MY188184A - Ni-based target material excellent in sputtering property - Google Patents

Ni-based target material excellent in sputtering property

Info

Publication number
MY188184A
MY188184A MYPI2017702870A MYPI2017702870A MY188184A MY 188184 A MY188184 A MY 188184A MY PI2017702870 A MYPI2017702870 A MY PI2017702870A MY PI2017702870 A MYPI2017702870 A MY PI2017702870A MY 188184 A MY188184 A MY 188184A
Authority
MY
Malaysia
Prior art keywords
target material
phase
content
total
alloy
Prior art date
Application number
MYPI2017702870A
Inventor
UNO Miyuki
Hasegawa Hiroyuki
Original Assignee
Sanyo Special Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Special Steel Co Ltd filed Critical Sanyo Special Steel Co Ltd
Publication of MY188184A publication Critical patent/MY188184A/en

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62—Record carriers characterised by the selection of the material
    • G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
    • G11B5/7368—Non-polymeric layer under the lowermost magnetic recording layer
    • G11B5/7379—Seed layer, e.g. at least one non-magnetic layer is specifically adapted as a seed or seeding layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/18—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Magnetic Record Carriers (AREA)
  • Thin Magnetic Films (AREA)

Abstract

A problem of the present invention is to provide a Ni-based alloy sputtering target material that is capable of obtaining a strong pass-through-flux and has a low magnetic permeability and a high use efficiency. In order to solve such a problem, there is provided a Ni-based sputtering target material including a (Nix-Fev-Coz)-M alloy, wherein: X, Y, and z represent the ratios of the content of Ni, the content of Fe, and the content of Co to the total content of Ni, Fe, and Co, respectively; the alloy includes as M elements, 2 to 20 at.% in total of one or more M1 elements selected from W, Mo, Ta, Cr, V, and Nb, and 0 to 10 at.% in total of one or more M2 elements selected from Al, Ga, In, Si, Ge, Sn, Zr, Ti, Hf, B, Cu, P, C, and Ru, and the balance of Ni, Fe, Co and unavoidable impurities; assuming that X + Y + Z = 100 is satisfied, 20 < X < 98, 0 < Y < 50, and 0 < Z < 60 are satisfied; and the alloy includes a microstructure that contains a Ni-M phase as a matrix phase, wherein an Fe phase and/or a Co phase are dispersed in the matrix phase.
MYPI2017702870A 2015-02-09 2016-02-04 Ni-based target material excellent in sputtering property MY188184A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015023101A JP6581780B2 (en) 2015-02-09 2015-02-09 Ni-based target material with excellent sputtering properties
PCT/JP2016/053350 WO2016129492A1 (en) 2015-02-09 2016-02-04 Ni BASED TARGET MATERIAL WITH EXCELLENT SPUTTERING PROPERTIES

Publications (1)

Publication Number Publication Date
MY188184A true MY188184A (en) 2021-11-24

Family

ID=56614649

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017702870A MY188184A (en) 2015-02-09 2016-02-04 Ni-based target material excellent in sputtering property

Country Status (6)

Country Link
JP (1) JP6581780B2 (en)
CN (1) CN107250424A (en)
MY (1) MY188184A (en)
SG (2) SG11201706370SA (en)
TW (1) TW201700742A (en)
WO (1) WO2016129492A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7385370B2 (en) * 2019-05-07 2023-11-22 山陽特殊製鋼株式会社 Ni-based sputtering target and magnetic recording medium
WO2021054136A1 (en) * 2019-09-19 2021-03-25 日立金属株式会社 Target
CN115161603B (en) * 2022-05-17 2023-02-21 广东欧莱高新材料股份有限公司 Production process of high-purity multi-element alloy rotary sputtering target for high-definition liquid crystal display of high generation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4941920A (en) * 1987-11-25 1990-07-17 Hitachi Metals, Ltd. Sintered target member and method of producing same
US20030228238A1 (en) * 2002-06-07 2003-12-11 Wenjun Zhang High-PTF sputtering targets and method of manufacturing
JP5403418B2 (en) * 2008-09-22 2014-01-29 日立金属株式会社 Method for producing Co-Fe-Ni alloy sputtering target material
JP5370917B2 (en) * 2009-04-20 2013-12-18 日立金属株式会社 Method for producing Fe-Co-Ni alloy sputtering target material
JP5726615B2 (en) * 2010-11-22 2015-06-03 山陽特殊製鋼株式会社 Alloy for seed layer of magnetic recording medium and sputtering target material
JP5751093B2 (en) * 2011-08-24 2015-07-22 新日鐵住金株式会社 Surface-treated hot-dip galvanized steel

Also Published As

Publication number Publication date
TW201700742A (en) 2017-01-01
CN107250424A (en) 2017-10-13
WO2016129492A1 (en) 2016-08-18
SG10201906538UA (en) 2019-08-27
JP6581780B2 (en) 2019-09-25
SG11201706370SA (en) 2017-09-28
JP2016145394A (en) 2016-08-12

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