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Application filed by Avantor Performance Mat IncfiledCriticalAvantor Performance Mat Inc
Publication of MY139624ApublicationCriticalpatent/MY139624A/en
AQUEOUS CLEANING COMPOSITIONS AND METHOD OF USING THE CLEANING COMPOSITIONS FOR CLEANING MICROELECTRONIC SUBSTRATES, WHICH COMPOSITIONS ARE ABLE TO ESSENTIALLY COMPLETELY CLEAN SUCH SUBSTRATES AND PRODUCE ESSENTIALLY NO METAL CORROSION OF THE METAL ELEMENTS OF SUCH SUBSTRATES. THE AQUEOUS CLEANING COMPOSITIONS OF THIS INVENTION HAVE (a) WATER, (b) AT LEAST ONE OF AMMONIUM AND QUATERNARY AMMONIUM IONS AND (c) AT LEAST ONE OF HYPOPHOSPHITE (H2PO2) AND/OR PHOSPHITE (HPO32-) IONS. THE CLEANING COMPOSITIONS ALSO MAY CONTAIN FLUORIDE IONS. OPTIONALLY, THE COMPOSITION MAY CONTAIN OTHER COMPONENTS SUCH AS ORGANIC SOLVENTS, OXIDIZING AGENTS, SURFACTANTS, CORROSION INHIBITORS AND METAL COMPLEXING AGENTS.
MYPI200445362004-03-012004-11-02Stripping and cleaning compositions for microelectronics
MY139624A
(en)
Method and composition for selectively removing metal hardmask and other residues from semiconductor device substrates comprising low-k dielectric material and copper
Flouride-containing photoresist stripper or residue removing cleaning compositions containing conjugate oligomeric or polymeric material of alpha-hydroxycarbonyl compound/amine or ammonia reaction
Flouride-free photoresist stripper or residue removing cleaning compositions containing conjugate oligomeric or polymeric material of alpha-hydroxycarbonyl compound/amine or ammonia reaction