NL192157B - Werkwijze voor de vervaardiging van een inductantie-element. - Google Patents

Werkwijze voor de vervaardiging van een inductantie-element.

Info

Publication number
NL192157B
NL192157B NL8502843A NL8502843A NL192157B NL 192157 B NL192157 B NL 192157B NL 8502843 A NL8502843 A NL 8502843A NL 8502843 A NL8502843 A NL 8502843A NL 192157 B NL192157 B NL 192157B
Authority
NL
Netherlands
Prior art keywords
manufacture
inductance element
inductance
Prior art date
Application number
NL8502843A
Other languages
English (en)
Other versions
NL8502843A (nl
NL192157C (nl
Original Assignee
Sanyo Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP21994284A external-priority patent/JPH0234443B2/ja
Priority claimed from JP21994384A external-priority patent/JPH0234444B2/ja
Priority claimed from JP21994184A external-priority patent/JPS6197809A/ja
Priority claimed from JP22746984A external-priority patent/JPH0234446B2/ja
Priority claimed from JP22746684A external-priority patent/JPS61105809A/ja
Priority claimed from JP22746784A external-priority patent/JPH0234445B2/ja
Priority claimed from JP22746884A external-priority patent/JPH0234442B2/ja
Priority claimed from JP59245451A external-priority patent/JPH063769B2/ja
Priority claimed from JP59245450A external-priority patent/JPH0614490B2/ja
Application filed by Sanyo Electric Co filed Critical Sanyo Electric Co
Publication of NL8502843A publication Critical patent/NL8502843A/nl
Publication of NL192157B publication Critical patent/NL192157B/nl
Publication of NL192157C publication Critical patent/NL192157C/nl
Application granted granted Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49071—Electromagnet, transformer or inductor by winding or coiling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
NL8502843A 1984-10-18 1985-10-17 Werkwijze voor de vervaardiging van een inductantie-element. NL192157C (nl)

Applications Claiming Priority (18)

Application Number Priority Date Filing Date Title
JP21994284 1984-10-18
JP21994284A JPH0234443B2 (ja) 1984-10-18 1984-10-18 Indakutansusoshinokeiseihoho
JP21994184 1984-10-18
JP21994184A JPS6197809A (ja) 1984-10-18 1984-10-18 インダクタンス素子
JP21994384A JPH0234444B2 (ja) 1984-10-18 1984-10-18 Indakutansusoshinokeiseihoho
JP21994384 1984-10-18
JP22746884 1984-10-29
JP22746984 1984-10-29
JP22746684A JPS61105809A (ja) 1984-10-29 1984-10-29 インダクタンス素子の形成方法
JP22746984A JPH0234446B2 (ja) 1984-10-29 1984-10-29 Indakutansusoshi
JP22746784A JPH0234445B2 (ja) 1984-10-29 1984-10-29 Indakutansusoshinokeiseihoho
JP22746784 1984-10-29
JP22746684 1984-10-29
JP22746884A JPH0234442B2 (ja) 1984-10-29 1984-10-29 Indakutansusoshinokeiseihoho
JP24545184 1984-11-20
JP59245451A JPH063769B2 (ja) 1984-11-20 1984-11-20 インダクタンス素子の形成方法
JP24545084 1984-11-20
JP59245450A JPH0614490B2 (ja) 1984-11-20 1984-11-20 インダクタンス素子の形成方法

Publications (3)

Publication Number Publication Date
NL8502843A NL8502843A (nl) 1986-05-16
NL192157B true NL192157B (nl) 1996-10-01
NL192157C NL192157C (nl) 1997-02-04

Family

ID=27577628

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8502843A NL192157C (nl) 1984-10-18 1985-10-17 Werkwijze voor de vervaardiging van een inductantie-element.

Country Status (6)

Country Link
US (1) US4860433A (nl)
CN (1) CN1007943B (nl)
DE (1) DE3536908A1 (nl)
FR (1) FR2572214B1 (nl)
GB (1) GB2166005B (nl)
NL (1) NL192157C (nl)

