MX9205128A - Metodo para procesar un bloque de circuito integrado semiconductor. - Google Patents
Metodo para procesar un bloque de circuito integrado semiconductor.Info
- Publication number
- MX9205128A MX9205128A MX9205128A MX9205128A MX9205128A MX 9205128 A MX9205128 A MX 9205128A MX 9205128 A MX9205128 A MX 9205128A MX 9205128 A MX9205128 A MX 9205128A MX 9205128 A MX9205128 A MX 9205128A
- Authority
- MX
- Mexico
- Prior art keywords
- processing
- integrated circuit
- semiconductor integrated
- circuit block
- block
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US76759391A | 1991-09-30 | 1991-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9205128A true MX9205128A (es) | 1993-04-01 |
Family
ID=25079961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9205128A MX9205128A (es) | 1991-09-30 | 1992-09-08 | Metodo para procesar un bloque de circuito integrado semiconductor. |
Country Status (10)
Country | Link |
---|---|
US (1) | US5690877A (es) |
EP (1) | EP0535882B1 (es) |
JP (1) | JP3399988B2 (es) |
KR (1) | KR100248551B1 (es) |
CN (1) | CN1073044A (es) |
CZ (1) | CZ282517B6 (es) |
DE (1) | DE69232200T2 (es) |
MX (1) | MX9205128A (es) |
SG (1) | SG46266A1 (es) |
SK (1) | SK298792A3 (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2741191B1 (fr) * | 1995-11-14 | 1998-01-09 | Sgs Thomson Microelectronics | Procede de fabrication d'un micromodule, notamment pour cartes a puces |
US5886397A (en) * | 1996-09-05 | 1999-03-23 | International Rectifier Corporation | Crushable bead on lead finger side surface to improve moldability |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3539675A (en) * | 1965-10-22 | 1970-11-10 | Motorola Inc | Method for encapsulating semiconductor devices |
US4109373A (en) * | 1975-03-10 | 1978-08-29 | General Electric Company | Method for manufacturing semiconductor devices |
US4451973A (en) * | 1981-04-28 | 1984-06-05 | Matsushita Electronics Corporation | Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor |
JPS5896921U (ja) * | 1981-12-24 | 1983-07-01 | トヨタ自動車株式会社 | インサート成形装置 |
EP0090503A3 (en) * | 1982-03-25 | 1985-05-22 | Texas Instruments Incorporated | Apparatus and method of packaging a semiconductor device |
JPS59135753A (ja) * | 1983-01-25 | 1984-08-04 | Toshiba Corp | 半導体装置とその製造方法 |
US4504427A (en) * | 1983-06-17 | 1985-03-12 | At&T Bell Laboratories | Solder preform stabilization for lead frames |
JPS60176259A (ja) * | 1984-02-22 | 1985-09-10 | Toshiba Corp | 樹脂封止形半導体装置の製造方法 |
JPS6147658A (ja) * | 1984-08-14 | 1986-03-08 | Nec Kansai Ltd | 半導体装置の製造方法 |
US4615857A (en) * | 1984-11-30 | 1986-10-07 | Motorola, Inc. | Encapsulation means and method for reducing flash |
US4862586A (en) * | 1985-02-28 | 1989-09-05 | Michio Osada | Lead frame for enclosing semiconductor chips with resin |
JPS62128163A (ja) * | 1985-11-29 | 1987-06-10 | Nec Corp | リ−ドフレ−ム |
US4778146A (en) * | 1987-03-20 | 1988-10-18 | Asm Fico | Leadframe for flash-free insert molding and method therefor |
US4874722A (en) * | 1987-04-16 | 1989-10-17 | Texas Instruments Incorporated | Process of packaging a semiconductor device with reduced stress forces |
US4915607A (en) * | 1987-09-30 | 1990-04-10 | Texas Instruments Incorporated | Lead frame assembly for an integrated circuit molding system |
JPH0828455B2 (ja) * | 1988-02-24 | 1996-03-21 | 富士通株式会社 | リードフレーム及びそれを用いた電子部品の製造方法 |
US4946518A (en) * | 1989-03-14 | 1990-08-07 | Motorola, Inc. | Method for improving the adhesion of a plastic encapsulant to copper containing leadframes |
US5070039A (en) * | 1989-04-13 | 1991-12-03 | Texas Instruments Incorporated | Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal |
-
1992
- 1992-09-08 MX MX9205128A patent/MX9205128A/es not_active IP Right Cessation
- 1992-09-15 KR KR1019920016706A patent/KR100248551B1/ko not_active IP Right Cessation
- 1992-09-22 JP JP27670892A patent/JP3399988B2/ja not_active Expired - Fee Related
- 1992-09-24 CN CN92110849.4A patent/CN1073044A/zh active Pending
- 1992-09-28 EP EP92308799A patent/EP0535882B1/en not_active Expired - Lifetime
- 1992-09-28 SG SG1996001750A patent/SG46266A1/en unknown
- 1992-09-28 DE DE69232200T patent/DE69232200T2/de not_active Expired - Fee Related
- 1992-09-30 CZ CS922987A patent/CZ282517B6/cs not_active IP Right Cessation
- 1992-09-30 SK SK2987-92A patent/SK298792A3/sk unknown
-
1995
- 1995-03-16 US US08/405,563 patent/US5690877A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR100248551B1 (ko) | 2000-03-15 |
SG46266A1 (en) | 1998-02-20 |
SK298792A3 (en) | 1994-11-09 |
CZ298792A3 (en) | 1993-04-14 |
DE69232200T2 (de) | 2002-06-06 |
DE69232200D1 (de) | 2001-12-20 |
CN1073044A (zh) | 1993-06-09 |
EP0535882A1 (en) | 1993-04-07 |
CZ282517B6 (cs) | 1997-07-16 |
JPH05206182A (ja) | 1993-08-13 |
JP3399988B2 (ja) | 2003-04-28 |
US5690877A (en) | 1997-11-25 |
EP0535882B1 (en) | 2001-11-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration | ||
MM | Annulment or lapse due to non-payment of fees |