MX350165B - Componentes eléctricos y métodos y sistemas de fabricación de componentes eléctricos. - Google Patents
Componentes eléctricos y métodos y sistemas de fabricación de componentes eléctricos.Info
- Publication number
- MX350165B MX350165B MX2015004055A MX2015004055A MX350165B MX 350165 B MX350165 B MX 350165B MX 2015004055 A MX2015004055 A MX 2015004055A MX 2015004055 A MX2015004055 A MX 2015004055A MX 350165 B MX350165 B MX 350165B
- Authority
- MX
- Mexico
- Prior art keywords
- coating layer
- electrical components
- irradiating
- layer
- electrical conductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Un método para fabricar un componente eléctrico (100) incluye proporcionar un sustrato aislante eléctrico (104) que tiene una superficie exterior (108) aplicar una capa de recubrimiento en la superficie exterior e irradiar la capa de revestimiento (106) con un haz de electrones (110) para formar un conductor eléctrico (102) sobre el sustrato. La irradiación puede incluir calentar la capa de revestimiento para fundir la capa de revestimiento para formar el conductor eléctrico. La capa de revestimiento puede tener una baja concentración de aglutinante y un una elevada concentración de metal. La irradiación puede incluir vaporizar sustancialmente todo el aglutinante dejando una capa metálica sustancialmente pura para formar el conductor eléctrico. La capa de recubrimiento puede ser irradiada hasta que el material no metálico de la capa de revestimiento se haya eliminado por completo.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261710365P | 2012-10-05 | 2012-10-05 | |
US13/836,861 US20140097002A1 (en) | 2012-10-05 | 2013-03-15 | Electrical components and methods and systems of manufacturing electrical components |
PCT/US2013/061107 WO2014055271A1 (en) | 2012-10-05 | 2013-09-23 | Electrical components and methods and systems of manufacturing electrical components |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2015004055A MX2015004055A (es) | 2016-02-22 |
MX350165B true MX350165B (es) | 2017-08-29 |
Family
ID=50431849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2015004055A MX350165B (es) | 2012-10-05 | 2013-09-23 | Componentes eléctricos y métodos y sistemas de fabricación de componentes eléctricos. |
Country Status (8)
Country | Link |
---|---|
US (2) | US20140097002A1 (es) |
EP (1) | EP2904883A1 (es) |
JP (1) | JP2015530760A (es) |
KR (1) | KR101728619B1 (es) |
CN (1) | CN104704930B (es) |
BR (1) | BR112015007557A2 (es) |
MX (1) | MX350165B (es) |
WO (1) | WO2014055271A1 (es) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013113485A1 (de) * | 2013-12-04 | 2015-06-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Ausbilden einer elektrisch leitfähigen Struktur auf einem Kunststoffsubstrat |
DE102015210460B4 (de) * | 2015-06-08 | 2021-10-07 | Te Connectivity Germany Gmbh | Verfahren zur Veränderung mechanischer und/oder elektrischer Eigenschaften zumindest eines Bereichs eines elektrischen Kontaktelements |
US20170100916A1 (en) | 2015-10-12 | 2017-04-13 | Tyco Electronics Corporation | Electronic Component and Process of Producing Electronic Component |
US20170105287A1 (en) | 2015-10-12 | 2017-04-13 | Tyco Electronics Corporation | Process of Producing Electronic Component and an Electronic Component |
TWI608639B (zh) * | 2016-12-06 | 2017-12-11 | 財團法人工業技術研究院 | 可撓熱電結構與其形成方法 |
JP6699827B2 (ja) * | 2016-12-27 | 2020-05-27 | Next Innovation合同会社 | ダイヤモンド系通電構造の製造方法 |
US20190059158A1 (en) * | 2017-08-17 | 2019-02-21 | Avery Dennison Retail Information Services, Llc | Use of rf driven coherence between conductive particles for rfid antennas |
TWI662872B (zh) * | 2018-01-26 | 2019-06-11 | 謝孟修 | 陶瓷電路板及其製法 |
CN110233170B (zh) | 2019-06-21 | 2021-10-12 | 京东方科技集团股份有限公司 | 显示基板及其制作方法、显示装置 |
EP3761452A1 (de) | 2019-07-03 | 2021-01-06 | Gebauer & Griller Kabelwerke Gesellschaft m.b.H. | Elektrische verbindung zwischen einem elektrischen leiter und einem kontaktelement |
US11554537B2 (en) * | 2021-02-09 | 2023-01-17 | Xerox Corporation | Polymer filaments comprising a metal precursor for additive manufacturing and methods associated therewith |
US20230268682A1 (en) * | 2022-02-23 | 2023-08-24 | TE Connectivity Services Gmbh | Metal polymer composite films as contact finish for low normal load sockets |
