MY118144A - Epoxy resin, epoxy resin composition and hardened product thereof - Google Patents
Epoxy resin, epoxy resin composition and hardened product thereofInfo
- Publication number
- MY118144A MY118144A MYPI96005465A MYPI9605465A MY118144A MY 118144 A MY118144 A MY 118144A MY PI96005465 A MYPI96005465 A MY PI96005465A MY PI9605465 A MYPI9605465 A MY PI9605465A MY 118144 A MY118144 A MY 118144A
- Authority
- MY
- Malaysia
- Prior art keywords
- epoxy resin
- resin composition
- hardened product
- hardened products
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
AN OBJECT IS TO PROVIDE HARDENED PRODUCTS HAVING EXCELLENT WATER RESISTANCE AND MECHANICAL STRENGTH, AND AN EPOXY RESIN AND AN EPOXY RESIN COMPOSITION FOR USE IN THE PRODUCTION THEREOF. AN EPOXY RESIN OBTAINED BY THE GLYCIDYLATION OF A NOVOLAK TYPE RESIN WHICH IS PREPARED BY THE CONDENSATION OF BIPHENYLS WITH PHENOLS AND NAPHTHOLS, AND A RESIN COMPOSITION CONTAINING SAID EPOXY RESIN AND HARDENED PRODUCTS THEREOF.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35229595A JP3575776B2 (en) | 1995-12-28 | 1995-12-28 | Epoxy resin, epoxy resin composition and cured product thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
MY118144A true MY118144A (en) | 2004-09-30 |
Family
ID=18423095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI96005465A MY118144A (en) | 1995-12-28 | 1996-12-26 | Epoxy resin, epoxy resin composition and hardened product thereof |
Country Status (8)
Country | Link |
---|---|
US (1) | US5840824A (en) |
JP (1) | JP3575776B2 (en) |
KR (1) | KR100411859B1 (en) |
CN (1) | CN1080733C (en) |
CH (1) | CH690823A5 (en) |
DE (1) | DE19654351A1 (en) |
MY (1) | MY118144A (en) |
SG (1) | SG72720A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69922577T2 (en) * | 1998-05-07 | 2005-12-01 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin compositions and encapsulated semiconductor devices |
CN1962713B (en) * | 2005-11-07 | 2010-05-05 | 中国科学院化学研究所 | Fluorine-containing phenol resin derivative and its composition and preparation method |
JP2012077152A (en) * | 2010-09-30 | 2012-04-19 | Sumitomo Bakelite Co Ltd | Resin composition for sealing electronic component and electronic component device |
JP5752574B2 (en) * | 2011-11-29 | 2015-07-22 | 明和化成株式会社 | Phenol novolac resin and epoxy resin composition using the same |
JP6041663B2 (en) * | 2012-12-21 | 2016-12-14 | 日本化薬株式会社 | Phenol resin, epoxy resin, epoxy resin composition, and cured product thereof |
JP6448447B2 (en) * | 2015-04-07 | 2019-01-09 | 日本化薬株式会社 | White active energy ray-curable resin composition |
TWI709583B (en) * | 2015-12-08 | 2020-11-11 | 日商迪愛生股份有限公司 | Epoxy resin, epoxy resin manufacturing method, curable resin composition and cured product |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1169045A (en) * | 1967-07-21 | 1969-10-29 | Midland Silicones Ltd | Novel Epoxylated Phenolic Resins |
JPS61138622A (en) * | 1984-12-12 | 1986-06-26 | Agency Of Ind Science & Technol | Fiber-reinforced composite material, and cured product produced therefrom |
JP2952094B2 (en) * | 1991-10-30 | 1999-09-20 | 新日鐵化学株式会社 | Epoxy compound |
JP2595859B2 (en) * | 1992-08-20 | 1997-04-02 | 信越化学工業株式会社 | Epoxy resin composition and semiconductor device |
US5459223A (en) * | 1993-01-22 | 1995-10-17 | Hitachi Chemical Company | Method of preparing naphthol-modified phenolic resin |
JP3132610B2 (en) * | 1993-03-22 | 2001-02-05 | 日本化薬株式会社 | Naphthalene ring-containing resin, resin composition and cured product thereof |
JP3476027B2 (en) * | 1994-04-28 | 2003-12-10 | 日本化薬株式会社 | Manufacturing method of epoxy resin |
JP3122834B2 (en) * | 1994-09-20 | 2001-01-09 | 明和化成株式会社 | New phenol novolak condensate |
JP3852789B2 (en) * | 1994-11-01 | 2006-12-06 | 日本化薬株式会社 | Epoxy resin, epoxy resin composition and cured product thereof |
JPH093161A (en) * | 1995-06-20 | 1997-01-07 | Toshiba Chem Corp | Epoxy resin composition and semiconductor sealed device |
JPH09132623A (en) * | 1995-11-09 | 1997-05-20 | Nippon Kayaku Co Ltd | Novolac resin, epoxy resin, epoxy resin composition and cured product thereof |
-
1995
- 1995-12-28 JP JP35229595A patent/JP3575776B2/en not_active Expired - Fee Related
-
1996
- 1996-12-24 DE DE19654351A patent/DE19654351A1/en not_active Withdrawn
- 1996-12-26 MY MYPI96005465A patent/MY118144A/en unknown
- 1996-12-26 US US08/773,967 patent/US5840824A/en not_active Expired - Fee Related
- 1996-12-27 CH CH03195/96A patent/CH690823A5/en not_active IP Right Cessation
- 1996-12-28 SG SG1996011935A patent/SG72720A1/en unknown
- 1996-12-28 KR KR1019960081404A patent/KR100411859B1/en not_active IP Right Cessation
- 1996-12-30 CN CN96123471A patent/CN1080733C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CH690823A5 (en) | 2001-01-31 |
SG72720A1 (en) | 2000-05-23 |
US5840824A (en) | 1998-11-24 |
CN1160724A (en) | 1997-10-01 |
CN1080733C (en) | 2002-03-13 |
DE19654351A1 (en) | 1997-07-03 |
JP3575776B2 (en) | 2004-10-13 |
JPH09183829A (en) | 1997-07-15 |
KR100411859B1 (en) | 2004-04-03 |
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