NL151611B - Elektronisch ketenpakket met grote ketendichtheid. - Google Patents
Elektronisch ketenpakket met grote ketendichtheid.Info
- Publication number
- NL151611B NL151611B NL676708155A NL6708155A NL151611B NL 151611 B NL151611 B NL 151611B NL 676708155 A NL676708155 A NL 676708155A NL 6708155 A NL6708155 A NL 6708155A NL 151611 B NL151611 B NL 151611B
- Authority
- NL
- Netherlands
- Prior art keywords
- chain
- package
- electronic
- density
- high chain
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US557086A US3365620A (en) | 1966-06-13 | 1966-06-13 | Circuit package with improved modular assembly and cooling apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
NL6708155A NL6708155A (xx) | 1967-12-14 |
NL151611B true NL151611B (nl) | 1976-11-15 |
Family
ID=24224001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL676708155A NL151611B (nl) | 1966-06-13 | 1967-06-12 | Elektronisch ketenpakket met grote ketendichtheid. |
Country Status (10)
Country | Link |
---|---|
US (1) | US3365620A (xx) |
JP (1) | JPS4421015B1 (xx) |
BE (1) | BE696771A (xx) |
CH (1) | CH456706A (xx) |
DE (1) | DE1591199B1 (xx) |
ES (1) | ES341637A1 (xx) |
FR (1) | FR1521039A (xx) |
GB (1) | GB1178566A (xx) |
NL (1) | NL151611B (xx) |
SE (1) | SE323436B (xx) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1064185A (fr) * | 1967-05-23 | 1954-05-11 | Philips Nv | Procédé de fabrication d'un système d'électrodes |
US3521128A (en) * | 1967-08-02 | 1970-07-21 | Rca Corp | Microminiature electrical component having integral indexing means |
GB1213726A (en) * | 1968-01-26 | 1970-11-25 | Ferranti Ltd | Improvements relating to electrical circuit assemblies |
JPS4826069B1 (xx) * | 1968-03-04 | 1973-08-04 | ||
US3619734A (en) * | 1969-12-17 | 1971-11-09 | Rca Corp | Assembly of series connected semiconductor elements having good heat dissipation |
US3621338A (en) * | 1970-01-02 | 1971-11-16 | Fairchild Camera Instr Co | Diaphragm-connected, leadless package for semiconductor devices |
US3654528A (en) * | 1970-08-03 | 1972-04-04 | Gen Electric | Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer |
US3697817A (en) * | 1971-01-25 | 1972-10-10 | Rca Corp | Mounting attachment for a modular substrate |
US3777221A (en) * | 1972-12-18 | 1973-12-04 | Ibm | Multi-layer circuit package |
US3959579A (en) * | 1974-08-19 | 1976-05-25 | International Business Machines Corporation | Apertured semi-conductor device mounted on a substrate |
US4000509A (en) * | 1975-03-31 | 1976-12-28 | International Business Machines Corporation | High density air cooled wafer package having improved thermal dissipation |
US4193081A (en) * | 1978-03-24 | 1980-03-11 | Massachusetts Institute Of Technology | Means for effecting cooling within elements for a solar cell array |
US4292647A (en) * | 1979-04-06 | 1981-09-29 | Amdahl Corporation | Semiconductor package and electronic array having improved heat dissipation |
JPS55156395A (en) * | 1979-05-24 | 1980-12-05 | Fujitsu Ltd | Method of fabricating hollow multilayer printed board |
US4544989A (en) * | 1980-06-30 | 1985-10-01 | Sharp Kabushiki Kaisha | Thin assembly for wiring substrate |
DE3146504A1 (de) * | 1981-11-24 | 1983-06-01 | Siemens AG, 1000 Berlin und 8000 München | Kuehlkonzept fuer bausteine mit hoher verlustleistung |
EP0116396A3 (en) * | 1983-01-06 | 1985-11-06 | Crystalate Electronics Limited | Electrical assembly |
US4551787A (en) * | 1983-02-07 | 1985-11-05 | Sperry Corporation | Apparatus for use in cooling integrated circuit chips |
GB2135521A (en) * | 1983-02-16 | 1984-08-30 | Ferranti Plc | Printed circuit boards |
GB8304890D0 (en) * | 1983-02-22 | 1983-03-23 | Smiths Industries Plc | Chip-carrier substrates |
GB2135525B (en) * | 1983-02-22 | 1986-06-18 | Smiths Industries Plc | Heat-dissipating chip carrier substrates |
US4630172A (en) * | 1983-03-09 | 1986-12-16 | Printed Circuits International | Semiconductor chip carrier package with a heat sink |
US4463409A (en) * | 1983-03-22 | 1984-07-31 | Westinghouse Electric Corp. | Attitude independent evaporative cooling system |
US4559580A (en) * | 1983-11-04 | 1985-12-17 | Sundstrand Corporation | Semiconductor package with internal heat exchanger |
US4603345A (en) * | 1984-03-19 | 1986-07-29 | Trilogy Computer Development Partners, Ltd. | Module construction for semiconductor chip |
