BR9801617A - Processo para depositar uma camada de material sobre um subtrato e um sistema de galvanização - Google Patents

Processo para depositar uma camada de material sobre um subtrato e um sistema de galvanização

Info

Publication number
BR9801617A
BR9801617A BR9801617A BR9801617A BR9801617A BR 9801617 A BR9801617 A BR 9801617A BR 9801617 A BR9801617 A BR 9801617A BR 9801617 A BR9801617 A BR 9801617A BR 9801617 A BR9801617 A BR 9801617A
Authority
BR
Brazil
Prior art keywords
depositing
substrate
layer
galvanizing system
galvanizing
Prior art date
Application number
BR9801617A
Other languages
English (en)
Inventor
Cindy Reidsema Simpson
Matthew T Herrick
Gregory S Etherington
James Derek Legg
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of BR9801617A publication Critical patent/BR9801617A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
BR9801617A 1997-05-14 1998-05-12 Processo para depositar uma camada de material sobre um subtrato e um sistema de galvanização BR9801617A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/856,459 US6174425B1 (en) 1997-05-14 1997-05-14 Process for depositing a layer of material over a substrate

Publications (1)

Publication Number Publication Date
BR9801617A true BR9801617A (pt) 1999-06-08

Family

ID=25323684

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9801617A BR9801617A (pt) 1997-05-14 1998-05-12 Processo para depositar uma camada de material sobre um subtrato e um sistema de galvanização

Country Status (13)

Country Link
US (3) US6174425B1 (pt)
JP (1) JP3326112B2 (pt)
KR (1) KR100329454B1 (pt)
CN (1) CN1143906C (pt)
BR (1) BR9801617A (pt)
DE (1) DE19820878B4 (pt)
FR (1) FR2763343B1 (pt)
GB (2) GB2325242A (pt)
IT (1) IT1299444B1 (pt)
MY (1) MY126502A (pt)
NL (1) NL1009157C2 (pt)
SG (1) SG71111A1 (pt)
TW (1) TW372330B (pt)

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Also Published As

Publication number Publication date
GB0111315D0 (en) 2001-07-04
IT1299444B1 (it) 2000-03-16
FR2763343A1 (fr) 1998-11-20
CN1204702A (zh) 1999-01-13
DE19820878B4 (de) 2011-03-03
NL1009157C2 (nl) 2000-01-10
FR2763343B1 (fr) 2000-11-24
NL1009157A1 (nl) 1998-11-17
DE19820878A1 (de) 1998-11-19
ITRM980277A0 (it) 1998-04-29
GB2325242A (en) 1998-11-18
JPH10330991A (ja) 1998-12-15
MX9803339A (es) 1998-12-31
JP3326112B2 (ja) 2002-09-17
TW372330B (en) 1999-10-21
SG71111A1 (en) 2000-03-21
ITRM980277A1 (it) 1999-10-29
MY126502A (en) 2006-10-31
KR100329454B1 (ko) 2002-08-28
US20020195347A1 (en) 2002-12-26
US6174425B1 (en) 2001-01-16
GB9809856D0 (en) 1998-07-08
KR19980087024A (ko) 1998-12-05
US6500324B1 (en) 2002-12-31
US7323094B2 (en) 2008-01-29
CN1143906C (zh) 2004-03-31

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