MY161431A - A method for eliminating aluminium surface defects - Google Patents

A method for eliminating aluminium surface defects

Info

Publication number
MY161431A
MY161431A MYPI2013003677A MYPI2013003677A MY161431A MY 161431 A MY161431 A MY 161431A MY PI2013003677 A MYPI2013003677 A MY PI2013003677A MY PI2013003677 A MYPI2013003677 A MY PI2013003677A MY 161431 A MY161431 A MY 161431A
Authority
MY
Malaysia
Prior art keywords
metal
surface defects
eliminating
aluminium surface
rinsing
Prior art date
Application number
MYPI2013003677A
Inventor
Bin Man Mazlin
Fairuz Bin Amir Mohammad
Ramdzan Buyong Muhamad
Binti Mohamad Zaliha
Binti Mohd Zain Azlina
Original Assignee
Mimos Berhad
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mimos Berhad filed Critical Mimos Berhad
Priority to MYPI2013003677A priority Critical patent/MY161431A/en
Priority to PCT/MY2014/000139 priority patent/WO2015053605A1/en
Publication of MY161431A publication Critical patent/MY161431A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/24—Cleaning or pickling metallic material with solutions or molten salts with neutral solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

THE PRESENT INVENTION RELATES TO A METHOD FOR ELIMINATING ALUMINIUM SURFACE DEFECTS ON LARGE EXPOSED METAL COMPRISING: CONDUCTING A POST PAD ETCHING TREATMENT (100) ON THE METAL; COLD-RINSING THE METAL (200); AND DRYING THE METAL (300) USING NITROGEN; CHARACTERIZED IN THAT THE STEPS OF CONDUCTING A POST PAD ETCHING TREATMENT (100) ON THE METAL, COLD-RINSING THE METAL (200); AND DRYING THE METAL (300) USING NITROGEN INVOLVE CHEMICAL-FREE SOLVENT. THE PRESENT INVENTION IS ADVANTAGEOUS AS IT IS EFFECTIVE IN ELIMINATING THE WHITE HAZE EFFECT. THE ADVANTAGE OF USE OF DEIONIZED (DI) WATER ONLY CLEANING METHOD IS THAT IT IS MORE ENVIRONMENT-FRIENDLY. MOST ILLUSTRATIVE
MYPI2013003677A 2013-10-07 2013-10-07 A method for eliminating aluminium surface defects MY161431A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
MYPI2013003677A MY161431A (en) 2013-10-07 2013-10-07 A method for eliminating aluminium surface defects
PCT/MY2014/000139 WO2015053605A1 (en) 2013-10-07 2014-05-30 A method for eliminating aluminium surface defects

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2013003677A MY161431A (en) 2013-10-07 2013-10-07 A method for eliminating aluminium surface defects

Publications (1)

Publication Number Publication Date
MY161431A true MY161431A (en) 2017-04-14

Family

ID=51589482

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013003677A MY161431A (en) 2013-10-07 2013-10-07 A method for eliminating aluminium surface defects

Country Status (2)

Country Link
MY (1) MY161431A (en)
WO (1) WO2015053605A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW466545B (en) * 2000-03-30 2001-12-01 United Microelectronics Corp Method for removing pad nodule
TWI242805B (en) * 2001-02-15 2005-11-01 United Microelectronics Corp Post metal etch cleaning method
US7585754B2 (en) * 2008-01-10 2009-09-08 Winbond Electronics Corp. Method of forming bonding pad opening
CN103077880B (en) * 2012-07-25 2015-09-30 上海华力微电子有限公司 A kind of process of the titanium nitride residue processed on aluminium welding pad
MY181531A (en) * 2013-01-18 2020-12-25 Mimos Berhad Method of fabricating a bond pad in a semiconductor device

Also Published As

Publication number Publication date
WO2015053605A1 (en) 2015-04-16

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