US4630096A (en) * | 1984-05-30 | 1986-12-16 | Motorola, Inc. | High density IC module assembly |
US4722914A (en) * | 1984-05-30 | 1988-02-02 | Motorola Inc. | Method of making a high density IC module assembly |
US4652065A (en) * | 1985-02-14 | 1987-03-24 | Prime Computer, Inc. | Method and apparatus for providing a carrier termination for a semiconductor package |
US4956749A (en) * | 1987-11-20 | 1990-09-11 | Hewlett-Packard Company | Interconnect structure for integrated circuits |
US4935803A (en) * | 1988-09-09 | 1990-06-19 | Motorola, Inc. | Self-centering electrode for power devices |
DE59101555D1 (de) * | 1990-08-03 | 1994-06-09 | Siemens Nixdorf Inf Syst | Einbausystem für elektrische Funktionseinheiten insbesondere für die Datentechnik. |
JPH06342990A (ja) * | 1991-02-04 | 1994-12-13 | Internatl Business Mach Corp <Ibm> | 統合冷却システム |
US5210440A (en) * | 1991-06-03 | 1993-05-11 | Vlsi Technology, Inc. | Semiconductor chip cooling apparatus |
US5315239A (en) * | 1991-12-16 | 1994-05-24 | Hughes Aircraft Company | Circuit module connections |
DE4312057A1 (de) * | 1993-04-13 | 1993-10-14 | Siegmund Maettig | Vorrichtung zum Kühlen hochintegrierter Multi-Chip-Moduls für Datenverarbeitungsanlagen mit hoher Rechnerleistung |
US6270262B1 (en) | 1999-11-10 | 2001-08-07 | Harris Corporation | Optical interconnect module |
JP3730968B2 (ja) * | 2003-03-26 | 2006-01-05 | Tdk株式会社 | スイッチング電源 |
US7538425B2 (en) | 2004-07-28 | 2009-05-26 | Delphi Technologies, Inc. | Power semiconductor package having integral fluid cooling |
AT13232U1 (de) * | 2011-12-28 | 2013-08-15 | Austria Tech & System Tech | Verfahren zum herstellen einer aus wenigstens zwei leiterplattenbereichen bestehenden leiterplatte sowie leiterplatte |
US9721870B2 (en) | 2014-12-05 | 2017-08-01 | International Business Machines Corporation | Cooling structure for electronic boards |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL178165B (nl) * | 1953-05-07 | 1900-01-01 | Bristol Myers Co | Werkwijze voor het bereiden of vervaardigen van een geneesmiddel met bloeddrukverlagende en/of bloedplaatjesaggregatie tegenwerkende activiteit; werkwijze voor het bereiden van een verbinding met een dergelijke activiteit. |
DE1778242U (de) * | 1958-09-23 | 1958-11-27 | Metz Transformatoren & App | Traegerplatte fuer gedruckte schaltungen. |
NL250171A (xx) * | 1959-06-23 | |||
DE1139894B (de) * | 1960-06-20 | 1962-11-22 | Siemens Ag | Einschubrahmen zur Aufnahme mehrerer Schaltungsplatten fuer Fernmeldeanlagen, insbesondere Fernsprechvermittlungsanlagen |
US3157828A (en) * | 1960-08-11 | 1964-11-17 | Gen Motors Corp | Encapsulated printed circuit module with heat transfer means |
DE1150724B (de) * | 1961-02-27 | 1963-06-27 | Siemens Ag | Blockfoermige Vorrichtung zum Halt fuer elektrische Bauelemente |
US3239719A (en) * | 1963-07-08 | 1966-03-08 | Sperry Rand Corp | Packaging and circuit connection means for microelectronic circuitry |
DE1895660U (de) * | 1963-11-13 | 1964-07-02 | Siemens Ag | Schutzkappe fuer elektrische bauelemente fuer fernmelde-, insbesondere fernsprechanlagen. |
-
1966
- 1966-06-13 US US557086A patent/US3365620A/en not_active Expired - Lifetime
-
1967
- 1967-03-31 JP JP2006967A patent/JPS4421015B1/ja active Pending
- 1967-04-07 BE BE696771D patent/BE696771A/xx unknown
- 1967-04-25 FR FR8474A patent/FR1521039A/fr not_active Expired
- 1967-04-27 GB GB09418/67A patent/GB1178566A/en not_active Expired
- 1967-05-29 CH CH760767A patent/CH456706A/de unknown
- 1967-06-06 DE DE19671591199 patent/DE1591199B1/de active Granted
- 1967-06-10 ES ES341637A patent/ES341637A1/es not_active Expired
- 1967-06-12 NL NL676708155A patent/NL151611B/xx unknown
- 1967-06-13 SE SE8323/67A patent/SE323436B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
FR1521039A (fr) | 1968-04-12 |
DE1591199B1 (de) | 1970-12-10 |
SE323436B (xx) | 1970-05-04 |
JPS4421015B1 (xx) | 1969-09-09 |
US3365620A (en) | 1968-01-23 |
CH456706A (de) | 1968-07-31 |
GB1178566A (en) | 1970-01-21 |
ES341637A1 (es) | 1968-07-01 |
BE696771A (xx) | 1967-09-18 |
NL6708155A (xx) | 1967-12-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
VJC | Lapsed due to non-payment of the due maintenance fee for the patent or patent application | ||
NL80 | Abbreviated name of patent owner mentioned of already nullified patent |
Owner name: I B M |