NL142048B - Gelamineerde plaat voor het vervaardigen van gedrukte bedradingen. - Google Patents
Gelamineerde plaat voor het vervaardigen van gedrukte bedradingen.Info
- Publication number
- NL142048B NL142048B NL696910528A NL6910528A NL142048B NL 142048 B NL142048 B NL 142048B NL 696910528 A NL696910528 A NL 696910528A NL 6910528 A NL6910528 A NL 6910528A NL 142048 B NL142048 B NL 142048B
- Authority
- NL
- Netherlands
- Prior art keywords
- printed wiring
- laminated plate
- wiring manufacture
- manufacture
- laminated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/923—Physical dimension
- Y10S428/924—Composite
- Y10S428/926—Thickness of individual layer specified
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12444—Embodying fibers interengaged or between layers [e.g., paper, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/1266—O, S, or organic compound in metal component
- Y10T428/12667—Oxide of transition metal or Al
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12681—Ga-, In-, Tl- or Group VA metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12778—Alternative base metals from diverse categories
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249987—With nonvoid component of specified composition
- Y10T428/24999—Inorganic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US76494768A | 1968-10-03 | 1968-10-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
NL6910528A NL6910528A (nl) | 1970-04-07 |
NL142048B true NL142048B (nl) | 1974-04-16 |
Family
ID=25072242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL696910528A NL142048B (nl) | 1968-10-03 | 1969-07-09 | Gelamineerde plaat voor het vervaardigen van gedrukte bedradingen. |
Country Status (8)
Country | Link |
---|---|
US (1) | US3585010A (nl) |
JP (1) | JPS5135711B1 (nl) |
CA (1) | CA921174A (nl) |
DE (1) | DE1934934B2 (nl) |
FR (1) | FR2019772A1 (nl) |
GB (2) | GB1293802A (nl) |
LU (1) | LU59568A1 (nl) |
NL (1) | NL142048B (nl) |
Families Citing this family (83)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3857681A (en) * | 1971-08-03 | 1974-12-31 | Yates Industries | Copper foil treatment and products produced therefrom |
BE788117A (fr) * | 1971-08-30 | 1973-02-28 | Perstorp Ab | Procede de production d'elements pour circuits imprimes |
FR2166347A1 (en) * | 1972-01-04 | 1973-08-17 | Mica Corp | Printed circuit laminate - with resistive under-cladding |
JPS534498B2 (nl) * | 1973-06-23 | 1978-02-17 | ||
JPS5856758B2 (ja) * | 1975-12-17 | 1983-12-16 | ミツイアナコンダドウハク カブシキガイシヤ | ドウハクヒヨウメンシヨリホウホウ |
JPS52145769A (en) * | 1976-05-31 | 1977-12-05 | Nippon Mining Co | Method of surface treating printed circuit copper foil |
US4061837A (en) * | 1976-06-17 | 1977-12-06 | Hutkin Irving J | Plastic-metal composite and method of making the same |
US4131517A (en) * | 1977-06-03 | 1978-12-26 | Nippon Mining Co., Ltd. | Surface treating process for copper foil for use in printed circuit |
DE2754248C2 (de) * | 1977-12-06 | 1982-07-01 | Califoil Inc., San Diego, Calif. | Verbundwerkstoff für die Herstellung von gedruckten Schaltungen |
US4311768A (en) * | 1977-12-22 | 1982-01-19 | Gould Inc. | Printed circuit board having mutually etchable copper and nickel layers |
US4190474A (en) * | 1977-12-22 | 1980-02-26 | Gould Inc. | Method of making a printed circuit board having mutually etchable copper and nickel layers |
