MY120158A - Chip mounting apparatus - Google Patents

Chip mounting apparatus

Info

Publication number
MY120158A
MY120158A MYPI98002967A MYPI9802967A MY120158A MY 120158 A MY120158 A MY 120158A MY PI98002967 A MYPI98002967 A MY PI98002967A MY PI9802967 A MYPI9802967 A MY PI9802967A MY 120158 A MY120158 A MY 120158A
Authority
MY
Malaysia
Prior art keywords
chips
mounting
chip
wiring board
stage
Prior art date
Application number
MYPI98002967A
Inventor
Shuichi Munakata
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of MY120158A publication Critical patent/MY120158A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

A CHIP MOUNTING APPARATUS COMPRISES: AN XY TABLE (11) SERVING AS A STATIONARY COMPONENT OF A TWO-DIMENSIONAL LINEAR MOTOR; FIRST TO THIRD CARRYING TABLES (12, 13, 14) SERVING AS MOVABLE COMPONENTS OF THE TWO-DIMENSIONAL LINEAR MOTOR; A CHIP DISTRIBUTING MEANS FOR FEEDING CHIPS (28) CONTAINED IN A PLURALITY OF HOPPERS (15) IN A PREDETERMINED ARRANGEMENT AT A CHIP FEED STAGE (S1); A SUCTION UNIT (18) FOR ATTRACTING THE CHIPS (28) ARRANGED IN THE PREDETERMINED ARRANGEMENT BY SUCTION NOZZLES AND MOUNTING THE CHIPS (28) ON A PRINTED WIRING BOARD (21) AT A MOUNTING STAGE (S2), AND A CONVEYOR (20) FOR CONVEYING THE PRINTED WIRING BOARD (21), WHEREIN THE TEMPLATES FOR HOLDING THE CHIPS ARE MOUNTED ON THE FIRST AND THE SECOND CARRYING TABLE (12, 13), RESPECTIVELY, THE FIRST AND THE SECOND CARRYING TABLE (12, 13) MOVE BETWEEN THE CHIP FEED STAGE (S1) AND THE MOUNTING STAGE (S2) ALONG DIFFERENT CIRCULATION PATHS, RESPECTIVELY; AND THE THIRD CARRYING TABLE (14) CARRIES THE PRINTED WIRING BOARD (21) BETWEEN THE MOUNTING STAGE (S2) AND THE CONVEYOR (20).
MYPI98002967A 1997-07-01 1998-06-30 Chip mounting apparatus MY120158A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17592797A JP3400929B2 (en) 1997-07-01 1997-07-01 Chip component mounting device

Publications (1)

Publication Number Publication Date
MY120158A true MY120158A (en) 2005-09-30

Family

ID=16004690

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI98002967A MY120158A (en) 1997-07-01 1998-06-30 Chip mounting apparatus

Country Status (5)

Country Link
JP (1) JP3400929B2 (en)
KR (1) KR100270763B1 (en)
CN (1) CN1110235C (en)
GB (1) GB2326981B (en)
MY (1) MY120158A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020041481A1 (en) 2000-09-28 2002-04-11 Yoshinori Kano Linear motor and electronic component feeding apparatus
JP4282018B2 (en) * 2004-09-30 2009-06-17 東京エレクトロン株式会社 Substrate transfer device
CN109060307B (en) * 2018-09-18 2021-02-09 罗昕明 Flip LED chip detection device
CN117223406A (en) * 2021-04-29 2023-12-12 株式会社富士 Bulk feeder and component supply control system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4501064A (en) * 1981-09-08 1985-02-26 Usm Corporation Micro component assembly machine
DE4337811A1 (en) * 1993-11-05 1995-05-11 Philips Patentverwaltung Arrangement for transporting printed circuit boards
JP3636739B2 (en) * 1993-12-06 2005-04-06 ジューキ株式会社 Chip component mounting machine
JPH09214177A (en) * 1996-01-30 1997-08-15 Matsushita Electric Ind Co Ltd Supply method of chip
JP3284050B2 (en) * 1996-06-18 2002-05-20 ティーディーケイ株式会社 Chip component supply device

Also Published As

Publication number Publication date
CN1204942A (en) 1999-01-13
GB9810319D0 (en) 1998-07-15
CN1110235C (en) 2003-05-28
GB2326981A (en) 1999-01-06
JP3400929B2 (en) 2003-04-28
KR100270763B1 (en) 2001-01-15
JPH1126988A (en) 1999-01-29
GB2326981B (en) 2002-01-16
KR19990013479A (en) 1999-02-25

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