MX9803339A - Proceso para la deposicion de una capa de material sobre un sustrato y sistema de electrodeposicion. - Google Patents

Proceso para la deposicion de una capa de material sobre un sustrato y sistema de electrodeposicion.

Info

Publication number
MX9803339A
MX9803339A MX9803339A MX9803339A MX9803339A MX 9803339 A MX9803339 A MX 9803339A MX 9803339 A MX9803339 A MX 9803339A MX 9803339 A MX9803339 A MX 9803339A MX 9803339 A MX9803339 A MX 9803339A
Authority
MX
Mexico
Prior art keywords
substrate
current density
electrical current
uniform
tailored
Prior art date
Application number
MX9803339A
Other languages
English (en)
Other versions
MXPA98003339A (es
Inventor
Cindy Reidsema Simpson
Matthew T Herrick
Gregory S Etherington
James Derek Legg
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of MX9803339A publication Critical patent/MX9803339A/es
Publication of MXPA98003339A publication Critical patent/MXPA98003339A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)

Abstract

Se describe un sistema (30) de electrodeposicion y proceso que hace a la densidad de corriente eléctrica a través de la superficie de un sustrato (20) de un dispositivo semiconductor más uniforme durante la electrodeposicion para permitir una deposicion más uniforme o ajustada de un material conductor. Los modificadores (364 y 37) de la densidad de la corriente eléctrica reducen la densidad de la corriente eléctrica cerca del borde del sustrato (20). Al reducir la densidad de corriente cerca del borde del sustrato (20) la electrodeposicion se hace más uniforme o puede ser ajustada de tal manera que ligeramente más material se electrodeposita cerca del centro del sustrato (20). El sistema también puede ser modificado de tal manera que el material que las porciones (364) modificadora de la densidad de corriente sobre la estructura (36) pueden ser separadas sin tener que desmontar cualquier porcion de la cabeza (35) o de otra manera separar las estructuras (36) del sistema. Esta limpieza in situ reduce la cantidad de paralizacion del equipo, incrementa la vida del equipo y reduce los conteos de partículas.
MXPA/A/1998/003339A 1997-05-14 1998-04-28 Proceso para la deposicion de una capa de material sobre un sustrato y sistema de electrodeposicion MXPA98003339A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08856459 1997-05-14
US08/856,459 US6174425B1 (en) 1997-05-14 1997-05-14 Process for depositing a layer of material over a substrate

Publications (2)

Publication Number Publication Date
MX9803339A true MX9803339A (es) 1998-12-31
MXPA98003339A MXPA98003339A (es) 1999-02-01

Family

ID=

Also Published As

Publication number Publication date
FR2763343B1 (fr) 2000-11-24
TW372330B (en) 1999-10-21
KR19980087024A (ko) 1998-12-05
CN1143906C (zh) 2004-03-31
US6500324B1 (en) 2002-12-31
SG71111A1 (en) 2000-03-21
ITRM980277A1 (it) 1999-10-29
GB0111315D0 (en) 2001-07-04
DE19820878A1 (de) 1998-11-19
GB9809856D0 (en) 1998-07-08
ITRM980277A0 (it) 1998-04-29
US7323094B2 (en) 2008-01-29
KR100329454B1 (ko) 2002-08-28
CN1204702A (zh) 1999-01-13
US20020195347A1 (en) 2002-12-26
BR9801617A (pt) 1999-06-08
IT1299444B1 (it) 2000-03-16
MY126502A (en) 2006-10-31
FR2763343A1 (fr) 1998-11-20
JPH10330991A (ja) 1998-12-15
JP3326112B2 (ja) 2002-09-17
DE19820878B4 (de) 2011-03-03
NL1009157A1 (nl) 1998-11-17
US6174425B1 (en) 2001-01-16
NL1009157C2 (nl) 2000-01-10
GB2325242A (en) 1998-11-18

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