NL154687B - SAWING MACHINE. - Google Patents

SAWING MACHINE.

Info

Publication number
NL154687B
NL154687B NL676709582A NL6709582A NL154687B NL 154687 B NL154687 B NL 154687B NL 676709582 A NL676709582 A NL 676709582A NL 6709582 A NL6709582 A NL 6709582A NL 154687 B NL154687 B NL 154687B
Authority
NL
Netherlands
Prior art keywords
sawing machine
sawing
machine
Prior art date
Application number
NL676709582A
Other languages
Dutch (nl)
Other versions
NL6709582A (en
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of NL6709582A publication Critical patent/NL6709582A/xx
Publication of NL154687B publication Critical patent/NL154687B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
NL676709582A 1966-12-27 1967-07-11 SAWING MACHINE. NL154687B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR88986A FR1512501A (en) 1966-12-27 1966-12-27 Improvements to machines for sawing elements made from fragile materials, especially crystalline

Publications (2)

Publication Number Publication Date
NL6709582A NL6709582A (en) 1968-06-28
NL154687B true NL154687B (en) 1977-10-17

Family

ID=8623000

Family Applications (1)

Application Number Title Priority Date Filing Date
NL676709582A NL154687B (en) 1966-12-27 1967-07-11 SAWING MACHINE.

Country Status (6)

Country Link
US (1) US3525324A (en)
CH (1) CH512305A (en)
DE (1) DE1652513C3 (en)
FR (1) FR1512501A (en)
GB (1) GB1158459A (en)
NL (1) NL154687B (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3831576A (en) * 1971-11-22 1974-08-27 Motorola Inc Machine and method for cutting brittle materials using a reciprocating cutting wire
FR2254948A5 (en) * 1973-12-18 1975-07-11 Motorola Inc Brittle material cutting mechanism - has grooved pulleys on axes inclined to each other guiding moving cutting wire
CH614151A5 (en) * 1976-12-27 1979-11-15 Meyer & Burger Maschinenfabrik
US4185609A (en) * 1978-06-23 1980-01-29 Frank Petera Band type lapidary saw
US4393450A (en) * 1980-08-11 1983-07-12 Trustees Of Dartmouth College Three-dimensional model-making system
US4766875A (en) * 1982-11-22 1988-08-30 Stanford University Endless wire saw having material recovery capability
US4574769A (en) * 1984-02-18 1986-03-11 Ishikawa Ken Ichi Multi-wire vibratory cutting method and apparatus
JPS61168466A (en) * 1985-01-21 1986-07-30 Yasunaga Eng Kk Faint pushup device of work
CH672452A5 (en) * 1987-08-21 1989-11-30 Photec S A
JP2673544B2 (en) * 1988-06-14 1997-11-05 株式会社日平トヤマ Cutting method for brittle materials
US4972680A (en) * 1989-09-26 1990-11-27 Cox Richard G Conversion kit for vehicle air conditioning circuit suction throttling valves
WO1991012915A1 (en) * 1990-03-01 1991-09-05 Charles Hauser Industrial device for sawing parts into thin slices
JP2516717B2 (en) * 1991-11-29 1996-07-24 信越半導体株式会社 Wire saw and its cutting method
US5564409A (en) * 1995-06-06 1996-10-15 Corning Incorporated Apparatus and method for wire cutting glass-ceramic wafers
CH691038A5 (en) * 1996-02-06 2001-04-12 Hct Shaping Systems Sa Wire sawing device for cutting thin slices.
CZ283541B6 (en) * 1996-03-06 1998-04-15 Trimex Tesla, S.R.O. Process of cutting ingots from hard materials to plates and a saw for making the same
DE19818484A1 (en) * 1998-04-24 1999-10-28 Wacker Siltronic Halbleitermat Separating semiconductor disc from crystal body
JP5054943B2 (en) * 2006-08-04 2012-10-24 Ｔｏｗａ株式会社 Cutting apparatus and cutting method
JP4995510B2 (en) * 2006-08-04 2012-08-08 Ｔｏｗａ株式会社 Cutting apparatus and cutting method
JP2008100298A (en) * 2006-10-17 2008-05-01 Seiko Epson Corp Multi-wire saw apparatus, and method for adjusting multi-wire saw apparatus
JP5571795B2 (en) 2009-10-16 2014-08-13 ダウ グローバル テクノロジーズ エルエルシー Aqueous cutting fluid for use with diamond wire saws
US9217118B2 (en) 2009-10-16 2015-12-22 Dow Global Technologies Llc Polyalkylene glycol-grafted polycarboxylate suspension and dispersing agent for cutting fluids and slurries
JP5658262B2 (en) 2009-10-16 2015-01-21 ダウ グローバル テクノロジーズ エルエルシー Cutting fluid with improved performance
WO2014086024A1 (en) 2012-12-06 2014-06-12 Dow Global Technologies Llc Aqueous cutting fluid composition

Also Published As

Publication number Publication date
CH512305A (en) 1971-09-15
DE1652513A1 (en) 1971-03-25
DE1652513B2 (en) 1975-04-17
US3525324A (en) 1970-08-25
NL6709582A (en) 1968-06-28
DE1652513C3 (en) 1975-11-27
GB1158459A (en) 1969-07-16
FR1512501A (en) 1968-02-09

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Legal Events

Date Code Title Description
VJC Lapsed due to non-payment of the due maintenance fee for the patent or patent application