MY121750A - Chip components mounting apparatus - Google Patents

Chip components mounting apparatus

Info

Publication number
MY121750A
MY121750A MYPI98002986A MYPI9802986A MY121750A MY 121750 A MY121750 A MY 121750A MY PI98002986 A MYPI98002986 A MY PI98002986A MY PI9802986 A MYPI9802986 A MY PI9802986A MY 121750 A MY121750 A MY 121750A
Authority
MY
Malaysia
Prior art keywords
chip components
template
circuit board
printed circuit
mounting apparatus
Prior art date
Application number
MYPI98002986A
Inventor
Shuichi Munakata
Yoshikazu Inamura
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of MY121750A publication Critical patent/MY121750A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

IN A CHIP COMPONENTS MOUNTING APPARATUS OF THE INVENTION, CHIP COMPONENTS RECEIVED IN A PLURALITY OF HOPPERS ARE DROPPED ONTO A TEMPLATE AND ARE ARRANGED IN ORDER, THEN THE TEMPLATE IS CONVEYED UP TO THE POSITION JUST UNDER A SUCTION UNIT, WHERE THE CHIP COMPONENTS ARE SUCKED FROM THE TEMPLATE BY MEANS OF SUCTION NOZZLES OF THE SUCTION UNIT, AND THE CHIP COMPONENTS THUS CHECKED ARE MOUNTED ONTO A PRINTED CIRCUIT BOARD AT PREDETERMINED POSITIONS. IN THIS CHIP COMPONENTS MOUNTING APPARATUS, THE CHIP COMPONENTS MOUNTING POSITIONS ON THE PRINTED CIRCUIT BOARD ARE DIVIDED TO A PLURALITY OF GROUPS, RETAINING HOLES ARE FORMED IN THE TEMPLATE SO AS TO BE DISTRIBUTED IN TWO-DIMENSIONAL DERECTIONS GROUP AND IN CORRESPONDING RELATION TO THE CHIP COMPONENTS MOUNTING POSITIONS, AND THE PRINTED CIRCUIT BOARD IS MOVED IN TWO-DIMENSIONAL DIRECTIONS BY MEANS OF A THIRD CARRIER TO MOUNT THE SUCKED CHIP COMPONENTS ONTO THE PRINTED CIRCUIT BOARD AT THE PREDETERMINED POSITIONS.(FIG. 5)
MYPI98002986A 1997-07-01 1998-06-30 Chip components mounting apparatus MY121750A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17592897A JP3512598B2 (en) 1997-07-01 1997-07-01 Chip component mounting device

Publications (1)

Publication Number Publication Date
MY121750A true MY121750A (en) 2006-02-28

Family

ID=16004710

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI98002986A MY121750A (en) 1997-07-01 1998-06-30 Chip components mounting apparatus

Country Status (5)

Country Link
JP (1) JP3512598B2 (en)
KR (1) KR100300837B1 (en)
CN (1) CN1104833C (en)
GB (1) GB2326980B (en)
MY (1) MY121750A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1330494C (en) * 2002-09-30 2007-08-08 索尼株式会社 Electronic-component alignment method and apparatus therefor
KR101000004B1 (en) 2004-12-24 2010-12-09 미래산업 주식회사 Parts Mounting Method
CN110139500B (en) * 2019-05-28 2021-11-23 铜陵金基科技有限公司 SMT chip mounter and chip mounting production process thereof
CN113950873A (en) * 2019-06-05 2022-01-18 株式会社富士 Component supply device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694800A (en) * 1979-12-28 1981-07-31 Taiyo Yuden Kk Method and device for mounting electronic part
US4528747A (en) * 1982-12-02 1985-07-16 At&T Technologies, Inc. Method and apparatus for mounting multilead components on a circuit board
US4548667A (en) * 1984-03-28 1985-10-22 Wical Robert M Planned coordinate component placement system
KR920002278B1 (en) * 1988-02-15 1992-03-20 다이요유덴 가부시끼가이샤 Mounting apparatus for chip-shaped curcuit component

Also Published As

Publication number Publication date
KR19990013480A (en) 1999-02-25
JPH1126989A (en) 1999-01-29
JP3512598B2 (en) 2004-03-29
GB9810318D0 (en) 1998-07-15
CN1208323A (en) 1999-02-17
GB2326980B (en) 2002-01-16
CN1104833C (en) 2003-04-02
KR100300837B1 (en) 2001-09-06
GB2326980A (en) 1999-01-06

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