US4260449A (en) * | 1977-12-22 | 1981-04-07 | Gould Inc. | Method of forming a printed circuit |
US4234395A (en) | 1978-10-17 | 1980-11-18 | Gould Inc. | Metal composites and laminates formed therefrom |
US4323632A (en) | 1978-10-17 | 1982-04-06 | Gould Inc. | Metal composites and laminates formed therefrom |
DE3061659D1 (en) * | 1979-04-06 | 1983-02-24 | Ibm | Method of making prints provided with masks |
JPS56155592A (en) * | 1980-04-03 | 1981-12-01 | Furukawa Circuit Foil | Copper foil for printed circuit and method of manufacturing same |
JPS56155593A (en) * | 1980-04-08 | 1981-12-01 | Furukawa Circuit Foil | Steel foil for printed circuit and method of manufacturing same |
US4357395A (en) * | 1980-08-22 | 1982-11-02 | General Electric Company | Transfer lamination of vapor deposited foils, method and product |
US4383003A (en) * | 1980-09-22 | 1983-05-10 | General Electric Company | Transfer lamination of copper thin sheets and films, method and product |
DE3040441A1 (de) * | 1980-10-27 | 1982-05-27 | Furukawa Circuit Foil Co., Ltd., Tokyo | Kupferfolie fuer eine gedruckte schaltung und verfahren zu ihrer herstellung |
US4386139A (en) * | 1980-10-31 | 1983-05-31 | Furukawa Circuit Foil Co., Ltd. | Copper foil for a printed circuit and a method for the production thereof |
WO1982002991A1 (en) * | 1981-02-26 | 1982-09-02 | Torday John | Treatment of copper foil |
US4387006A (en) * | 1981-07-08 | 1983-06-07 | Fukuda Metal Foil & Powder Co., Ltd. | Method of treating the surface of the copper foil used in printed wire boards |
US4444848A (en) * | 1982-01-04 | 1984-04-24 | Western Electric Co., Inc. | Adherent metal coatings on rubber-modified epoxy resin surfaces |
US4468293A (en) * | 1982-03-05 | 1984-08-28 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
US4454379A (en) * | 1982-05-21 | 1984-06-12 | General Electric Company | Semi-conductive, moisture barrier shielding tape and cable |
US4431685A (en) * | 1982-07-02 | 1984-02-14 | International Business Machines Corporation | Decreasing plated metal defects |
US4515671A (en) * | 1983-01-24 | 1985-05-07 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
US4490218A (en) * | 1983-11-07 | 1984-12-25 | Olin Corporation | Process and apparatus for producing surface treated metal foil |
US4549940A (en) * | 1984-04-23 | 1985-10-29 | Karwan Steven J | Method for surface treating copper foil |
US4599279A (en) * | 1984-10-01 | 1986-07-08 | Ball Corporation | Zinc alloy for reducing copper-zinc diffusion |
JPS61110794A (ja) * | 1984-11-06 | 1986-05-29 | Mitsui Mining & Smelting Co Ltd | 銅箔の表面処理方法 |
US4568431A (en) * | 1984-11-13 | 1986-02-04 | Olin Corporation | Process for producing electroplated and/or treated metal foil |
US4549941A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Electrochemical surface preparation for improving the adhesive properties of metallic surfaces |
US4549950A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Systems for producing electroplated and/or treated metal foil |
US4552627A (en) * | 1984-11-13 | 1985-11-12 | Olin Corporation | Preparation for improving the adhesion properties of metal foils |
US4532014A (en) * | 1984-11-13 | 1985-07-30 | Olin Corporation | Laser alignment system |
