MY174169A - Electro-deposited copper foil and surface-treated copper foil manufactured by using the electro-deposited copper foil - Google Patents

Electro-deposited copper foil and surface-treated copper foil manufactured by using the electro-deposited copper foil

Info

Publication number
MY174169A
MY174169A MYPI2019003304A MYPI2019003304A MY174169A MY 174169 A MY174169 A MY 174169A MY PI2019003304 A MYPI2019003304 A MY PI2019003304A MY PI2019003304 A MYPI2019003304 A MY PI2019003304A MY 174169 A MY174169 A MY 174169A
Authority
MY
Malaysia
Prior art keywords
copper foil
electro
deposited copper
deposited
mpa
Prior art date
Application number
MYPI2019003304A
Other languages
English (en)
Inventor
Sakiko Tomonaga
Koichi Miyake
Kazutaka Hozumi
Hiroaki Nakahara
Yasuhiro Shibata
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY174169A publication Critical patent/MY174169A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
MYPI2019003304A 2013-01-31 2014-01-30 Electro-deposited copper foil and surface-treated copper foil manufactured by using the electro-deposited copper foil MY174169A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013017620 2013-01-31

Publications (1)

Publication Number Publication Date
MY174169A true MY174169A (en) 2020-03-12

Family

ID=51262367

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI2019003304A MY174169A (en) 2013-01-31 2014-01-30 Electro-deposited copper foil and surface-treated copper foil manufactured by using the electro-deposited copper foil
MYPI2015702490A MY173524A (en) 2013-01-31 2014-01-30 Electro-deposited copper foil, method of manufacturing electro-deposited copper foil, and surface-treated copper foil manufactured by using electro-deposited copper foil

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI2015702490A MY173524A (en) 2013-01-31 2014-01-30 Electro-deposited copper foil, method of manufacturing electro-deposited copper foil, and surface-treated copper foil manufactured by using electro-deposited copper foil

Country Status (7)

Country Link
JP (2) JP6373764B2 (ja)
KR (2) KR102227681B1 (ja)
CN (1) CN104955988B (ja)
MY (2) MY174169A (ja)
PH (1) PH12015501706A1 (ja)
TW (1) TWI518210B (ja)
WO (1) WO2014119656A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102122425B1 (ko) * 2015-06-18 2020-06-12 케이씨에프테크놀로지스 주식회사 리튬 이차전지용 전해동박 및 이를 포함하는 리튬 이차전지
KR101897474B1 (ko) 2015-06-26 2018-09-12 케이씨에프테크놀로지스 주식회사 리튬 이차전지용 전해동박 및 이를 포함하는 리튬 이차전지
JP6067910B1 (ja) * 2015-11-04 2017-01-25 古河電気工業株式会社 電解銅箔、その電解銅箔を用いたリチウムイオン二次電池
JP6440656B2 (ja) * 2016-07-12 2018-12-19 古河電気工業株式会社 電解銅箔
KR102646185B1 (ko) * 2017-02-27 2024-03-08 에스케이넥실리스 주식회사 우수한 접착력을 갖는 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
JP6757773B2 (ja) * 2018-09-26 2020-09-23 古河電気工業株式会社 電解銅箔
JP6827022B2 (ja) * 2018-10-03 2021-02-10 Ｊｘ金属株式会社 フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
CN111455414A (zh) * 2020-03-09 2020-07-28 深圳市惟华电子科技有限公司 一种用于生产渐变式电解铜箔的添加剂
KR20220043617A (ko) * 2020-09-29 2022-04-05 에스케이넥실리스 주식회사 고강도 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지 및 그것의 제조방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001011685A (ja) * 1999-06-30 2001-01-16 Mitsui Mining & Smelting Co Ltd 電解銅箔およびその製造方法
KR100454270B1 (ko) * 2002-11-29 2004-10-26 엘지전선 주식회사 저조도 전해동박의 제조방법 및 전해동박
US20060191798A1 (en) * 2003-04-03 2006-08-31 Fukuda Metal Foil & Powder Co., Ltd. Electrolytic copper foil with low roughness surface and process for producing the same
JP4273309B2 (ja) 2003-05-14 2009-06-03 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
JP5255229B2 (ja) * 2006-04-28 2013-08-07 三井金属鉱業株式会社 電解銅箔、その電解銅箔を用いた表面処理銅箔及びその表面処理銅箔を用いた銅張積層板並びにその電解銅箔の製造方法
US9307639B2 (en) * 2006-04-28 2016-04-05 Mitsui Mining & Smelting Co., Ltd. Electro-deposited copper foil, surface-treated copper foil using the electro-deposited copper foil and copper clad laminate using the surface-treated copper foil, and a method for manufacturing the electro-deposited copper foil
JP2008285727A (ja) 2007-05-18 2008-11-27 Furukawa Circuit Foil Kk 高抗張力電解銅箔及びその製造方法
JP5588607B2 (ja) 2007-10-31 2014-09-10 三井金属鉱業株式会社 電解銅箔及びその電解銅箔の製造方法
US20110171491A1 (en) * 2008-07-07 2011-07-14 Furukawa Electric Co., Ltd. Electrodeposited copper foil and copper clad laminate
JP5598700B2 (ja) 2010-02-25 2014-10-01 福田金属箔粉工業株式会社 電解銅箔及びその製造方法
KR101385761B1 (ko) 2010-07-01 2014-04-17 미쓰이금속광업주식회사 전해 동박 및 그 제조 방법
EP2644753B1 (en) * 2010-11-22 2016-05-11 Mitsui Mining & Smelting Co., Ltd. Surface-treated copper foil
EP2654111B1 (en) 2010-12-27 2018-04-18 Furukawa Electric Co., Ltd. Lithium-ion secondary battery, electrode for secondary battery, and electrolytic copper foil for secondary battery electrode
JP5771392B2 (ja) 2010-12-28 2015-08-26 日本電解株式会社 電解銅箔およびその製造方法
KR20140041804A (ko) * 2011-06-30 2014-04-04 후루카와 덴키 고교 가부시키가이샤 전해 동박, 상기 전해 동박의 제조 방법 및 상기 전해 동박을 집전체로 하는 리튬 이온 이차 전지
WO2013176115A1 (ja) * 2012-05-22 2013-11-28 三井金属鉱業株式会社 銅箔、負極集電体及び非水系二次電池の負極材

Also Published As

Publication number Publication date
JP2018165411A (ja) 2018-10-25
KR20190006075A (ko) 2019-01-16
JPWO2014119656A1 (ja) 2017-01-26
KR102227681B1 (ko) 2021-03-15
MY173524A (en) 2020-01-31
TWI518210B (zh) 2016-01-21
JP6529646B2 (ja) 2019-06-12
JP6373764B2 (ja) 2018-08-15
TW201437435A (zh) 2014-10-01
CN104955988B (zh) 2018-01-30
PH12015501706A1 (en) 2015-10-12
KR102272695B1 (ko) 2021-07-05
CN104955988A (zh) 2015-09-30
WO2014119656A1 (ja) 2014-08-07
KR20150114484A (ko) 2015-10-12

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