MX2021012618A - Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices. - Google Patents

Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices.

Info

Publication number
MX2021012618A
MX2021012618A MX2021012618A MX2021012618A MX2021012618A MX 2021012618 A MX2021012618 A MX 2021012618A MX 2021012618 A MX2021012618 A MX 2021012618A MX 2021012618 A MX2021012618 A MX 2021012618A MX 2021012618 A MX2021012618 A MX 2021012618A
Authority
MX
Mexico
Prior art keywords
quantum computing
computing devices
flip chip
frequency tuning
fabrication methods
Prior art date
Application number
MX2021012618A
Other languages
Spanish (es)
Inventor
Dongbing Shao
Markus Brink
Firat Solgun
Jared Barney Hertzberg
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/389,033 external-priority patent/US11195982B2/en
Priority claimed from US16/389,001 external-priority patent/US10903412B2/en
Application filed by Ibm filed Critical Ibm
Publication of MX2021012618A publication Critical patent/MX2021012618A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
    • G06N10/40—Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/80—Constructional details
    • H10N60/805—Constructional details for Josephson-effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66977—Quantum effect devices, e.g. using quantum reflection, diffraction or interference effects, i.e. Bragg- or Aharonov-Bohm effects

Abstract

A quantum computing device includes a first chip having a first substrate and one or more qubits disposed on the first substrate. Each of the one or more qubits has an associated resonance frequency. The quantum computing device further includes a second chip having a second substrate and at least one conductive surface disposed on the second substrate opposite the one or more qubits. The at least one conductive surface has at least one dimension configured to adjust the resonance frequency associated with at least one of the one or more qubits to a determined frequency adjustment value.
MX2021012618A 2019-04-19 2020-04-15 Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices. MX2021012618A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/389,033 US11195982B2 (en) 2019-04-19 2019-04-19 Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices
US16/389,001 US10903412B2 (en) 2019-04-19 2019-04-19 Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices
PCT/EP2020/060612 WO2020212437A1 (en) 2019-04-19 2020-04-15 Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices

Publications (1)

Publication Number Publication Date
MX2021012618A true MX2021012618A (en) 2021-11-12

Family

ID=70289808

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2021012618A MX2021012618A (en) 2019-04-19 2020-04-15 Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices.

Country Status (11)

Country Link
EP (1) EP3956825A1 (en)
JP (1) JP2022528739A (en)
KR (1) KR20210143798A (en)
CN (1) CN113711245A (en)
AU (1) AU2020259830B2 (en)
BR (1) BR112021020936A2 (en)
CA (1) CA3137214A1 (en)
IL (1) IL286613B1 (en)
MX (1) MX2021012618A (en)
SG (1) SG11202109829PA (en)
WO (1) WO2020212437A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9768371B2 (en) 2012-03-08 2017-09-19 D-Wave Systems Inc. Systems and methods for fabrication of superconducting integrated circuits
CN110462857B (en) 2017-02-01 2024-02-27 D-波***公司 System and method for manufacturing superconducting integrated circuits
US20200152851A1 (en) 2018-11-13 2020-05-14 D-Wave Systems Inc. Systems and methods for fabricating superconducting integrated circuits
WO2022178130A1 (en) * 2021-02-19 2022-08-25 D-Wave Systems Inc. Systems and methods for fabrication of superconducting integrated circuits with improved coherence
CN115598490B (en) * 2021-06-28 2024-04-05 本源量子计算科技（合肥）股份有限公司 Quantum chip testing method and device, quantum measurement and control system and quantum computer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3164889B1 (en) * 2014-07-02 2023-06-07 University of Copenhagen A semiconductor josephson junction comprising a semiconductor nanowire and superconductor layers thereon
US10068181B1 (en) * 2015-04-27 2018-09-04 Rigetti & Co, Inc. Microwave integrated quantum circuits with cap wafer and methods for making the same
US10170681B1 (en) * 2017-11-28 2019-01-01 International Business Machines Corporation Laser annealing of qubits with structured illumination
US10686007B2 (en) * 2018-06-20 2020-06-16 Intel Corporation Quantum circuit assemblies with at least partially buried transmission lines and capacitors

Also Published As

Publication number Publication date
CA3137214A1 (en) 2020-10-22
SG11202109829PA (en) 2021-10-28
JP2022528739A (en) 2022-06-15
CN113711245A (en) 2021-11-26
AU2020259830A1 (en) 2021-09-30
EP3956825A1 (en) 2022-02-23
WO2020212437A1 (en) 2020-10-22
BR112021020936A2 (en) 2022-01-25
IL286613A (en) 2021-10-31
AU2020259830B2 (en) 2023-08-10
IL286613B1 (en) 2024-02-01
KR20210143798A (en) 2021-11-29

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