FR1077492A - Improvements to the electrolytic deposition of copper from an acid bath - Google Patents

Improvements to the electrolytic deposition of copper from an acid bath

Info

Publication number
FR1077492A
FR1077492A FR1077492DA FR1077492A FR 1077492 A FR1077492 A FR 1077492A FR 1077492D A FR1077492D A FR 1077492DA FR 1077492 A FR1077492 A FR 1077492A
Authority
FR
France
Prior art keywords
copper
acid bath
electrolytic deposition
electrolytic
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Udylite Corp
Original Assignee
Udylite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Udylite Corp filed Critical Udylite Corp
Application granted granted Critical
Publication of FR1077492A publication Critical patent/FR1077492A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
FR1077492D 1952-05-26 1953-05-21 Improvements to the electrolytic deposition of copper from an acid bath Expired FR1077492A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US290091A US2707166A (en) 1952-05-26 1952-05-26 Electrodeposition of copper from an acid bath

Publications (1)

Publication Number Publication Date
FR1077492A true FR1077492A (en) 1954-11-08

Family

ID=23114498

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1077492D Expired FR1077492A (en) 1952-05-26 1953-05-21 Improvements to the electrolytic deposition of copper from an acid bath

Country Status (6)

Country Link
US (1) US2707166A (en)
BE (1) BE520209A (en)
DE (1) DE947656C (en)
FR (1) FR1077492A (en)
GB (1) GB736252A (en)
NL (2) NL83873C (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE934508C (en) * 1954-04-23 1955-10-27 Dehydag Gmbh Process for the production of galvanic metal coatings
US2738318A (en) * 1954-12-28 1956-03-13 Udylite Res Corp Electrodeposition of copper from an acid bath
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
NL291575A (en) * 1962-04-16
US3288690A (en) * 1962-04-16 1966-11-29 Udylite Corp Electrodeposition of copper from acidic baths
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
DE2028803C3 (en) * 1970-06-06 1980-08-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Polymeric phenazonium compounds
US4316778A (en) * 1980-09-24 1982-02-23 Rca Corporation Method for the manufacture of recording substrates for capacitance electronic discs
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
AU554236B2 (en) * 1983-06-10 1986-08-14 Omi International Corp. Electrolyte composition and process for electrodepositing copper
US4551212A (en) * 1985-03-11 1985-11-05 Rca Corporation Bath and process for the electrodeposition of micromachinable copper and additive for said bath
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6709568B2 (en) 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
US20060266648A1 (en) * 2002-12-17 2006-11-30 King Mackenzie E Process analyzer for monitoring electrochemical deposition solutions
DE10261852B3 (en) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
DE10354860B4 (en) * 2003-11-19 2008-06-26 Atotech Deutschland Gmbh Halogenated or pseudohalogenated monomeric phenazinium compounds, process for their preparation and acid bath containing these compounds and process for the electrolytic deposition of a copper precipitate
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
DE102005011708B3 (en) 2005-03-11 2007-03-01 Atotech Deutschland Gmbh A polyvinylammonium compound and process for the production thereof, and an acidic solution containing the compound and a process for electrolytically depositing a copper precipitate
ES2761883T3 (en) 2017-06-16 2020-05-21 Atotech Deutschland Gmbh Aqueous acid copper electroplating bath and method for electrolytically depositing a copper coating
EP3483307B1 (en) 2017-11-09 2020-04-01 ATOTECH Deutschland GmbH Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2326999A (en) * 1940-03-11 1943-08-17 Harshaw Chem Corp Nickel plating
US2291590A (en) * 1940-03-11 1942-07-28 Harshaw Chem Corp Electrodeposition of metals
US2489538A (en) * 1941-05-24 1949-11-29 Gen Motors Corp Electrodeposition of copper
US2563360A (en) * 1941-05-24 1951-08-07 Gen Motors Corp Electrodeposition of copper
USRE24253E (en) * 1948-05-11 1956-12-11 Method of producing a composite liquid

Also Published As

Publication number Publication date
GB736252A (en) 1955-09-07
NL83873C (en)
US2707166A (en) 1955-04-26
BE520209A (en)
NL178453B (en)
DE947656C (en) 1956-08-23

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