617465C3 (de) * | 1976-04-21 | 1978-10-19 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Elektrische Spule und Verfahren zu ihrer Herstellung |
US4134091A (en) * | 1976-12-10 | 1979-01-09 | Rogers Noel A | Low cost, high efficiency radio frequency transformer |
US4245207A (en) * | 1977-05-20 | 1981-01-13 | Toko, Inc. | Miniature high frequency coil assembly or transformer |
US4103267A (en) * | 1977-06-13 | 1978-07-25 | Burr-Brown Research Corporation | Hybrid transformer device |
US4157519A (en) * | 1978-04-13 | 1979-06-05 | Amf Incorporated | Start lead dampeners on coil bobbin |
US4229722A (en) * | 1979-07-02 | 1980-10-21 | Rca Corporation | Wire coil assembly for an electrical circuit |
JPS5792807A (en) * | 1981-06-05 | 1982-06-09 | Tdk Corp | Small-sized inductor |
JPS5887810A (ja) * | 1981-11-20 | 1983-05-25 | Sony Corp | トランスの製造方法 |
JPS5943513A (ja) * | 1982-09-04 | 1984-03-10 | Toko Inc | チツプインダクタの製造方法 |
-
1985
- 1985-10-16 DE DE19853536908 patent/DE3536908A1/de active Granted
- 1985-10-17 GB GB08525605A patent/GB2166005B/en not_active Expired
- 1985-10-17 NL NL8502843A patent/NL192157C/nl not_active IP Right Cessation
- 1985-10-18 CN CN85108084A patent/CN1007943B/zh not_active Expired
- 1985-10-18 FR FR858515516A patent/FR2572214B1/fr not_active Expired - Lifetime
-
1987
- 1987-08-11 US US07/084,332 patent/US4860433A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
NL8502843A (nl) | 1986-05-16 |
CN85108084A (zh) | 1986-07-16 |
GB8525605D0 (en) | 1985-11-20 |
DE3536908A1 (de) | 1986-04-24 |
FR2572214A1 (fr) | 1986-04-25 |
CN1007943B (zh) | 1990-05-09 |
GB2166005B (en) | 1988-08-03 |
GB2166005A (en) | 1986-04-23 |
FR2572214B1 (fr) | 1993-08-27 |
NL192157C (nl) | 1997-02-04 |
DE3536908C2 (nl) | 1988-04-14 |
US4860433A (en) | 1989-08-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CNR | Transfer of rights (patent application after its laying open for public inspection) |
Free format text: SANYO ELECTRIC CO., LTD. TE MORIGUCHI |
|
BA | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
V1 | Lapsed because of non-payment of the annual fee |
Effective date: 20040501 |