MY183124A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- MY183124A MY183124A MYPI2017702498A MYPI2017702498A MY183124A MY 183124 A MY183124 A MY 183124A MY PI2017702498 A MYPI2017702498 A MY PI2017702498A MY PI2017702498 A MYPI2017702498 A MY PI2017702498A MY 183124 A MY183124 A MY 183124A
- Authority
- MY
- Malaysia
- Prior art keywords
- leads
- linking
- lead frames
- unit lead
- lead frame
- Prior art date
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016137817A JP6738676B2 (ja) | 2016-07-12 | 2016-07-12 | リードフレーム |
Publications (1)
Publication Number | Publication Date |
---|---|
MY183124A true MY183124A (en) | 2021-02-15 |
Family
ID=60995768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2017702498A MY183124A (en) | 2016-07-12 | 2017-07-07 | Lead frame |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6738676B2 (ja) |
CN (1) | CN107611113B (ja) |
MY (1) | MY183124A (ja) |
TW (1) | TWI703695B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020262533A1 (ja) * | 2019-06-28 | 2020-12-30 | ローム株式会社 | 電子装置および電子装置の実装構造 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03296254A (ja) * | 1990-02-06 | 1991-12-26 | Dainippon Printing Co Ltd | リードフレーム |
US5202577A (en) * | 1990-02-06 | 1993-04-13 | Dai Nippon Printing Co., Ltd. | Leadframe having a particular dam bar |
JP2866816B2 (ja) * | 1995-03-31 | 1999-03-08 | 日鉄セミコンダクター株式会社 | リードフレーム |
JP3483994B2 (ja) * | 1995-08-31 | 2004-01-06 | ローム株式会社 | 樹脂パッケージ型半導体装置の成形用金型装置、および半導体装置の樹脂パッケージング方法 |
JP2000188366A (ja) * | 1998-12-24 | 2000-07-04 | Hitachi Ltd | 半導体装置 |
CN100416815C (zh) * | 2003-02-21 | 2008-09-03 | 先进互连技术有限公司 | 包括无源器件的引线框架及其形成方法 |
JP2005026466A (ja) * | 2003-07-02 | 2005-01-27 | Renesas Technology Corp | 半導体装置およびリードフレーム |
JP2005166695A (ja) * | 2003-11-28 | 2005-06-23 | Mitsui High Tec Inc | リードフレーム及び半導体装置の製造方法 |
TWI280399B (en) * | 2004-10-01 | 2007-05-01 | Yamaha Corp | Physical amount sensor and lead frame used therein |
JP5467506B2 (ja) * | 2009-10-05 | 2014-04-09 | 大日本印刷株式会社 | 樹脂封止型半導体装置及びその製造方法 |
-
2016
- 2016-07-12 JP JP2016137817A patent/JP6738676B2/ja active Active
-
2017
- 2017-07-07 MY MYPI2017702498A patent/MY183124A/en unknown
- 2017-07-10 CN CN201710555426.7A patent/CN107611113B/zh active Active
- 2017-07-12 TW TW106123268A patent/TWI703695B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN107611113B (zh) | 2022-02-08 |
TWI703695B (zh) | 2020-09-01 |
CN107611113A (zh) | 2018-01-19 |
JP2018010935A (ja) | 2018-01-18 |
TW201803061A (zh) | 2018-01-16 |
JP6738676B2 (ja) | 2020-08-12 |
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