BR112021020936A2 - Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices - Google Patents

Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices

Info

Publication number
BR112021020936A2
BR112021020936A2 BR112021020936A BR112021020936A BR112021020936A2 BR 112021020936 A2 BR112021020936 A2 BR 112021020936A2 BR 112021020936 A BR112021020936 A BR 112021020936A BR 112021020936 A BR112021020936 A BR 112021020936A BR 112021020936 A2 BR112021020936 A2 BR 112021020936A2
Authority
BR
Brazil
Prior art keywords
quantum computing
computing devices
flip chip
fabrication methods
frequency tuning
Prior art date
Application number
BR112021020936A
Other languages
Portuguese (pt)
Inventor
Dongbing Shao
Firat Solgun
Barney Hertzberg Jared
Markus Brink
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/389,033 external-priority patent/US11195982B2/en
Priority claimed from US16/389,001 external-priority patent/US10903412B2/en
Application filed by Ibm filed Critical Ibm
Publication of BR112021020936A2 publication Critical patent/BR112021020936A2/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N10/00Quantum computing, i.e. information processing based on quantum-mechanical phenomena
    • G06N10/40Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N10/00Quantum computing, i.e. information processing based on quantum-mechanical phenomena
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66977Quantum effect devices, e.g. using quantum reflection, diffraction or interference effects, i.e. Bragg- or Aharonov-Bohm effects
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00Superconducting devices
    • H10N60/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00Superconducting devices
    • H10N60/80Constructional details
    • H10N60/805Constructional details for Josephson-effect devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N69/00Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic

Abstract

estruturas de sintonia de frequência qubit e métodos de fabricação para dispositivos de computação quântica flip chip. um dispositivo de computação quântica inclui um primeiro chip com um primeiro substrato e um ou mais qubits descartados no primeiro substrato. cada um ou mais qubits tem uma frequência de ressonância associada. o dispositivo de computação quântica inclui ainda um segundo chip com um segundo substrato e pelo menos uma superfície condutora descartada no segundo substrato oposto ao um ou mais qubits. a pelo menos uma superfície condutora tem pelo menos uma dimensão configurada para ajustar a frequência de ressonância associada a pelo menos um ou mais qubits a um determinado valor de ajuste de frequência.qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices. a quantum computing device includes a first chip with a first substrate and one or more qubits discarded on the first substrate. each one or more qubits has an associated resonant frequency. the quantum computing device further includes a second chip with a second substrate and at least one discarded conductive surface on the second substrate opposite the one or more qubits. the at least one conductive surface has at least one dimension configured to adjust the resonant frequency associated with the at least one or more qubits to a certain frequency adjustment value.

BR112021020936A 2019-04-19 2020-04-15 Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices BR112021020936A2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/389,033 US11195982B2 (en) 2019-04-19 2019-04-19 Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices
US16/389,001 US10903412B2 (en) 2019-04-19 2019-04-19 Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices
PCT/EP2020/060612 WO2020212437A1 (en) 2019-04-19 2020-04-15 Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices

Publications (1)

Publication Number Publication Date
BR112021020936A2 true BR112021020936A2 (en) 2022-01-25

Family

ID=70289808

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112021020936A BR112021020936A2 (en) 2019-04-19 2020-04-15 Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices

Country Status (11)

Country Link
EP (1) EP3956825A1 (en)
JP (1) JP2022528739A (en)
KR (1) KR20210143798A (en)
CN (1) CN113711245A (en)
AU (1) AU2020259830B2 (en)
BR (1) BR112021020936A2 (en)
CA (1) CA3137214A1 (en)
IL (1) IL286613B1 (en)
MX (1) MX2021012618A (en)
SG (1) SG11202109829PA (en)
WO (1) WO2020212437A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013180780A2 (en) 2012-03-08 2013-12-05 D-Wave Systems Inc. Systems and methods for fabrication of superconducting integrated circuits
EP3577700B1 (en) 2017-02-01 2022-03-30 D-Wave Systems Inc. Systems and methods for fabrication of superconducting integrated circuits
US20200152851A1 (en) 2018-11-13 2020-05-14 D-Wave Systems Inc. Systems and methods for fabricating superconducting integrated circuits
WO2022178130A1 (en) * 2021-02-19 2022-08-25 D-Wave Systems Inc. Systems and methods for fabrication of superconducting integrated circuits with improved coherence
CN115598490B (en) * 2021-06-28 2024-04-05 本源量子计算科技(合肥)股份有限公司 Quantum chip testing method and device, quantum measurement and control system and quantum computer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106575667B (en) * 2014-07-02 2020-07-31 哥本哈根大学 Semiconductor josephson junctions and related transmon qubits
US9971970B1 (en) * 2015-04-27 2018-05-15 Rigetti & Co, Inc. Microwave integrated quantum circuits with VIAS and methods for making the same
US10170681B1 (en) * 2017-11-28 2019-01-01 International Business Machines Corporation Laser annealing of qubits with structured illumination
US10686007B2 (en) * 2018-06-20 2020-06-16 Intel Corporation Quantum circuit assemblies with at least partially buried transmission lines and capacitors

Also Published As

Publication number Publication date
WO2020212437A1 (en) 2020-10-22
MX2021012618A (en) 2021-11-12
KR20210143798A (en) 2021-11-29
JP2022528739A (en) 2022-06-15
SG11202109829PA (en) 2021-10-28
CA3137214A1 (en) 2020-10-22
AU2020259830B2 (en) 2023-08-10
IL286613A (en) 2021-10-31
IL286613B1 (en) 2024-02-01
AU2020259830A1 (en) 2021-09-30
EP3956825A1 (en) 2022-02-23
CN113711245A (en) 2021-11-26

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