MX350165B - Componentes eléctricos y métodos y sistemas de fabricación de componentes eléctricos. - Google Patents

Componentes eléctricos y métodos y sistemas de fabricación de componentes eléctricos.

Info

Publication number
MX350165B
MX350165B MX2015004055A MX2015004055A MX350165B MX 350165 B MX350165 B MX 350165B MX 2015004055 A MX2015004055 A MX 2015004055A MX 2015004055 A MX2015004055 A MX 2015004055A MX 350165 B MX350165 B MX 350165B
Authority
MX
Mexico
Prior art keywords
coating layer
electrical components
irradiating
layer
electrical conductor
Prior art date
Application number
MX2015004055A
Other languages
English (en)
Other versions
MX2015004055A (es
Inventor
Schmidt Helge
Leidner Michael
Sachs Soenke
Kay Myers Marjorie
Marie M Freckmann Dominique
Henshel Eva
Original Assignee
Tyco Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Corp filed Critical Tyco Electronics Corp
Publication of MX2015004055A publication Critical patent/MX2015004055A/es
Publication of MX350165B publication Critical patent/MX350165B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

Un método para fabricar un componente eléctrico (100) incluye proporcionar un sustrato aislante eléctrico (104) que tiene una superficie exterior (108) aplicar una capa de recubrimiento en la superficie exterior e irradiar la capa de revestimiento (106) con un haz de electrones (110) para formar un conductor eléctrico (102) sobre el sustrato. La irradiación puede incluir calentar la capa de revestimiento para fundir la capa de revestimiento para formar el conductor eléctrico. La capa de revestimiento puede tener una baja concentración de aglutinante y un una elevada concentración de metal. La irradiación puede incluir vaporizar sustancialmente todo el aglutinante dejando una capa metálica sustancialmente pura para formar el conductor eléctrico. La capa de recubrimiento puede ser irradiada hasta que el material no metálico de la capa de revestimiento se haya eliminado por completo.
MX2015004055A 2012-10-05 2013-09-23 Componentes eléctricos y métodos y sistemas de fabricación de componentes eléctricos. MX350165B (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261710365P 2012-10-05 2012-10-05
US13/836,861 US20140097002A1 (en) 2012-10-05 2013-03-15 Electrical components and methods and systems of manufacturing electrical components
PCT/US2013/061107 WO2014055271A1 (en) 2012-10-05 2013-09-23 Electrical components and methods and systems of manufacturing electrical components

Publications (2)

Publication Number Publication Date
MX2015004055A MX2015004055A (es) 2016-02-22
MX350165B true MX350165B (es) 2017-08-29

Family

ID=50431849

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015004055A MX350165B (es) 2012-10-05 2013-09-23 Componentes eléctricos y métodos y sistemas de fabricación de componentes eléctricos.

Country Status (8)

Country Link
US (2) US20140097002A1 (es)
EP (1) EP2904883A1 (es)
JP (1) JP2015530760A (es)
KR (1) KR101728619B1 (es)
CN (1) CN104704930B (es)
BR (1) BR112015007557A2 (es)
MX (1) MX350165B (es)
WO (1) WO2014055271A1 (es)

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DE102015210460B4 (de) * 2015-06-08 2021-10-07 Te Connectivity Germany Gmbh Verfahren zur Veränderung mechanischer und/oder elektrischer Eigenschaften zumindest eines Bereichs eines elektrischen Kontaktelements
US20170100916A1 (en) 2015-10-12 2017-04-13 Tyco Electronics Corporation Electronic Component and Process of Producing Electronic Component
US20170105287A1 (en) 2015-10-12 2017-04-13 Tyco Electronics Corporation Process of Producing Electronic Component and an Electronic Component
TWI608639B (zh) * 2016-12-06 2017-12-11 財團法人工業技術研究院 可撓熱電結構與其形成方法
JP6699827B2 (ja) * 2016-12-27 2020-05-27 Ｎｅｘｔ Ｉｎｎｏｖａｔｉｏｎ合同会社 ダイヤモンド系通電構造の製造方法
US20190059158A1 (en) * 2017-08-17 2019-02-21 Avery Dennison Retail Information Services, Llc Use of rf driven coherence between conductive particles for rfid antennas
TWI662872B (zh) * 2018-01-26 2019-06-11 謝孟修 陶瓷電路板及其製法
CN110233170B (zh) 2019-06-21 2021-10-12 京东方科技集团股份有限公司 显示基板及其制作方法、显示装置
EP3761452A1 (de) 2019-07-03 2021-01-06 Gebauer & Griller Kabelwerke Gesellschaft m.b.H. Elektrische verbindung zwischen einem elektrischen leiter und einem kontaktelement
US11554537B2 (en) * 2021-02-09 2023-01-17 Xerox Corporation Polymer filaments comprising a metal precursor for additive manufacturing and methods associated therewith
US20230268682A1 (en) * 2022-02-23 2023-08-24 TE Connectivity Services Gmbh Metal polymer composite films as contact finish for low normal load sockets

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Also Published As

Publication number Publication date
US20140097002A1 (en) 2014-04-10
EP2904883A1 (en) 2015-08-12
US10154595B2 (en) 2018-12-11
JP2015530760A (ja) 2015-10-15
KR20150052279A (ko) 2015-05-13
CN104704930B (zh) 2019-01-15
WO2014055271A1 (en) 2014-04-10
CN104704930A (zh) 2015-06-10
KR101728619B1 (ko) 2017-04-19
US20150319865A1 (en) 2015-11-05
MX2015004055A (es) 2016-02-22
BR112015007557A2 (pt) 2017-07-04

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Legal Events

Date Code Title Description
HC Change of company name or juridical status

Owner name: MOERAE MATRIX, INC.

Owner name: SIEMENS AKTIENGESELLSCHAFT

FG Grant or registration