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DE3615307C2 (de) * 1986-05-06 1994-07-07 Johann Leonhard Huettlinger Spule für automatische SMD-Bestückung
DE3615308A1 (de) * 1986-05-06 1987-12-17 Huettlinger Johann Leonhard Verformen von anschlussdraehten von luftspulen
FI80542C (fi) * 1988-10-27 1990-06-11 Lk Products Oy Resonatorkonstruktion.
EP0526484B1 (fr) * 1990-04-19 1994-03-16 GUSTAFSON, Ake Procede d'assemblage d'une bobine sur un circuit imprime
US5025550A (en) * 1990-05-25 1991-06-25 Trovan Limited Automated method for the manufacture of small implantable transponder devices
DE69200282C5 (de) * 1991-02-25 2006-01-26 Assa Abloy East Europe AG Verfahren zur befestigung einer wicklung an einem elektronischen kreis.
WO1993009551A1 (de) * 1991-11-08 1993-05-13 Herbert Stowasser Transponder sowie verfahren und vorrichtung zur herstellung
DE4340594C2 (de) * 1992-12-01 1998-04-09 Murata Manufacturing Co Verfahren zur Herstellung und zum Einstellen der Charakteristik eines oberflächenmontierbaren chipförmigen LC-Filters
DE4313608A1 (de) * 1993-04-26 1994-10-27 Siemens Ag Verfahren und Vorrichtung zum Kontaktieren von Wickelgütern an Anschlußelementen
US5372665A (en) * 1993-09-17 1994-12-13 General Motors Corporation Thermoplastic terminal encapsulation method and apparatus
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US6836962B2 (en) 1993-11-16 2005-01-04 Formfactor, Inc. Method and apparatus for shaping spring elements
US6442831B1 (en) 1993-11-16 2002-09-03 Formfactor, Inc. Method for shaping spring elements
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
EP1408337A3 (en) * 1994-11-15 2007-09-19 FormFactor, Inc. Probe card assembly
TW337033B (en) * 1996-02-08 1998-07-21 Matsushita Electric Ind Co Ltd Bump forming method and its forming apparatus
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US6192574B1 (en) * 1996-11-11 2001-02-27 Metget Ab Method of manufacturing and attaching a coil to an electric circuit using a circuit fixture
US6056185A (en) * 1998-03-18 2000-05-02 Ga-Tek Inc. Method of connecting batteries to electronic circuits
US6351033B1 (en) * 1999-10-06 2002-02-26 Agere Systems Guardian Corp. Multifunction lead frame and integrated circuit package incorporating the same
US6641027B2 (en) 2001-12-18 2003-11-04 Ngk Spark Plug Co., Ltd. Method of connecting electric leads to battery tabs
JP3665296B2 (ja) * 2002-01-24 2005-06-29 後藤電子 株式会社 コイル巻線時の端末処理方法
DE60333074D1 (de) * 2003-04-25 2010-08-05 Assa Abloy Ab Verfahren und Vorrichtung zur Herstellung eines Transponders
WO2009065127A1 (en) 2007-11-16 2009-05-22 Cochlear Americas Electrode array and method of forming an electrode array
WO2005055363A1 (en) * 2003-12-08 2005-06-16 Cochlear Limited Cochlear implant assembly
EP1786004B1 (en) 2005-11-11 2015-05-20 SMARTRAC TECHNOLOGY GERMANY GmbH Method of manufacturing an electronic component comprising an integrated circuit and a winding assembly
EP1793395A1 (en) * 2005-11-11 2007-06-06 Sokymat Automotive GmbH Method of manufacturing an electronic component comprising an integrated circuit and a winding assembly
US8672667B2 (en) 2007-07-17 2014-03-18 Cochlear Limited Electrically insulative structure having holes for feedthroughs
US8008183B2 (en) * 2007-10-04 2011-08-30 Texas Instruments Incorporated Dual capillary IC wirebonding
WO2014014643A1 (en) * 2012-07-17 2014-01-23 Kulicke And Soffa Industries, Inc. Methods of forming wire interconnect structures
US9355774B2 (en) * 2012-12-28 2016-05-31 General Electric Company System and method for manufacturing magnetic resonance imaging coils using ultrasonic consolidation
KR102194727B1 (ko) * 2015-04-29 2020-12-23 삼성전기주식회사 인덕터
JP6727747B1 (ja) * 2019-06-17 2020-07-22 株式会社カイジョー ワイヤボンディング方法及びワイヤボンディング装置
CN114716158A (zh) * 2022-02-22 2022-07-08 上海沚明电子材料有限公司 导电玻璃基板及其制备方法、玻璃显示装置

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Also Published As

Publication number Publication date
NL8502843A (nl) 1986-05-16
CN85108084A (zh) 1986-07-16
GB8525605D0 (en) 1985-11-20
DE3536908A1 (de) 1986-04-24
FR2572214A1 (fr) 1986-04-25
CN1007943B (zh) 1990-05-09
GB2166005B (en) 1988-08-03
GB2166005A (en) 1986-04-23
FR2572214B1 (fr) 1993-08-27
NL192157C (nl) 1997-02-04
DE3536908C2 (nl) 1988-04-14
US4860433A (en) 1989-08-29

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Legal Events

Date Code Title Description
CNR Transfer of rights (patent application after its laying open for public inspection)

Free format text: SANYO ELECTRIC CO., LTD. TE MORIGUCHI

BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
V1 Lapsed because of non-payment of the annual fee

Effective date: 20040501