Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/495—Lead-frames or other flat leads
  • H01L23/49541—Geometry of the lead-frame
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
  • H01L21/4814—Conductive parts
  • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
  • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Lead Frames For Integrated Circuits (AREA)
• Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=25079961

Family Applications (1)

Country Status (10)

Families Citing this family (2)

Family Cites Families (18)

• 1992
  • 1992-09-08 MX MX9205128A patent/MX9205128A/es not_active IP Right Cessation
  • 1992-09-15 KR KR1019920016706A patent/KR100248551B1/ko not_active IP Right Cessation
  • 1992-09-22 JP JP27670892A patent/JP3399988B2/ja not_active Expired - Fee Related
  • 1992-09-24 CN CN92110849.4A patent/CN1073044A/zh active Pending
  • 1992-09-28 EP EP92308799A patent/EP0535882B1/en not_active Expired - Lifetime
  • 1992-09-28 SG SG1996001750A patent/SG46266A1/en unknown
  • 1992-09-28 DE DE69232200T patent/DE69232200T2/de not_active Expired - Fee Related
  • 1992-09-30 CZ CS922987A patent/CZ282517B6/cs not_active IP Right Cessation
  • 1992-09-30 SK SK2987-92A patent/SK298792A3/sk unknown
• 1995
  • 1995-03-16 US US08/405,563 patent/US5690877A/en not_active Expired - Lifetime

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