US4551210A (en) * | 1984-11-13 | 1985-11-05 | Olin Corporation | Dendritic treatment of metallic surfaces for improving adhesive bonding |
JPS63103075A (ja) * | 1986-10-14 | 1988-05-07 | エドワ−ド アドラ− | マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品 |
JPS642330A (en) * | 1987-06-25 | 1989-01-06 | Nippon Mining Co Ltd | Film carrier and manufacture thereof |
EP0318876A3 (en) * | 1987-11-30 | 1989-10-18 | E.I. Du Pont De Nemours And Company | Method for improving the adhesion of a metal to a fluoropolymer |
US4959278A (en) * | 1988-06-16 | 1990-09-25 | Nippon Mining Co., Ltd. | Tin whisker-free tin or tin alloy plated article and coating technique thereof |
US4961828A (en) * | 1989-04-05 | 1990-10-09 | Olin Corporation | Treatment of metal foil |
US5057193A (en) * | 1989-04-05 | 1991-10-15 | Olin Corporation | Anti-tarnish treatment of metal foil |
US5182420A (en) * | 1989-04-25 | 1993-01-26 | Cray Research, Inc. | Method of fabricating metallized chip carriers from wafer-shaped substrates |
JP2772684B2 (ja) * | 1989-09-11 | 1998-07-02 | 三井金属鉱業株式会社 | 銅箔の表面処理方法 |
US5250363A (en) * | 1989-10-13 | 1993-10-05 | Olin Corporation | Chromium-zinc anti-tarnish coating for copper foil having a dark color |
US5022968A (en) * | 1990-09-20 | 1991-06-11 | Olin Corporation | Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil |
US5230932A (en) * | 1989-10-13 | 1993-07-27 | Olin Corporation | Chromium-zinc anti-tarnish coating for copper foil |
US5098796A (en) * | 1989-10-13 | 1992-03-24 | Olin Corporation | Chromium-zinc anti-tarnish coating on copper foil |
US5127986A (en) * | 1989-12-01 | 1992-07-07 | Cray Research, Inc. | High power, high density interconnect method and apparatus for integrated circuits |
US5185502A (en) * | 1989-12-01 | 1993-02-09 | Cray Research, Inc. | High power, high density interconnect apparatus for integrated circuits |
US5069979A (en) * | 1990-03-19 | 1991-12-03 | Mitsubishi Denki Kabushiki Kaisha | Plated copper alloy material |
US5403465A (en) * | 1990-05-30 | 1995-04-04 | Gould Inc. | Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives |
JPH0819550B2 (ja) * | 1990-06-05 | 1996-02-28 | 福田金属箔粉工業株式会社 | 印刷回路用銅箔の表面処理方法 |
TW208110B (nl) * | 1990-06-08 | 1993-06-21 | Furukawa Circuit Foil Kk | |
US5336558A (en) * | 1991-06-24 | 1994-08-09 | Minnesota Mining And Manufacturing Company | Composite article comprising oriented microstructures |
US6042711A (en) * | 1991-06-28 | 2000-03-28 | Gould Electronics, Inc. | Metal foil with improved peel strength and method for making said foil |
US5861076A (en) * | 1991-07-19 | 1999-01-19 | Park Electrochemical Corporation | Method for making multi-layer circuit boards |
JPH0787270B2 (ja) * | 1992-02-19 | 1995-09-20 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
KR960701581A (ko) * | 1993-03-05 | 1996-02-24 | 제임즈 더블유. 크록커 | 인쇄배선 회로기판용 드럼측면이 처리된 금속호일 및 래미네이트 및 그 제조방법(drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture) |
US5622782A (en) * | 1993-04-27 | 1997-04-22 | Gould Inc. | Foil with adhesion promoting layer derived from silane mixture |
TW317575B (nl) * | 1994-01-21 | 1997-10-11 | Olin Corp | |
TW289900B (nl) | 1994-04-22 | 1996-11-01 | Gould Electronics Inc | |
WO1996017503A1 (fr) * | 1994-12-01 | 1996-06-06 | Ibiden Co., Ltd. | Carte a circuit imprime multicouche et son procede de production |
