MY139624A - Stripping and cleaning compositions for microelectronics - Google Patents

Stripping and cleaning compositions for microelectronics

Info

Publication number
MY139624A
MY139624A MYPI20044536A MY139624A MY 139624 A MY139624 A MY 139624A MY PI20044536 A MYPI20044536 A MY PI20044536A MY 139624 A MY139624 A MY 139624A
Authority
MY
Malaysia
Prior art keywords
cleaning compositions
substrates
ions
compositions
microelectronics
Prior art date
Application number
Inventor
Joseph M Ilardi
David C Skee
Sean M Kane
Karen E Trovalli
Original Assignee
Avantor Performance Mat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avantor Performance Mat Inc filed Critical Avantor Performance Mat Inc
Publication of MY139624A publication Critical patent/MY139624A/en

Links

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)

Abstract

AQUEOUS CLEANING COMPOSITIONS AND METHOD OF USING THE CLEANING COMPOSITIONS FOR CLEANING MICROELECTRONIC SUBSTRATES, WHICH COMPOSITIONS ARE ABLE TO ESSENTIALLY COMPLETELY CLEAN SUCH SUBSTRATES AND PRODUCE ESSENTIALLY NO METAL CORROSION OF THE METAL ELEMENTS OF SUCH SUBSTRATES. THE AQUEOUS CLEANING COMPOSITIONS OF THIS INVENTION HAVE (a) WATER, (b) AT LEAST ONE OF AMMONIUM AND QUATERNARY AMMONIUM IONS AND (c) AT LEAST ONE OF HYPOPHOSPHITE (H2PO2) AND/OR PHOSPHITE (HPO32-) IONS. THE CLEANING COMPOSITIONS ALSO MAY CONTAIN FLUORIDE IONS. OPTIONALLY, THE COMPOSITION MAY CONTAIN OTHER COMPONENTS SUCH AS ORGANIC SOLVENTS, OXIDIZING AGENTS, SURFACTANTS, CORROSION INHIBITORS AND METAL COMPLEXING AGENTS.
MYPI20044536 2004-03-01 2004-11-02 Stripping and cleaning compositions for microelectronics MY139624A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54897604P 2004-03-01 2004-03-01

Publications (1)

Publication Number Publication Date
MY139624A true MY139624A (en) 2009-10-30

Family

ID=45756837

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20044536 MY139624A (en) 2004-03-01 2004-11-02 Stripping and cleaning compositions for microelectronics

Country Status (2)

Country Link
MY (1) MY139624A (en)
TW (1) TWI354020B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150104952A1 (en) * 2013-10-11 2015-04-16 Ekc Technology, Inc. Method and composition for selectively removing metal hardmask and other residues from semiconductor device substrates comprising low-k dielectric material and copper
CN114908341B (en) * 2022-07-18 2022-09-27 深圳市板明科技股份有限公司 Special surface treating agent for PCB chemical nickel-palladium-gold plating layer and preparation method thereof

Also Published As

Publication number Publication date
TWI354020B (en) 2011-12-11
TW200536936A (en) 2005-11-16

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