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US3081485A (en) * | 1958-11-20 | 1963-03-19 | Steigerwald Karl Heinz | Process and apparatus for treating synthetic plastic materials |
US3294951A (en) * | 1963-04-30 | 1966-12-27 | United Aircraft Corp | Micro-soldering |
US3968056A (en) * | 1974-09-27 | 1976-07-06 | General Electric Company | Radiation curable inks |
JPS59204036A (ja) * | 1983-05-06 | 1984-11-19 | Dainippon Ink & Chem Inc | レジストパタ−ンの形成法 |
JPS60167491A (ja) * | 1984-02-10 | 1985-08-30 | 株式会社東芝 | 導体路形成方法 |
US4942110A (en) * | 1988-08-29 | 1990-07-17 | Xerox Corporation | High resolution conductor patterning |
JPH04247681A (ja) * | 1991-02-04 | 1992-09-03 | Fujitsu Ltd | 導体パターンの形成方法 |
US5141602A (en) * | 1991-06-18 | 1992-08-25 | International Business Machines Corporation | High-productivity method and apparatus for making customized interconnections |
US5599468A (en) | 1994-10-03 | 1997-02-04 | Frederick M. Mako | Pulsed electron beam joining of materials |
US5855755A (en) * | 1995-06-19 | 1999-01-05 | Lynntech, Inc. | Method of manufacturing passive elements using conductive polypyrrole formulations |
JPH09110534A (ja) * | 1995-10-13 | 1997-04-28 | Dainippon Printing Co Ltd | 焼結体膜の形成方法 |
US5825123A (en) * | 1996-03-28 | 1998-10-20 | Retsky; Michael W. | Method and apparatus for deflecting a charged particle stream |
US5780970A (en) * | 1996-10-28 | 1998-07-14 | University Of Maryland | Multi-stage depressed collector for small orbit gyrotrons |
US5897794A (en) | 1997-01-30 | 1999-04-27 | The United States Of America As Represented By The Secretary Of The Navy | Method and apparatus for ablative bonding using a pulsed electron |
JP3422233B2 (ja) | 1997-09-26 | 2003-06-30 | 株式会社村田製作所 | バイアホール用導電性ペースト、およびそれを用いた積層セラミック基板の製造方法 |
US6235353B1 (en) | 1998-02-24 | 2001-05-22 | Alliedsignal Inc. | Low dielectric constant films with high glass transition temperatures made by electron beam curing |
JP3232051B2 (ja) * | 1998-09-28 | 2001-11-26 | 京セラ株式会社 | 電子装置の製造方法 |
US6187418B1 (en) | 1999-07-19 | 2001-02-13 | International Business Machines Corporation | Multilayer ceramic substrate with anchored pad |
CN1211807C (zh) * | 2000-02-21 | 2005-07-20 | 东洋油墨制造株式会社 | 活化高能射线束硬化型导电糊、导体电路基片的制造方法及装置以及非接触式id及其制造方法 |
US20040209190A1 (en) * | 2000-12-22 | 2004-10-21 | Yoshiaki Mori | Pattern forming method and apparatus used for semiconductor device, electric circuit, display module, and light emitting device |
EP1223615A1 (en) * | 2001-01-10 | 2002-07-17 | Eidgenössische Technische Hochschule Zürich | A method for producing a structure using nanoparticles |
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CN1659027A (zh) * | 2002-06-05 | 2005-08-24 | 东洋油墨制造株式会社 | 收缩薄膜及其制造方法,以及印刷油墨及使用该油墨的印刷物及印刷物的制造方法 |
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JP4536601B2 (ja) | 2004-06-14 | 2010-09-01 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
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-
2013
- 2013-03-15 US US13/836,861 patent/US20140097002A1/en not_active Abandoned
- 2013-09-23 BR BR112015007557A patent/BR112015007557A2/pt not_active Application Discontinuation
- 2013-09-23 KR KR1020157008710A patent/KR101728619B1/ko active IP Right Grant
- 2013-09-23 MX MX2015004055A patent/MX350165B/es active IP Right Grant
- 2013-09-23 CN CN201380051737.XA patent/CN104704930B/zh not_active Expired - Fee Related
- 2013-09-23 EP EP13771341.8A patent/EP2904883A1/en not_active Withdrawn
- 2013-09-23 WO PCT/US2013/061107 patent/WO2014055271A1/en active Application Filing
- 2013-09-23 JP JP2015535691A patent/JP2015530760A/ja active Pending
-
2015
- 2015-05-13 US US14/711,453 patent/US10154595B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20140097002A1 (en) | 2014-04-10 |
EP2904883A1 (en) | 2015-08-12 |
US10154595B2 (en) | 2018-12-11 |
JP2015530760A (ja) | 2015-10-15 |
KR20150052279A (ko) | 2015-05-13 |
CN104704930B (zh) | 2019-01-15 |
WO2014055271A1 (en) | 2014-04-10 |
CN104704930A (zh) | 2015-06-10 |
KR101728619B1 (ko) | 2017-04-19 |
US20150319865A1 (en) | 2015-11-05 |
MX2015004055A (es) | 2016-02-22 |
BR112015007557A2 (pt) | 2017-07-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
HC | Change of company name or juridical status |
Owner name: MOERAE MATRIX, INC. Owner name: SIEMENS AKTIENGESELLSCHAFT |
|
FG | Grant or registration |