US5679230A (en) * | 1995-08-21 | 1997-10-21 | Oak-Mitsui, Inc. | Copper foil for printed circuit boards |
TW420729B (en) * | 1996-02-12 | 2001-02-01 | Gould Electronics Inc | A non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath |
US6224991B1 (en) * | 1999-09-13 | 2001-05-01 | Yates Foil Usa, Inc. | Process for electrodeposition of barrier layer over copper foil bonding treatment, products thereof and electrolyte useful in such process |
KR100442564B1 (ko) | 2001-10-23 | 2004-07-30 | 엘지전선 주식회사 | 아연-코발트-비소 합금의 배리어층이 형성된 피씨비용전해동박 및 그 표면 처리방법 |
CN1329979C (zh) * | 2002-12-26 | 2007-08-01 | 三井金属矿业株式会社 | 电子部件封装用薄膜载带及其制造方法 |
JP2006024902A (ja) * | 2004-06-07 | 2006-01-26 | Shinko Electric Ind Co Ltd | 極細線パターンを有する配線基板の製造方法および配線基板 |
JP4986060B2 (ja) | 2005-06-23 | 2012-07-25 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔 |
JP4938130B2 (ja) | 2008-06-17 | 2012-05-23 | Jx日鉱日石金属株式会社 | 印刷回路基板用銅箔及び印刷回路基板用銅張積層板 |
JP5638952B2 (ja) * | 2008-07-22 | 2014-12-10 | 古河電気工業株式会社 | 表面処理銅箔及び銅張積層板 |
EP2439311A4 (en) | 2009-06-05 | 2014-04-16 | Jx Nippon Mining & Metals Corp | COPPER FOIL FOR A SEMICONDUCTOR PACKAGE SUBSTRATE AND SUBSTRATE FOR A SEMICONDUCTOR PACK |
CN103125149B (zh) | 2010-09-27 | 2016-09-14 | 吉坤日矿日石金属株式会社 | 印刷电路板用铜箔、其制造方法、印刷电路板用树脂基板以及印刷电路板 |
JP2012158828A (ja) * | 2011-02-03 | 2012-08-23 | Furukawa Electric Co Ltd:The | 表面処理銅箔及びその製造方法 |
JP5919656B2 (ja) * | 2011-06-14 | 2016-05-18 | 大日本印刷株式会社 | 太陽電池用集電シートの配線パターン形成用の導電性基材 |
EP2722417B1 (en) * | 2011-06-14 | 2018-06-27 | Dai Nippon Printing Co., Ltd. | Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells |
US9663868B2 (en) * | 2011-12-28 | 2017-05-30 | Mitsui Mining & Smelting Co., Ltd. | Electro-deposited copper-alloy foil and electro-deposited copper-alloy foil provided with carrier foil |
JP5204908B1 (ja) | 2012-03-26 | 2013-06-05 | Jx日鉱日石金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板 |
US9204547B2 (en) | 2013-04-17 | 2015-12-01 | The United States of America as Represented by the Secratary of the Army | Non-planar printed circuit board with embedded electronic components |
DE102014001631A1 (de) * | 2014-02-07 | 2015-04-30 | Audi Ag | Elektrische Leitungsverbindung zwischen einem Getriebesteuergerät und einer elektrischen Getriebekomponente |
-
1968
- 1968-10-03 US US764947A patent/US3585010A/en not_active Expired - Lifetime
-
1969
- 1969-07-09 NL NL696910528A patent/NL142048B/nl unknown
- 1969-07-10 DE DE1934934A patent/DE1934934B2/de not_active Ceased
- 1969-09-02 CA CA060969A patent/CA921174A/en not_active Expired
- 1969-09-16 FR FR6931438A patent/FR2019772A1/fr active Pending
- 1969-09-30 GB GB28686/72A patent/GB1293802A/en not_active Expired
- 1969-09-30 GB GB48099/69A patent/GB1293801A/en not_active Expired
- 1969-10-02 LU LU59568D patent/LU59568A1/xx unknown
- 1969-10-02 JP JP44078209A patent/JPS5135711B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
GB1293802A (en) | 1972-10-25 |
NL6910528A (nl) | 1970-04-07 |
JPS5135711B1 (nl) | 1976-10-04 |
GB1293801A (en) | 1972-10-25 |
DE1934934A1 (de) | 1970-04-09 |
LU59568A1 (nl) | 1970-01-09 |
DE1934934B2 (de) | 1978-03-23 |
US3585010A (en) | 1971-06-15 |
FR2019772A1 (nl) | 1970-07-10 |
CA921174A (en) | 1973-02-13 |
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