MY127326A - Multilayer printed-circuit board and semiconductor device - Google Patents

Multilayer printed-circuit board and semiconductor device

Info

Publication number
MY127326A
MY127326A MYPI20011869A MYPI20011869A MY127326A MY 127326 A MY127326 A MY 127326A MY PI20011869 A MYPI20011869 A MY PI20011869A MY PI20011869 A MYPI20011869 A MY PI20011869A MY 127326 A MY127326 A MY 127326A
Authority
MY
Malaysia
Prior art keywords
circuit board
circuit
multilayer printed
via hole
circuit boards
Prior art date
Application number
MYPI20011869A
Inventor
Asai Motoo
Kariya Takashi
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000245656A external-priority patent/JP4592891B2/en
Priority claimed from JP2000245649A external-priority patent/JP4592889B2/en
Priority claimed from JP2000245650A external-priority patent/JP4592890B2/en
Priority claimed from JP2000245648A external-priority patent/JP2001217356A/en
Priority claimed from JP2000356700A external-priority patent/JP4592929B2/en
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of MY127326A publication Critical patent/MY127326A/en

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A MULTILAYER PRINTED?CIRCUIT BOARD IS PROVIDED WHICH IS FORMED BY STACKING ONE ON THE OTHER A PLURALITY OF CIRCUIT BOARDS, EACH INCLUDING A HARD INSULATIVE SUBSTRATE (10) HAVING A CONDUCTOR CIRCUIT (40) FORMED ON ONE OR EITHER SIDE THEREOF, AND HAVING FORMED THEREIN VIA?HOLES FORMED THROUGH THE HARD INSULATIVE SUBSTRATE (10) TO EXTEND TO THE CONDUCTOR CIRCUIT (40) AND EACH FILLED WITH A CONDUCTIVE SUBSTANCE, WITH AN ADHESIVE APPLIED BETWEEN THE PLURALITY OF CIRCUIT BOARDS, AND HEATING AND PRESSING THE CIRCUIT BOARDS TOGETHER. ONE OF THE OUTERMOST ONES OF THE STACKED CIRCUIT BOARDS HAS FORMED ON THE SURFACE THEREOF CONDUCTIVE BUMPS (62) EACH POSITIONED RIGHT ABOVE THE VIA HOLE AND ELECTRICALLY CONNECTED TO THE VIA HOLE, AND THE OTHER OUTERMOST ONE OF THE STACKED CIRCUIT BOARDS HAS FORMED ON THE SURFACE THEREOF CONDUCTIVE PIN (64) OR BALLS (66) EACH POSITIONED RIGHT ABOVE THE VIA HOLE AND ELECTRICALLY CONNECTED TO THE VIA HOLE. THIS MULTILAYER PRINTED?CIRCUIT BOARD IS USED AS A PACKAGE CIRCUIT BOARD AND ELECTRONIC COMPONENTS (82) SUCH AS LSI CHIP ARE MOUNTED ON IT TO FORM A SEMICONDUCTOR DEVICE. THE MULTILAYER PRINTED?CIRCUIT BOARD IS USED AS A CORE SUBSTRATE, AND A BUILD?UP WIRING LAYER IS FORMED ON ONE OR EITHER SIDE OF THE CORE MULTILAYER CIRCUIT BOARD. SOLDER BUMPS ARE FORMED ON THE SURFACE OF ONE OUTERMOST CONDUCTOR CIRCUIT OF THE BUILD?UP WIRING LAYER AND CONDUCTIVE PINS (64) OR BALLS (66) ARE PROVIDED ON THE SURFACE OF THE OTHER OUTERMOST CONDUCTOR CIRCUIT OF THE BUILD?UP WIRING LAYER. THUS, A MULTILAYER PRINTED-CIRCUIT BOARD IS PROVIDED ON WHICH WIRING CAN BE MADE DENSELY AND ALSO ELECTRONIC COMPONENTS (82) CAN BE MOUNTED WITH A HIGH DENSITY. (FIGURE 7 )
MYPI20011869A 2000-08-14 2001-04-19 Multilayer printed-circuit board and semiconductor device MY127326A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000245656A JP4592891B2 (en) 1999-11-26 2000-08-14 Multilayer circuit board and semiconductor device
JP2000245649A JP4592889B2 (en) 1999-11-26 2000-08-14 Multilayer circuit board
JP2000245650A JP4592890B2 (en) 1999-11-26 2000-08-14 Multilayer circuit board
JP2000245648A JP2001217356A (en) 1999-11-26 2000-08-14 Multilayer circuit board and semiconductor device
JP2000356700A JP4592929B2 (en) 1999-11-26 2000-11-22 Multilayer circuit board

Publications (1)

Publication Number Publication Date
MY127326A true MY127326A (en) 2006-11-30

Family

ID=78401923

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20011869A MY127326A (en) 2000-08-14 2001-04-19 Multilayer printed-circuit board and semiconductor device

Country Status (1)

Country Link
MY (1) MY127326A (en)

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